DUAL CAVITY PRESSURE STRUCTURES
    1.
    发明申请
    DUAL CAVITY PRESSURE STRUCTURES 有权
    双孔压力结构

    公开(公告)号:US20160272486A1

    公开(公告)日:2016-09-22

    申请号:US15071499

    申请日:2016-03-16

    申请人: InvenSense, Inc.

    IPC分类号: B81B7/02 B81C1/00

    摘要: Provided herein is a method including forming a trench in a handle substrate, and a trench lining is formed in the trench. A first cavity and a second cavity are formed in the handle substrate, wherein the first cavity is connected to the trench. A first MEMS structure and the handle substrate are sealed for maintaining a first pressure within the trench and the first cavity. A second MEMS structure and the handle substrate are sealed for maintaining the first pressure within the second cavity. A portion of the trench lining is exposed, and the first pressure is changed to a second pressure within the first cavity. The first cavity and the trench are sealed to maintain the second pressure within the trench and the first cavity.

    摘要翻译: 这里提供了一种方法,包括在手柄基板中形成沟槽,并且沟槽衬里形成在沟槽中。 第一腔和第二腔形成在手柄衬底中,其中第一腔连接到沟槽。 第一MEMS结构和手柄基板被密封以保持沟槽和第一腔内的第一压力。 第二MEMS结构和手柄基板被密封以将第一压力保持在第二腔内。 沟槽衬里的一部分被暴露,并且第一压力被改变到第一腔内的第二压力。 第一腔体和沟槽被密封以将第二压力保持在沟槽和第一腔体内。