公开(公告)号：US20140287158A1

公开(公告)日：2014-09-25

申请号：US14219047

申请日：2014-03-19

Applicant: Intrinsiq Materials, Inc.

Inventor： Janet Heyen ,  Michael Carmody

IPC: C09D5/24

CPC classification number: H05K1/095 ,  C08K9/10 ,  H01B1/22 ,  H01L23/49883 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/0326 ,  H05K3/1216 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0224 ,  H05K2201/0245 ,  H05K2201/0266 ,  H05K2201/0272 ,  H05K2203/0514 ,  H01L2924/00

Abstract: A conductive paste for screen application has a mixture of copper flake having a mean diameter between 1.0-8.0 micrometers and copper nanoparticles having a mean diameter from 10 nm to 100 nm, wherein the ratio of the copper flake to the nanoparticles is between 2:1 and 5:1 by weight; and a resin comprising about half of a polymer having a molecular weight in excess of 10,000 and one or more solvents.

Abstract translation: 用于筛网的导电糊剂具有平均直径在1.0-8.0微米之间的铜薄片和平均直径为10nm至100nm的铜纳米颗粒的混合物，其中铜片与纳米颗粒的比例为2:1 和5：1重量比; 以及包含分子量超过10,000的聚合物的大约一半的树脂和一种或多种溶剂。

公开(公告)号：US20140287159A1

公开(公告)日：2014-09-25

申请号：US14219087

申请日：2014-03-19

Applicant: Intrinsiq Materials, Inc.

Inventor： Michael Carmody ,  Janet Heyen

IPC: C09D5/24

CPC classification number: C09D5/24 ,  H01B1/22 ,  H01L31/022425

Abstract: A conductive paste for screen application to a substrate has a mixture of copper particles having a mean diameter between 1.0-5.0 micrometers and polymer-coated copper nanoparticles having a mean diameter from 10 nm to 100 nm. The ratio of the copper particles to the nanoparticles is between 2:1 and 5:1 by weight. The paste has a resin comprising a binder portion and a solvent portion, wherein the binder portion is about half of the resin by weight, and a plasticizer having a boiling point above about 200 degrees C., wherein the plasticizer is from 1-3% of the paste, by weight.

Abstract translation: 用于筛网施加到基底的导电膏具有平均直径为1.0-5.0微米的铜颗粒与平均直径为10nm至100nm的聚合物涂覆的铜纳米颗粒的混合物。 铜颗粒与纳米颗粒的重量比为2:1至5:1。 糊状物具有包含粘合剂部分和溶剂部分的树脂，其中粘合剂部分为树脂重量的约一半，沸点高于约200℃的增塑剂，其中增塑剂为1-3％ 的浆料，重量。