公开(公告)号：US20160118315A1

公开(公告)日：2016-04-28

申请号：US14918119

申请日：2015-10-20

Applicant: Intel Corporation

Inventor： Susan F. Smith ,  Jeffory L. Smalley ,  Mani Prakash ,  Thu Huynh

IPC: H01L23/367 ,  H01L25/065 ,  H01L21/48 ,  H01L25/00

CPC classification number: H01L23/3672 ,  H01L21/4882 ,  H01L23/40 ,  H01L23/4006 ,  H01L23/427 ,  H01L25/065 ,  H01L25/50 ,  H01L2023/4037 ,  H01L2023/4056 ,  H01L2023/4068 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second heat exchanger disposed in the opening on the at least one secondary device; at least one heat pipe coupled to the first heat exchanger and the second heat exchanger. A method including placing a heat exchanger on a multi-chip package, the heat exchanger including a first portion, a second portion and at least one heat pipe coupled to the first portion and the second portion; and coupling the heat exchanger to the multi-chip package.

Abstract translation: 一种装置，包括主要装置和至少一个辅助装置，其以平面阵列耦合到基板; 第一热交换器，其设置在所述主装置上并且在对应于所述至少一个次装置的区域上具有开口; 设置在所述至少一个次要装置的开口中的第二热交换器; 耦合到第一热交换器和第二热交换器的至少一个热管。 一种方法，包括将热交换器放置在多芯片封装上，所述热交换器包括耦合到所述第一部分和所述第二部分的第一部分，第二部分和至少一个热管; 并将热交换器耦合到多芯片封装。

公开(公告)号：US09935033B2

公开(公告)日：2018-04-03

申请号：US14918119

申请日：2015-10-20

Applicant: Intel Corporation

Inventor： Susan F. Smith ,  Jeffory L. Smalley ,  Mani Prakash ,  Thu Huynh

IPC: H01L23/00 ,  H01L23/367 ,  H01L25/00 ,  H01L25/065 ,  H01L23/427 ,  H01L21/48 ,  H01L23/40

CPC classification number: H01L23/3672 ,  H01L21/4882 ,  H01L23/40 ,  H01L23/4006 ,  H01L23/427 ,  H01L25/065 ,  H01L25/50 ,  H01L2023/4037 ,  H01L2023/4056 ,  H01L2023/4068 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second heat exchanger disposed in the opening on the at least one secondary device; at least one heat pipe coupled to the first heat exchanger and the second heat exchanger. A method including placing a heat exchanger on a multi-chip package, the heat exchanger including a first portion, a second portion and at least one heat pipe coupled to the first portion and the second portion; and coupling the heat exchanger to the multi-chip package.

公开(公告)号：US20180040536A1

公开(公告)日：2018-02-08

申请号：US15787544

申请日：2017-10-18

Applicant: Intel Corporation

Inventor： Jeffory L. Smalley ,  Susan F. Smith ,  Thu Huynh ,  Mani Prakash

IPC: H01L23/427 ,  H05K7/20 ,  H01L25/065 ,  H05K1/02 ,  H01L25/00

CPC classification number: H01L23/427 ,  H01L23/3672 ,  H01L23/473 ,  H01L24/00 ,  H01L25/0655 ,  H05K7/20336 ,  H05K7/20409 ,  H05K7/20509

Abstract: An apparatus including a primary device and at least one secondary device coupled to a substrate; a heat exchanger disposed on the primary device and on the at least one secondary device, wherein the heat exchanger includes at least one portion disposed over an area corresponding to the primary device or the at least one second device including a deflectable surface; and at least one thermally conductive conduit coupled to the heat exchanger. A method including placing a heat exchanger on a multi-chip package, the heat exchanger including the heat exchanger including at least one floating section operable to move in a direction toward or away from at least one of the plurality of dice and at least one thermally conductive conduit disposed in a channel of the heat exchanger and connected to the at least one floating section; and coupling the heat exchanger to the multi-chip package.

公开(公告)号：US09806003B2

公开(公告)日：2017-10-31

申请号：US15197129

申请日：2016-06-29

Applicant: Intel Corporation

Inventor： Jeffory L. Smalley ,  Susan F. Smith ,  Thu Huynh ,  Mani Prakash

IPC: H01L23/42 ,  H01L25/00 ,  H05K1/02 ,  H05K7/20 ,  H01L23/427 ,  H01L25/065

CPC classification number: H01L23/427 ,  H01L23/3672 ,  H01L23/473 ,  H01L25/0655 ,  H01L25/50 ,  H05K1/0203 ,  H05K7/20336 ,  H05K7/20409 ,  H05K7/20509 ,  H05K2201/10522

Abstract: An apparatus including a primary device and at least one secondary device coupled to a substrate; a heat exchanger disposed on the primary device and on the at least one secondary device, wherein the heat exchanger includes at least one portion disposed over an area corresponding to the primary device or the at least one second device including a deflectable surface; and at least one thermally conductive conduit coupled to the heat exchanger. A method including placing a heat exchanger on a multi-chip package, the heat exchanger including the heat exchanger including at least one floating section operable to move in a direction toward or away from at least one of the plurality of dice and at least one thermally conductive conduit disposed in a channel of the heat exchanger and connected to the at least one floating section; and coupling the heat exchanger to the multi-chip package.