公开(公告)号：US11016556B2

公开(公告)日：2021-05-25

申请号：US16513267

申请日：2019-07-16

Applicant: INTEL CORPORATION

Inventor： Alexander Gendler ,  Doron Rajwan ,  Tal Kuzi ,  Dean Mulla ,  Ariel Szapiro ,  Nir Tell

IPC: G06F1/32 ,  G06F1/3296 ,  G06F1/3206 ,  G06F1/324

Abstract: A parallel multi-step power management flow apparatus and method for using the same are disclosed. In one embodiment, an integrated circuit comprises a plurality of processing entities to execute operations, a power controller coupled to the plurality of processing entities to control power management for the plurality of processing entities, and a plurality of agents, where each of the plurality of agents is operable to perform a power control flow for one of the processing entities by separately scheduling, using a scheduler, and executing a plurality of power control flow phases in response to a plurality of requests received from the power controller, and each agent is operable to send a plurality of acknowledgements, one acknowledgement for each phase, upon completion of the plurality of power control flow phases.

公开(公告)号：US12093100B2

公开(公告)日：2024-09-17

申请号：US17033753

申请日：2020-09-26

Applicant: Intel Corporation

Inventor： Vivek Garg ,  Ankush Varma ,  Krishnakanth Sistla ,  Nikhil Gupta ,  Nikethan Shivanand Baligar ,  Stephen Wang ,  Nilanjan Palit ,  Timothy Yee-Kwong Kam ,  Adwait Purandare ,  Ujjwal Gupta ,  Stanley Chen ,  Dorit Shapira ,  Shruthi Venugopal ,  Suresh Chemudupati ,  Rupal Parikh ,  Eric Dehaemer ,  Pavithra Sampath ,  Phani Kumar Kandula ,  Yogesh Bansal ,  Dean Mulla ,  Michael Tulanowski ,  Stephen Paul Haake ,  Andrew Herdrich ,  Ripan Das ,  Nazar Syed Haider ,  Aman Sewani

IPC: G06F1/28 ,  G06F1/30 ,  G06F13/20

CPC classification number: G06F1/28 ,  G06F1/30 ,  G06F13/20 ,  G06F2213/40

Abstract: Hierarchical Power Management (HPM) architecture considers the limits of scaling on a power management controller, the autonomy at each die, and provides a unified view of the package to a platform. At a simplest level, HPM architecture has a supervisor and one or more supervisee power management units (PMUs) that communicate via at least two different communication fabrics. Each PMU can behave as a supervisor for a number of supervisee PMUs in a particular domain. HPM addresses these needs for products that comprise a collection of dice with varying levels of power and thermal management capabilities and needs. HPM serves as a unified mechanism than can span collection of dice of varying capability and function, which together form a traditional system-on-chip (SoC). HPM provides a basis for managing power and thermals across a diverse set of dice.

公开(公告)号：US10946866B2

公开(公告)日：2021-03-16

申请号：US15942466

申请日：2018-03-31

Applicant: Intel Corporation

Inventor： Bahaa Fahim ,  Riccardo Mariani ,  Dean Mulla ,  Robert Gottlieb

IPC: B60W50/023 ,  B60W50/02 ,  B60R16/023 ,  B60W50/00

Abstract: Methods and apparatus relating to provision of core tightly coupled lockstep for high functional safety are described. In an embodiment, a master core, coupled to a slave core, executes one or more operations to support Advanced Driver Assistance Systems (ADA) or autonomous driving. The master core and the slave core receive the same input signal and core tightly couple logic causes generation of a signal in response to comparison of a first output from the master core and a second output from the slave core. The generated signal causes an interruption of the one or more operations in response to a mismatch between the first output and the second output. Other embodiments are also disclosed and claimed.

公开(公告)号：US20180164873A1

公开(公告)日：2018-06-14

申请号：US15374684

申请日：2016-12-09

Applicant: Intel Corporation

Inventor： Alexander Gendler ,  Doron Rajwan ,  Tal Kuzi ,  Dean Mulla ,  Ariel Szapiro ,  Nir Tell

IPC: G06F1/32 ,  G06F1/26

CPC classification number: G06F1/3296 ,  G06F1/3206 ,  G06F1/324 ,  Y02D10/126 ,  Y02D10/172

Abstract: A parallel multi-step power management flow apparatus and method for using the same are disclosed. In one embodiment, an integrated circuit comprises a plurality of processing entities to execute operations, a power controller coupled to the plurality of processing entities to control power management for the plurality of processing entities, and a plurality of agents, where each of the plurality of agents is operable to perform a power control flow for one of the processing entities by separately scheduling, using a scheduler, and executing a plurality of power control flow phases in response to a plurality of requests received from the power controller, and each agent is operable to send a plurality of acknowledgements, one acknowledgement for each phase, upon completion of the plurality of power control flow phases.

公开(公告)号：US20170177046A1

公开(公告)日：2017-06-22

申请号：US14970747

申请日：2015-12-16

Applicant: Intel Corporation

Inventor： Vivek Garg ,  Alexander Gendler ,  Arvind Raman ,  Ashish V. Choubal ,  Krishnakanth V. Sistla ,  Dean Mulla ,  Eric J. Dehaemer ,  Rahul Agrawal ,  Guy G. Sotomayor

IPC: G06F1/26

CPC classification number: G06F1/26 ,  G06F1/3243 ,  Y02D10/152

Abstract: In one embodiment, a processor includes cores to execute instructions. At least some of the cores include a telemetry data control logic to send a first telemetry data packet to a power controller according to a stagger schedule to prevent data collisions, and a global alignment counter to count a stagger alignment period. Other embodiments are described and claimed.

公开(公告)号：US20160378173A1

公开(公告)日：2016-12-29

申请号：US14752841

申请日：2015-06-27

Applicant: Intel Corporation

Inventor： Dean Mulla ,  Daniel G. Borkowski ,  Krishnakanth V. Sistla ,  Victor Wu ,  Manev Luthra

IPC: G06F1/32 ,  G06F3/06

CPC classification number: G06F1/3296 ,  G06F1/3225 ,  G06F1/3237 ,  G06F1/3275 ,  G06F3/0604 ,  G06F3/0625 ,  G06F3/0653 ,  G06F3/0673 ,  Y02D10/128 ,  Y02D10/14 ,  Y02D10/172

Abstract: Systems and methods may provide for determining, in a first domain that manages a state of a second domain, that the second domain is in the state and determining, in the first domain, that a periodic action has been scheduled to occur in the second domain while the second domain is in the state. Additionally, the periodic action may be documented as a missed event with respect to the second domain. In one example, documenting the periodic action as a missed event includes incrementing a missed event counter.

Abstract translation: 系统和方法可以提供用于在管理第二域的状态的第一域中确定第二域处于该状态，并且在第一域中确定周期性动作已被调度出现在第二域中 而第二个域处于状态。 此外，周期性动作可以被记录为关于第二域的错过事件。 在一个示例中，将周期性动作记录为错过事件包括增加错过的事件计数器。

公开(公告)号：US10365707B2

公开(公告)日：2019-07-30

申请号：US15374684

申请日：2016-12-09

Applicant: Intel Corporation

Inventor： Alexander Gendler ,  Doron Rajwan ,  Tal Kuzi ,  Dean Mulla ,  Ariel Szapiro ,  Nir Tell

IPC: G06F1/32 ,  G06F1/3296 ,  G06F1/3206 ,  G06F1/324

Abstract: A parallel multi-step power management flow apparatus and method for using the same are disclosed. In one embodiment, an integrated circuit comprises a plurality of processing entities to execute operations, a power controller coupled to the plurality of processing entities to control power management for the plurality of processing entities, and a plurality of agents, where each of the plurality of agents is operable to perform a power control flow for one of the processing entities by separately scheduling, using a scheduler, and executing a plurality of power control flow phases in response to a plurality of requests received from the power controller, and each agent is operable to send a plurality of acknowledgements, one acknowledgement for each phase, upon completion of the plurality of power control flow phases.

公开(公告)号：US09910470B2

公开(公告)日：2018-03-06

申请号：US14970747

申请日：2015-12-16

Applicant: Intel Corporation

Inventor： Vivek Garg ,  Alexander Gendler ,  Arvind Raman ,  Ashish V. Choubal ,  Krishnakanth V. Sistla ,  Dean Mulla ,  Eric J. Dehaemer ,  Rahul Agrawal ,  Guy G. Sotomayor

IPC: G06F1/26 ,  G06F1/32

CPC classification number: G06F1/26 ,  G06F1/3243 ,  Y02D10/152

Abstract: In one embodiment, a processor includes cores to execute instructions. At least some of the cores include a telemetry data control logic to send a first telemetry data packet to a power controller according to a stagger schedule to prevent data collisions, and a global alignment counter to count a stagger alignment period. Other embodiments are described and claimed.

公开(公告)号：US09753525B2

公开(公告)日：2017-09-05

申请号：US14581781

申请日：2014-12-23

Applicant: Intel Corporation

Inventor： Nazar S. Haider ,  Dean Mulla ,  Allen W. Chu

IPC: G06F1/32

CPC classification number: G06F1/3243 ,  G06F1/305 ,  Y02D10/152

Abstract: Systems, methods, and devices are disclosed for mitigating voltage droop in a computing device. An example apparatus includes a plurality of threshold registers to store respective voltage droop thresholds, and an interface to receive a license grant message indicating a license mode for a processor core or domain. The license mode corresponds to a selected set of execution units in the processor core or domain. The apparatus also includes a voltage droop correction module to, based on the license mode indicated in the license grant message, select one of the voltage droop thresholds from the plurality of voltage droop registers, and compare a voltage droop in the processor core or domain with the selected voltage droop threshold. Based on the comparison, the apparatus triggers a voltage droop correction process.

公开(公告)号：US20220100247A1

公开(公告)日：2022-03-31

申请号：US17033753

申请日：2020-09-26

Applicant: Intel Corporation

Inventor： Vivek Garg ,  Ankush Varma ,  Krishnakanth Sistla ,  Nikhil Gupta ,  Nikethan Shivanand Baligar ,  Stephen Wang ,  Nilanjan Palit ,  Timothy Kam ,  Adwait Purandare ,  Ujjwal Gupta ,  Stanley Chen ,  Dorit Shapira ,  Shruthi Venugopal ,  Suresh Chemudupati ,  Rupal Parikh ,  Eric Dehaemer ,  Pavithra Sampath ,  Phani Kumar Kandula ,  Yogesh Bansal ,  Dean Mulla ,  Michael Tulanowski ,  Stephen Haake ,  Andrew Herdrich ,  Ripan Das

IPC: G06F1/28 ,  G06F1/30 ,  G06F13/20

Abstract: Hierarchical Power Management (HPM) architecture considers the limits of scaling on a power management controller, the autonomy at each die, and provides a unified view of the package to a platform. At a simplest level, HPM architecture has a supervisor and one or more supervisee power management units (PMUs) that communicate via at least two different communication fabrics. Each PMU can behave as a supervisor for a number of supervisee PMUs in a particular domain. HPM addresses these needs for products that comprise a collection of dice with varying levels of power and thermal management capabilities and needs. HPM serves as a unified mechanism than can span collection of dice of varying capability and function, which together form a traditional system-on-chip (SoC). HPM provides a basis for managing power and thermals across a diverse set of dice.