公开(公告)号：US20200245472A1

公开(公告)日：2020-07-30

申请号：US16637545

申请日：2017-09-22

申请人： Intel Corporation

发明人： Darko GRUJICIC ,  Rengarajan SHANMUGAM ,  Sandeep GAAN ,  Adrian BAYRAKTAROGLU ,  Roy DITTLER ,  Ke LIU ,  Suddhasattwa NAD ,  Marcel A. WALL ,  Rahul N. MANEPALLI ,  Ravindra V. TANIKELLA

IPC分类号： H05K3/38 ,  H05K3/42 ,  H05K3/46 ,  H01L21/48 ,  C23C18/16 ,  C23C18/18 ,  C23C18/38

摘要： Embodiments of the present disclosure describe techniques for providing an apparatus with a substrate provided with plasma treatment. In some instances, the apparatus may include a substrate with a surface that comprises a metal layer to provide signal routing in the apparatus. The metal layer may be provided in response to a plasma treatment of the surface with a functional group containing a gas (e.g., nitrogen-based gas), to provide absorption of a transition metal catalyst into the surface, and subsequent electroless plating of the surface with a metal. The transition metal catalyst is to enhance electroless plating of the surface with the metal. Other embodiments may be described and/or claimed.