公开(公告)号：US09570649B2

公开(公告)日：2017-02-14

申请号：US14671619

申请日：2015-03-27

Applicant: Intersil Americas LLC

Inventor： Sri Ganesh A. Tharumalingam ,  Seck Jiong Wong

IPC: H01L31/16 ,  H01L31/0232 ,  H01L27/144 ,  H01L23/00 ,  H01L25/16 ,  H01L31/02 ,  H01L31/18 ,  G01S7/481 ,  H01L31/0203 ,  H01L31/173 ,  G01S17/02

CPC classification number: H01L31/16 ,  G01S7/4813 ,  G01S17/026 ,  H01L24/97 ,  H01L25/165 ,  H01L25/167 ,  H01L27/144 ,  H01L27/1446 ,  H01L31/02002 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/173 ,  H01L31/18 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Optoelectronic devices (e.g., optical proximity sensors), methods for fabricating optoelectronic devices, and systems including optoelectronic devices, are described herein. An optoelectronic device includes a light detector die that includes a light detector sensor area. A light source die is attached to a portion of the light detector die that does not include the light detector sensor area. An opaque barrier is formed between the light detector sensor area and the light source die, and a light transmissive material encapsulates the light detector sensor area and the light source die. Rather than requiring a separate base substrate (e.g., a PCB substrate) to which are connected a light source die and a light detector die, the light source die is connected to the light detector die, such that the light detector die acts as the base for the finished optoelectronic device. This provides for cost reductions and reduces the total package footprint.

Abstract translation: 本文描述了光电子器件（例如，光学接近传感器），用于制造光电子器件的方法，以及包括光电器件的系统。 光电子器件包括光检测器管芯，其包括光检测器传感器区域。 光源管芯附接到不包括光检测器传感器区域的光检测器管芯的一部分。 在光检测器传感器区域和光源管芯之间形成不透明屏障，并且透光材料封装光检测器传感器区域和光源管芯。 光源管芯不需要连接光源管芯和光检测器管芯的单独的基底（例如，PCB衬底），光源管芯连接到光检测器管芯，使得光检测器管芯用作基座 用于成品光电器件。 这样做可以降低成本并减少总封装尺寸。

公开(公告)号：US09570648B2

公开(公告)日：2017-02-14

申请号：US13761708

申请日：2013-02-07

Applicant: Intersil Americas LLC

Inventor： Sri Ganesh A. Tharumalingam ,  Seck Jiong Wong

IPC: G06M7/00 ,  H01J5/02 ,  H01J40/14 ,  H01L31/16 ,  H01L31/0232 ,  H01L27/144 ,  H01L23/00 ,  H01L25/16 ,  H01L31/02 ,  H01L31/18 ,  G01S7/481 ,  H01L31/0203 ,  H01L31/173 ,  G01S17/02

CPC classification number: H01L31/16 ,  G01S7/4813 ,  G01S17/026 ,  H01L24/97 ,  H01L25/165 ,  H01L25/167 ,  H01L27/144 ,  H01L27/1446 ,  H01L31/02002 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/173 ,  H01L31/18 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Optoelectronic devices (e.g., optical proximity sensors), methods for fabricating optoelectronic devices, and systems including optoelectronic devices, are described herein. An optoelectronic device includes a light detector die that includes a light detector sensor area. A light source die is attached to a portion of the light detector die that does not include the light detector sensor area. An opaque barrier is formed between the light detector sensor area and the light source die, and a light transmissive material encapsulates the light detector sensor area and the light source die. Rather than requiring a separate base substrate (e.g., a PCB substrate) to which are connected a light source die and a light detector die, the light source die is connected to the light detector die, such that the light detector die acts as the base for the finished optoelectronic device. This provides for cost reductions and reduces the total package footprint.

Abstract translation: 本文描述了光电子器件（例如，光学接近传感器），用于制造光电子器件的方法，以及包括光电器件的系统。 光电子器件包括光检测器管芯，其包括光检测器传感器区域。 光源管芯附接到不包括光检测器传感器区域的光检测器管芯的一部分。 在光检测器传感器区域和光源管芯之间形成不透明屏障，并且透光材料封装光检测器传感器区域和光源管芯。 光源管芯不需要连接光源管芯和光检测器管芯的单独的基底（例如，PCB衬底），光源管芯连接到光检测器管芯，使得光检测器管芯用作基座 用于成品光电器件。 这样做可以降低成本并减少总封装尺寸。

公开(公告)号：US20150207016A1

公开(公告)日：2015-07-23

申请号：US14671619

申请日：2015-03-27

Applicant: Intersil Americas LLC

Inventor： Sri Ganesh A. Tharumalingam ,  Seck Jiong Wong

IPC: H01L31/16 ,  H01L31/18 ,  H01L31/02 ,  H01L25/16

CPC classification number: H01L31/16 ,  G01S7/4813 ,  G01S17/026 ,  H01L24/97 ,  H01L25/165 ,  H01L25/167 ,  H01L27/144 ,  H01L27/1446 ,  H01L31/02002 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/173 ,  H01L31/18 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Optoelectronic devices (e.g., optical proximity sensors), methods for fabricating optoelectronic devices, and systems including optoelectronic devices, are described herein. An optoelectronic device includes a light detector die that includes a light detector sensor area. A light source die is attached to a portion of the light detector die that does not include the light detector sensor area. An opaque barrier is formed between the light detector sensor area and the light source die, and a light transmissive material encapsulates the light detector sensor area and the light source die. Rather than requiring a separate base substrate (e.g., a PCB substrate) to which are connected a light source die and a light detector die, the light source die is connected to the light detector die, such that the light detector die acts as the base for the finished optoelectronic device. This provides for cost reductions and reduces the total package footprint.

Abstract translation: 本文描述了光电子器件（例如，光学接近传感器），用于制造光电子器件的方法，以及包括光电器件的系统。 光电子器件包括光检测器管芯，其包括光检测器传感器区域。 光源管芯附接到不包括光检测器传感器区域的光检测器管芯的一部分。 在光检测器传感器区域和光源管芯之间形成不透明屏障，并且透光材料封装光检测器传感器区域和光源管芯。 光源管芯不需要连接光源管芯和光检测器管芯的单独的基底（例如，PCB衬底），光源管芯连接到光检测器管芯，使得光检测器管芯用作基座 用于成品光电器件。 这样做可以降低成本并减少总封装尺寸。

公开(公告)号：US20130334445A1

公开(公告)日：2013-12-19

申请号：US13761708

申请日：2013-02-07

Applicant: INTERSIL AMERICAS LLC

Inventor： Sri Ganesh A. Tharumalingam ,  Seck Jiong Wong

IPC: H01L31/0232 ,  H01L27/144

CPC classification number: H01L31/16 ,  G01S7/4813 ,  G01S17/026 ,  H01L24/97 ,  H01L25/165 ,  H01L25/167 ,  H01L27/144 ,  H01L27/1446 ,  H01L31/02002 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/173 ,  H01L31/18 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Optoelectronic devices (e.g., optical proximity sensors), methods for fabricating optoelectronic devices, and systems including optoelectronic devices, are described herein. An optoelectronic device includes a light detector die that includes a light detector sensor area. A light source die is attached to a portion of the light detector die that does not include the light detector sensor area. An opaque barrier is formed between the light detector sensor area and the light source die, and a light transmissive material encapsulates the light detector sensor area and the light source die. Rather than requiring a separate base substrate (e.g., a PCB substrate) to which are connected a light source die and a light detector die, the light source die is connected to the light detector die, such that the light detector die acts as the base for the finished optoelectronic device. This provides for cost reductions and reduces the total package footprint.

Abstract translation: 本文描述了光电子器件（例如，光学接近传感器），用于制造光电子器件的方法，以及包括光电器件的系统。 光电子器件包括光检测器管芯，其包括光检测器传感器区域。 光源管芯附接到不包括光检测器传感器区域的光检测器管芯的一部分。 在光检测器传感器区域和光源管芯之间形成不透明屏障，并且透光材料封装光检测器传感器区域和光源管芯。 光源管芯不需要连接光源管芯和光检测器管芯的单独的基底（例如，PCB衬底），光源管芯连接到光检测器管芯，使得光检测器管芯用作基座 用于成品光电器件。 这样做可以降低成本并减少总封装尺寸。