公开(公告)号：US20140287158A1

公开(公告)日：2014-09-25

申请号：US14219047

申请日：2014-03-19

Applicant: Intrinsiq Materials, Inc.

Inventor： Janet Heyen ,  Michael Carmody

IPC: C09D5/24

CPC classification number: H05K1/095 ,  C08K9/10 ,  H01B1/22 ,  H01L23/49883 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/0326 ,  H05K3/1216 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0224 ,  H05K2201/0245 ,  H05K2201/0266 ,  H05K2201/0272 ,  H05K2203/0514 ,  H01L2924/00

Abstract: A conductive paste for screen application has a mixture of copper flake having a mean diameter between 1.0-8.0 micrometers and copper nanoparticles having a mean diameter from 10 nm to 100 nm, wherein the ratio of the copper flake to the nanoparticles is between 2:1 and 5:1 by weight; and a resin comprising about half of a polymer having a molecular weight in excess of 10,000 and one or more solvents.

Abstract translation: 用于筛网的导电糊剂具有平均直径在1.0-8.0微米之间的铜薄片和平均直径为10nm至100nm的铜纳米颗粒的混合物，其中铜片与纳米颗粒的比例为2:1 和5：1重量比; 以及包含分子量超过10,000的聚合物的大约一半的树脂和一种或多种溶剂。

公开(公告)号：US20150189761A1

公开(公告)日：2015-07-02

申请号：US14568168

申请日：2014-12-12

Applicant: Intrinsiq Materials, Inc.

Inventor： Chun Wong Aaron Chan ,  Richard John Dixon ,  Michael J. Carmody ,  Kai Man Kerry Yu ,  Hsin-Yi Sherry Tsai ,  Glenn Shackleford ,  Janet Heyen

IPC: H05K3/12 ,  C09D11/52 ,  H05K3/26 ,  H01B1/02 ,  H01L21/02 ,  H05K3/22

CPC classification number: C09D11/52 ,  H01L21/02532 ,  H01L21/02628 ,  H05K1/097 ,  H05K3/1283 ,  H05K3/38 ,  H05K2203/107

Abstract: A method for forming a conductive pattern on a substrate deposits, onto a surface of the substrate, a nanoparticle ink that comprises nanoparticles of a conductive or semiconductor material, at least one low boiling point solvent, and from 0.1 weight % to 50 weight % of a high boiling point solvent. The method forms a partially wet patterned substrate by drying the deposited nanoparticle ink to a wetness range between about 3 weight % and 8 weight % solvent. The method directs a patterned illumination of laser light to cure the deposited ink pattern on the partially wet patterned substrate.

Abstract translation: 在衬底上形成导电图案的方法在衬底的表面上沉积纳米颗粒油墨，该纳米颗粒油墨包含导电或半导体材料，至少一种低沸点溶剂和0.1重量％至50重量％ 高沸点溶剂。 该方法通过将沉积的纳米颗粒油墨干燥至约3重量％至8重量％溶剂之间的湿度范围来形成部分湿图案化基材。 该方法引导激光的图案照明以固化部分湿图案化衬底上沉积的墨图案。

公开(公告)号：US20160128201A1

公开(公告)日：2016-05-05

申请号：US14931356

申请日：2015-11-03

Applicant: Intrinsiq Materials, Inc.

Inventor： David Ciufo ,  Janet Heyen

IPC: H05K3/00 ,  H05K3/42

CPC classification number: H05K3/4069 ,  H05K1/0306 ,  H05K1/032 ,  H05K1/097 ,  H05K3/0047 ,  H05K3/1233 ,  H05K3/227 ,  H05K3/26 ,  H05K3/429 ,  H05K3/4617 ,  H05K2201/0266 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2203/0139 ,  H05K2203/085 ,  H05K2203/086 ,  H05K2203/107 ,  H05K2203/1131 ,  H05K2203/143 ,  H05K2203/1438 ,  Y10T29/49165

Abstract: A method for filling a via on a printed circuit board formulates a paste as a dispersion of copper particulate that includes nanocopper particles in a solvent and a binder and depositing the paste into a via cavity formed in the printed circuit board. Heating the paste-filled cavity removes most of the solvent. The method sinters the deposited paste in the via cavity, planarizes the sintered via, and overplates the filled via with copper.

Abstract translation: 用于在印刷电路板上填充通孔的方法将作为包括纳米颗粒在内的铜颗粒的分散体的糊剂制成溶剂和粘合剂，并将该糊料沉积到形成在印刷电路板中的通孔中。 加热糊状空腔去除大部分溶剂。 该方法将沉积的糊料烧结在通孔腔中，使烧结的通孔平坦化，并用铜填充填充的通孔。

公开(公告)号：US09999137B2

公开(公告)日：2018-06-12

申请号：US14931356

申请日：2015-11-03

Applicant: Intrinsiq Materials, Inc.

Inventor： David Ciufo ,  Janet Heyen

IPC: H01K3/10 ,  H05K3/40 ,  H05K3/00 ,  H05K3/42 ,  H05K1/03 ,  H05K1/09 ,  H05K3/12 ,  H05K3/22 ,  H05K3/26 ,  H05K3/46

CPC classification number: H05K3/4069 ,  H05K1/0306 ,  H05K1/032 ,  H05K1/097 ,  H05K3/0047 ,  H05K3/1233 ,  H05K3/227 ,  H05K3/26 ,  H05K3/429 ,  H05K3/4617 ,  H05K2201/0266 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2203/0139 ,  H05K2203/085 ,  H05K2203/086 ,  H05K2203/107 ,  H05K2203/1131 ,  H05K2203/143 ,  H05K2203/1438 ,  Y10T29/49165

Abstract: A method for filling a via on a printed circuit board formulates a paste as a dispersion of copper particulate that includes nanocopper particles in a solvent and a binder and depositing the paste into a via cavity formed in the printed circuit board. Heating the paste-filled cavity removes most of the solvent. The method sinters the deposited paste in the via cavity, planarizes the sintered via, and overplates the filled via with copper.

公开(公告)号：US20140287159A1

公开(公告)日：2014-09-25

申请号：US14219087

申请日：2014-03-19

Applicant: Intrinsiq Materials, Inc.

Inventor： Michael Carmody ,  Janet Heyen

IPC: C09D5/24

CPC classification number: C09D5/24 ,  H01B1/22 ,  H01L31/022425

Abstract: A conductive paste for screen application to a substrate has a mixture of copper particles having a mean diameter between 1.0-5.0 micrometers and polymer-coated copper nanoparticles having a mean diameter from 10 nm to 100 nm. The ratio of the copper particles to the nanoparticles is between 2:1 and 5:1 by weight. The paste has a resin comprising a binder portion and a solvent portion, wherein the binder portion is about half of the resin by weight, and a plasticizer having a boiling point above about 200 degrees C., wherein the plasticizer is from 1-3% of the paste, by weight.

Abstract translation: 用于筛网施加到基底的导电膏具有平均直径为1.0-5.0微米的铜颗粒与平均直径为10nm至100nm的聚合物涂覆的铜纳米颗粒的混合物。 铜颗粒与纳米颗粒的重量比为2:1至5:1。 糊状物具有包含粘合剂部分和溶剂部分的树脂，其中粘合剂部分为树脂重量的约一半，沸点高于约200℃的增塑剂，其中增塑剂为1-3％ 的浆料，重量。