公开(公告)号：US20210090946A1

公开(公告)日：2021-03-25

申请号：US16578698

申请日：2019-09-23

Applicant: Intel Corporation

Inventor： Darko GRUJICIC ,  Matthew ANDERSON ,  Adrian BAYRAKTAROGLU ,  Roy DITTLER ,  Benjamin DUONG ,  Tarek A. IBRAHIM ,  Rahul N. MANEPALLI ,  Suddhasattwa NAD ,  Rengarajan SHANMUGAM ,  Marcel WALL

IPC: H01L21/768 ,  H01L23/522 ,  H01L23/532

Abstract: Embodiments herein relate to systems, apparatuses, and/or processes directed to a package or a manufacturing process flow for creating a package that uses multiple seeding techniques to fill vias in the package. Embodiments include a first layer of copper seeding coupled with a portion of the boundary surface and a second layer of copper seeding coupled with the boundary surface or the first layer of copper seeding, where the first layer of copper seeding and the second layer of copper seeding have a combined thickness along the boundary surface that is greater than a threshold value.

公开(公告)号：US20200245472A1

公开(公告)日：2020-07-30

申请号：US16637545

申请日：2017-09-22

Applicant: Intel Corporation

Inventor： Darko GRUJICIC ,  Rengarajan SHANMUGAM ,  Sandeep GAAN ,  Adrian BAYRAKTAROGLU ,  Roy DITTLER ,  Ke LIU ,  Suddhasattwa NAD ,  Marcel A. WALL ,  Rahul N. MANEPALLI ,  Ravindra V. TANIKELLA

IPC: H05K3/38 ,  H05K3/42 ,  H05K3/46 ,  H01L21/48 ,  C23C18/16 ,  C23C18/18 ,  C23C18/38

Abstract: Embodiments of the present disclosure describe techniques for providing an apparatus with a substrate provided with plasma treatment. In some instances, the apparatus may include a substrate with a surface that comprises a metal layer to provide signal routing in the apparatus. The metal layer may be provided in response to a plasma treatment of the surface with a functional group containing a gas (e.g., nitrogen-based gas), to provide absorption of a transition metal catalyst into the surface, and subsequent electroless plating of the surface with a metal. The transition metal catalyst is to enhance electroless plating of the surface with the metal. Other embodiments may be described and/or claimed.

公开(公告)号：US20230304795A1

公开(公告)日：2023-09-28

申请号：US17702839

申请日：2022-03-24

Applicant: Intel Corporation

Inventor： Adrian BAYRAKTAROGLU ,  David LAMPNER ,  Darko GRUJICIC

IPC: G01C19/56 ,  C25D21/10 ,  C25D17/26

CPC classification number: G01C19/56 ,  C25D21/10 ,  C25D17/26

Abstract: The present disclosure is directed to a monitoring system for a plating process using a monitoring device including a metrology component for collecting agitation intensity data on at least one agitation component within a plating equipment and transferring the collected agitation intensity data to a process control station.