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    COLD PLATE DEVICE FOR A TWO-PHASE COOLING SYSTEM
    3.
    发明申请
    COLD PLATE DEVICE FOR A TWO-PHASE COOLING SYSTEM 审中-公开

    公开(公告)号：US20200296857A1

    公开(公告)日：2020-09-17

    申请号：US16405214

    申请日：2019-05-07

    Applicant: International Business Machines Corporation

    Inventor： Timothy Joseph Chainer ,  Pritish Ranjan Parida ,  Fanghao Yang

    IPC: H05K7/20 ,  F28F3/12 ,  H01L23/473 ,  H01L21/48

    Abstract: Techniques that facilitate two-phase liquid cooling of an electronic device are provided. In one example, an apparatus, such as a cold plate device, comprises a first stackable layer and a second stackable layer. The first stackable layer comprises a first channel formed within the first stackable layer. The first channel comprises a first channel width and the first channel receives a coolant fluid via an inlet port of the apparatus. The second stackable layer comprises a second channel that provides a path for the coolant fluid to flow between the first channel and an outlet port of the apparatus. A width of the second channel increases along a flow direction of the coolant fluid that flows between the inlet port and the outlet port.

    Wafer level integration for embedded cooling
    5.
    发明授权
    Wafer level integration for embedded cooling 有权

    公开(公告)号：US10170392B2

    公开(公告)日：2019-01-01

    申请号：US15479810

    申请日：2017-04-05

    Applicant: International Business Machines Corporation

    Inventor： Timothy Joseph Chainer ,  Pritish Ranjan Parida ,  Mark Delorman Schultz

    IPC: H01L23/42 ,  H01L23/46 ,  H01L25/00 ,  H01L23/427 ,  H01L21/82 ,  H01L25/065

    Abstract: Techniques for wafer level integration of embedded cooling structures for integrated circuit devices are provided. In one embodiment, a method includes forming channel structures on a first surface of a silicon first wafer, wherein the channel structures respectively include radial channels that extend from central fluid distribution areas, and wherein integrated circuits are formed on a second surface of the silicon first wafer that opposes the first surface. The method can further include bonding a manifold wafer to the first surface of the silicon wafer such that inlet openings formed through the manifold wafer respectively connect to the central fluid distribution areas, thereby enclosing the radial channels and forming a bonded structure.

    COLD PLATE DEVICE FOR A TWO-PHASE COOLING SYSTEM
    7.
    发明申请
    COLD PLATE DEVICE FOR A TWO-PHASE COOLING SYSTEM 审中-公开

    公开(公告)号：US20180098459A1

    公开(公告)日：2018-04-05

    申请号：US15411484

    申请日：2017-01-20

    Applicant: International Business Machines Corporation

    Inventor： Timothy Joseph Chainer ,  Pritish Ranjan Parida ,  Fanghao Yang

    IPC: H05K7/20

    CPC classification number: H05K7/20254 ,  F28F3/12 ,  H01L23/34 ,  H01L23/473 ,  H05K7/20272

    Abstract: Techniques that facilitate two-phase liquid cooling of an electronic device are provided. In one example, an apparatus, such as a cold plate device, comprises a first stackable layer and a second stackable layer. The first stackable layer comprises a first channel formed within the first stackable layer. The first channel comprises a first channel width and the first channel receives a coolant fluid via an inlet port of the apparatus. The second stackable layer comprises a second channel that provides a path for the coolant fluid to flow between the first channel and an outlet port of the apparatus. A width of the second channel increases along a flow direction of the coolant fluid that flows between the inlet port and the outlet port.

    System level model for pumped two-phase cooling systems
    9.
    发明授权
    System level model for pumped two-phase cooling systems 有权

    公开(公告)号：US11009926B2

    公开(公告)日：2021-05-18

    申请号：US16775885

    申请日：2020-01-29

    Applicant: International Business Machines Corporation

    Inventor： Timothy Joseph Chainer ,  Leitao Chen ,  Pritish Ranjan Parida ,  Mark Delorman Schultz ,  Fanghao Yang

    IPC: G06F1/20 ,  F24F11/62

    Abstract: Techniques are provided for system level modeling of two-phase cooling systems. In one example, a computer-implemented method comprises determining, by a system operatively coupled to a processor, respective sets of steady state values for parameters at inlet-outlet junctions using a system model, wherein the determining is based on first user input specifying a cooling system design comprising a plurality of part objects, wherein adjacent part objects in a flow direction are connected at the inlet-outlet junctions. The computer-implemented method can also comprise generating, by the system, a graphical display that depicts the respective sets of parameter values at the inlet-outlet junctions.

    Autonomous development of two-phase cooling architecture
    10.
    发明授权
    Autonomous development of two-phase cooling architecture 有权

    公开(公告)号：US10929577B2

    公开(公告)日：2021-02-23

    申请号：US15842017

    申请日：2017-12-14

    Applicant: International Business Machines Corporation

    Inventor： Timothy Joseph Chainer ,  Pritish Ranjan Parida

    IPC: G06F30/20 ,  G06F119/08

    Abstract: Techniques for autonomously modeling a two-phase cooling architecture are provided. In one example, a computer-implemented method can comprise generating, by a system operatively coupled to a processor, a reduced physics model based on a profile of a heat source and a parameter of a cooling structure. The reduced physics model can provide an output. Also, the computer-implemented method can comprise generating, by the system, a full physics model based on the output. The computer-implemented method can further comprise combining, by the system, the reduced physics model and the full physics model to define an architecture that achieves a flow distribution of a coolant.

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