公开(公告)号：US20190205042A1

公开(公告)日：2019-07-04

申请号：US15856780

申请日：2017-12-28

Applicant: Intel Corporation

Inventor： Phani Kumar Kandula ,  Bharat S. Pillilli ,  Suresh Chemudupati ,  Yi-Feng Liu

IPC: G06F3/06 ,  G06F9/4401

CPC classification number: G06F3/0619 ,  G06F3/0629 ,  G06F3/0647 ,  G06F3/0653 ,  G06F3/0685 ,  G06F9/4403

Abstract: An apparatus is provided which includes: a first storage to store one or more parameters, a second storage to store data, and a third storage. The apparatus may further include a first circuitry to detect a triggering event. The apparatus may further include a second circuitry to, in response to the triggering event, cause transfer of the data from the second storage to the third storage, while one or more components of the apparatus is to operate in accordance with the one or more parameters.

公开(公告)号：US12093100B2

公开(公告)日：2024-09-17

申请号：US17033753

申请日：2020-09-26

Applicant: Intel Corporation

Inventor： Vivek Garg ,  Ankush Varma ,  Krishnakanth Sistla ,  Nikhil Gupta ,  Nikethan Shivanand Baligar ,  Stephen Wang ,  Nilanjan Palit ,  Timothy Yee-Kwong Kam ,  Adwait Purandare ,  Ujjwal Gupta ,  Stanley Chen ,  Dorit Shapira ,  Shruthi Venugopal ,  Suresh Chemudupati ,  Rupal Parikh ,  Eric Dehaemer ,  Pavithra Sampath ,  Phani Kumar Kandula ,  Yogesh Bansal ,  Dean Mulla ,  Michael Tulanowski ,  Stephen Paul Haake ,  Andrew Herdrich ,  Ripan Das ,  Nazar Syed Haider ,  Aman Sewani

IPC: G06F1/28 ,  G06F1/30 ,  G06F13/20

CPC classification number: G06F1/28 ,  G06F1/30 ,  G06F13/20 ,  G06F2213/40

Abstract: Hierarchical Power Management (HPM) architecture considers the limits of scaling on a power management controller, the autonomy at each die, and provides a unified view of the package to a platform. At a simplest level, HPM architecture has a supervisor and one or more supervisee power management units (PMUs) that communicate via at least two different communication fabrics. Each PMU can behave as a supervisor for a number of supervisee PMUs in a particular domain. HPM addresses these needs for products that comprise a collection of dice with varying levels of power and thermal management capabilities and needs. HPM serves as a unified mechanism than can span collection of dice of varying capability and function, which together form a traditional system-on-chip (SoC). HPM provides a basis for managing power and thermals across a diverse set of dice.

公开(公告)号：US12282377B2

公开(公告)日：2025-04-22

申请号：US17358224

申请日：2021-06-25

Applicant: Intel Corporation

Inventor： Pritesh P. Shah ,  Suresh Chemudupati ,  Alexander Gendler ,  David Hunt ,  Christopher M. Macnamara ,  Ofer Nathan ,  Adwait Purandare ,  Ankush Varma

IPC: G06F1/3287 ,  G06F1/3228 ,  G06F1/3296 ,  G06F9/50

Abstract: A hardware controller within a core of a processor is described. The hardware controller includes telemetry logic to generate telemetry data that indicates an activity state of the core; core stall detection logic to determine, based on the telemetry data from the telemetry logic, whether the core is in an idle loop state; and a power controller that, in response to the core stall detection logic determining that the core is in the idle loop state, is to decrease a power mode of the core from a first power mode associated with a first set of power settings to a second power mode associated with a second set of power settings.

公开(公告)号：US20220100247A1

公开(公告)日：2022-03-31

申请号：US17033753

申请日：2020-09-26

Applicant: Intel Corporation

Inventor： Vivek Garg ,  Ankush Varma ,  Krishnakanth Sistla ,  Nikhil Gupta ,  Nikethan Shivanand Baligar ,  Stephen Wang ,  Nilanjan Palit ,  Timothy Kam ,  Adwait Purandare ,  Ujjwal Gupta ,  Stanley Chen ,  Dorit Shapira ,  Shruthi Venugopal ,  Suresh Chemudupati ,  Rupal Parikh ,  Eric Dehaemer ,  Pavithra Sampath ,  Phani Kumar Kandula ,  Yogesh Bansal ,  Dean Mulla ,  Michael Tulanowski ,  Stephen Haake ,  Andrew Herdrich ,  Ripan Das

IPC: G06F1/28 ,  G06F1/30 ,  G06F13/20

Abstract: Hierarchical Power Management (HPM) architecture considers the limits of scaling on a power management controller, the autonomy at each die, and provides a unified view of the package to a platform. At a simplest level, HPM architecture has a supervisor and one or more supervisee power management units (PMUs) that communicate via at least two different communication fabrics. Each PMU can behave as a supervisor for a number of supervisee PMUs in a particular domain. HPM addresses these needs for products that comprise a collection of dice with varying levels of power and thermal management capabilities and needs. HPM serves as a unified mechanism than can span collection of dice of varying capability and function, which together form a traditional system-on-chip (SoC). HPM provides a basis for managing power and thermals across a diverse set of dice.