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1.
公开(公告)号:US11201393B2
公开(公告)日:2021-12-14
申请号:US16185763
申请日:2018-11-09
Applicant: International Business Machines Corporation
Inventor: Samuel Connor , Joseph Kuczynski , Matthew Doyle , Stuart B. Benefield
Abstract: Embodiments herein describe a capillary containing a eutectic conductive liquid (e.g., EGaIn) and an electrolyte (e.g., NaOH) that is integrated into a printed circuit board (PCB). In one embodiment, the capillary is formed in a through-hole in the PCB and has negative and positive electrodes at its respective ends to seal the eutectic conductive liquid and the electrolyte. The capillary further includes one or more electrodes that extend through a side of the portion of the capillary containing the liquids. The wiper electrodes also make electrical contact with respective conductive layers in the PCB. Using a DC voltage between the negative and positive electrodes, the eutectic conductive liquid forms electrical connections between the wiper electrodes, which in turn, forms electrical connections between the conductive layers in the PCB.
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公开(公告)号:US10834829B1
公开(公告)日:2020-11-10
申请号:US16550403
申请日:2019-08-26
Applicant: International Business Machines Corporation
Inventor: Stuart B. Benefield , Samuel R. Connor , Matthew S. Doyle
Abstract: Embodiments herein describe a variable inductor containing a capillary. The capillary includes an eutectic conductive liquid (e.g., EGaIn) containing suspended magnetic particles and an electrolyte (e.g., NaOH). In one embodiment, the variable inductor has a pair of electrodes (e.g., negative and positive electrodes) at the respective ends of the capillary to seal the eutectic conductive liquid and the electrolyte. The variable inductor also includes an inductor coil disposed around the capillary, and the inductor coil is connected to a circuit and provides inductance for the connected circuit. Using a DC voltage between the pair of electrodes, the eutectic conductive liquid can extend inside the capillary, which in turn, causes the variable inductor to have a desired inductance.
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公开(公告)号:US10262553B2
公开(公告)日:2019-04-16
申请号:US15783532
申请日:2017-10-13
Applicant: International Business Machines Corporation
Inventor: Stuart B. Benefield , Samuel R. Connor , Jonathan W. Jackson , Joseph P. Kuczynski
Abstract: In an approach for providing dynamic services a computer receives a dietary plan for an individual. The computer tracks physical activity data for the individual. The computer creates one or more propositions for the individual based at least in part on the received dietary plan and the tracked physical activity data. The computer provides the created one or more propositions to the individual. The computer receives a selection from the created one or more propositions. The computer tracks the received selection.
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公开(公告)号:US10685585B2
公开(公告)日:2020-06-16
申请号:US15634315
申请日:2017-06-27
Applicant: International Business Machines Corporation
Inventor: Stuart B. Benefield , Samuel R. Connor , Jonathan W. Jackson , Joseph P. Kuczynski
IPC: G09B19/00 , A63B71/06 , G06Q50/12 , A61B5/145 , A61B5/157 , G06Q10/08 , A63B24/00 , G06Q30/02 , A61B5/00
Abstract: In an approach for providing dynamic services a computer receives a dietary plan for an individual. The computer tracks physical activity data for the individual. The computer creates one or more propositions for the individual based at least in part on the received dietary plan and the tracked physical activity data. The computer provides the created one or more propositions to the individual. The computer receives a selection from the created one or more propositions. The computer tracks the received selection.
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公开(公告)号:US20200037446A1
公开(公告)日:2020-01-30
申请号:US16508945
申请日:2019-07-11
Applicant: International Business Machines Corporation
Inventor: Samuel Connor , Stuart B. Benefield , Matthew S. Doyle , Joseph Kuczynski , Jonathan Jackson
Abstract: Methods and structures are provided for implementing embedded wire repair for printed circuit board (PCB) constructs. A repair wire layer is provided within the PCB stack with reference planes on opposite sides of the repair wire layer. When a repair connection is required, an appropriate plated through hole (PTH) is drilled to form the repair connection using the repair wire layer.
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公开(公告)号:US20180075218A1
公开(公告)日:2018-03-15
申请号:US15262371
申请日:2016-09-12
Applicant: International Business Machines Corporation
Inventor: Stuart B. Benefield , Samuel R. Connor , Jonathan W. Jackson , Joseph Kuczynski
IPC: G06F19/00
Abstract: Disclosed aspects relate to wellness data management. A wellness engine detects a triggering event which indicates an anticipated nourishment event that relates to an expected location. Based on both a set of user wellness data and the expected location for the anticipated nourishment event, the wellness engine determines a set of nourishment items. As such, the wellness engine provides a set of nourishment item identifiers for the anticipated nourishment event.
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7.
公开(公告)号:US11855341B2
公开(公告)日:2023-12-26
申请号:US17457353
申请日:2021-12-02
Applicant: International Business Machines Corporation
Inventor: Samuel Connor , Joseph Kuczynski , Matthew Doyle , Stuart B. Benefield
CPC classification number: H01Q1/364 , H01Q1/38 , H05K3/06 , H05K2203/0165
Abstract: Embodiments herein describe a capillary containing a eutectic conductive liquid (e.g., EGaIn) and an electrolyte (e.g., NaOH) that is integrated into a printed circuit board (PCB). In one embodiment, the PCB includes a capillary, a negative electrode, a positive electrode, a plurality of insulation layers, and a conductive layer. The capillary extends through the PCB. The capillary includes a side surface forming an annular cylinder. A eutectic conductive liquid and an electrolyte are disposed within an aperture formed by the side surface. An electrode extends through the side surface and contacts at least the eutectic conductive liquid or the electrolyte. The negative electrode is disposed at a first end of the capillary. The positive electrode is disposed at a second end of the capillary. The conductive layer is disposed between two of the plurality of insulation layers. The electrode forms an electrical connection with the conductive layer.
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公开(公告)号:US11412612B2
公开(公告)日:2022-08-09
申请号:US16508945
申请日:2019-07-11
Applicant: International Business Machines Corporation
Inventor: Samuel Connor , Stuart B. Benefield , Matthew S. Doyle , Joseph Kuczynski , Jonathan Jackson
Abstract: Methods and structures are provided for implementing embedded wire repair for printed circuit board (PCB) constructs. A repair wire layer is provided within the PCB stack with reference planes on opposite sides of the repair wire layer. When a repair connection is required, an appropriate plated through hole (PTH) is drilled to form the repair connection using the repair wire layer.
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9.
公开(公告)号:US20200153089A1
公开(公告)日:2020-05-14
申请号:US16185763
申请日:2018-11-09
Applicant: International Business Machines Corporation
Inventor: Samuel Connor , Joseph Kuczynski , Matthew Doyle , Stuart B. Benefield
Abstract: Embodiments herein describe a capillary containing a eutectic conductive liquid (e.g., EGaIn) and an electrolyte (e.g., NaOH) that is integrated into a printed circuit board (PCB). In one embodiment, the capillary is formed in a through-hole in the PCB and has negative and positive electrodes at its respective ends to seal the eutectic conductive liquid and the electrolyte. The capillary further includes one or more electrodes that extend through a side of the portion of the capillary containing the liquids. The wiper electrodes also make electrical contact with respective conductive layers in the PCB. Using a DC voltage between the negative and positive electrodes, the eutectic conductive liquid forms electrical connections between the wiper electrodes, which in turn, forms electrical connections between the conductive layers in the PCB.
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公开(公告)号:US10462901B1
公开(公告)日:2019-10-29
申请号:US16046518
申请日:2018-07-26
Applicant: International Business Machines Corporation
Inventor: Samuel Connor , Stuart B. Benefield , Matthew S. Doyle , Joseph Kuczynski , Jonathan Jackson
Abstract: Methods and structures are provided for implementing embedded wire repair for printed circuit board (PCB) constructs. A repair wire layer is provided within the PCB stack with reference planes on opposite sides of the repair wire layer. When a repair connection is required, an appropriate plated through hole (PTH) is drilled to form the repair connection using the repair wire layer.
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