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公开(公告)号：US12180067B2
公开(公告)日：2024-12-31
申请号：US17549207
申请日：2021-12-13
Applicant: InvenSense, Inc.
Inventor： Pei-Wen Yen , Ting-Yuan Liu , Jye Ren , Chung-Hsien Lin , Joseph Seeger , Calin Miclaus
IPC: B81B7/00
Abstract: A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.
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公开(公告)号：US20230030211A1
公开(公告)日：2023-02-02
申请号：US17964520
申请日：2022-10-12
Applicant: InvenSense, Inc.
Inventor： Calin Miclaus , Chung-Hsien Lin , Jye Ren , Tim Piessens , Pei-Wen Yen , Manish Sharma-Kulamarva
Abstract: A device includes a housing unit with an internal volume. The device further includes a sensor coupled to a substrate via an electrical coupling, wherein the sensor is disposed within the internal volume of the housing unit, and wherein the sensor is in communication with an external environment of the housing unit from a side other than a side associated with the substrate. The device also includes a moisture detection unit electrically coupled to the sensor, wherein the moisture detection unit comprises at least two looped wires forming electrodes, and wherein the moisture detection unit is configured to detect presence of a moisture within an interior environment of the housing unit by measuring a capacitance between the electrodes and by detecting a change between the measured capacitance and a capacitance between the electrodes in absence of moisture.
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公开(公告)号：US11768122B2
公开(公告)日：2023-09-26
申请号：US17964501
申请日：2022-10-12
Applicant: InvenSense, Inc.
Inventor： Calin Miclaus , Chung-Hsien Lin , Jye Ren , Tim Piessens , Pei-Wen Yen , Manish Sharma-Kulamarva
CPC classification number: G01L19/0654 , G01L9/0041 , G01L19/0092 , G01N25/56 , G01N27/048 , G01N27/223
Abstract: A device includes a housing unit with an internal volume. The device further includes a sensor coupled to a substrate via an electrical coupling, wherein the sensor is disposed within the internal volume of the housing unit, and wherein the sensor is in communication with an external environment of the housing unit from a side other than a side associated with the substrate. The device also includes a moisture detection unit electrically coupled to the sensor, wherein the moisture detection unit comprises at least two looped wires at different heights, and wherein the moisture detection unit is configured to detect presence of a moisture within an interior environment of the housing unit when the moisture detection unit becomes in direct contact with the moisture.
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Patent Agency Ranking
公开(公告)号：US11225409B2
公开(公告)日：2022-01-18
申请号：US16574037
申请日：2019-09-17
Applicant: InvenSense, Inc.
Inventor： Pei-Wen Yen , Ting-Yuan Liu , Jye Ren , Chung-Hsien Lin , Joseph Seeger , Calin Miclaus
IPC: B81B7/00
Abstract: A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.
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公开(公告)号：US20230035487A1
公开(公告)日：2023-02-02
申请号：US17964501
申请日：2022-10-12
Applicant: InvenSense, Inc.
Inventor： Calin Miclaus , Chung-Hsien Lin , Jye Ren , Tim Piessens , Pei-Wen Yen , Manish Sharma-Kulamarva
Abstract: A device includes a housing unit with an internal volume. The device further includes a sensor coupled to a substrate via an electrical coupling, wherein the sensor is disposed within the internal volume of the housing unit, and wherein the sensor is in communication with an external environment of the housing unit from a side other than a side associated with the substrate. The device also includes a moisture detection unit electrically coupled to the sensor, wherein the moisture detection unit comprises at least two looped wires at different heights, and wherein the moisture detection unit is configured to detect presence of a moisture within an interior environment of the housing unit when the moisture detection unit becomes in direct contact with the moisture.
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公开(公告)号：US11499884B2
公开(公告)日：2022-11-15
申请号：US16518879
申请日：2019-07-22
Applicant: InvenSense, Inc.
Inventor： Calin Miclaus , Chung-Hsien Lin , Jye Ren , Tim Piessens , Pei-Wen Yen , Manish Sharma-Kulamarva
Abstract: A device includes a sensor die, an electrical coupling, a substrate, a liquid detection unit, and a housing unit. The sensor die is coupled to the substrate via the electrical coupling. The liquid detection unit electrically is coupled to the sensor die. The housing unit and the substrate are configured to house the sensor die, the liquid detection unit, and the electrical coupling. The housing unit comprises an opening that exposes the sensor die to an environment external to the housing unit. The liquid detection unit detects presence of liquid within an interior environment of the housing unit. In some embodiments, the device further includes a gel filled within the interior environment of the housing unit covering the sensor die and the substrate. The gel, e.g., silicone, fluoro silicone, etc., is configured to protect the sensor die, the electrical coupling, and the substrate from exposure to the liquid.
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公开(公告)号：US20220098030A1
公开(公告)日：2022-03-31
申请号：US17549207
申请日：2021-12-13
Applicant: InvenSense, Inc.
Inventor： Pei-Wen Yen , Ting-Yuan Liu , Jye Ren , Chung-Hsien Lin , Joseph Seeger , Calin Miclaus
IPC: B81B7/00
Abstract: A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.
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公开(公告)号：US20200087142A1
公开(公告)日：2020-03-19
申请号：US16574037
申请日：2019-09-17
Applicant: InvenSense, Inc.
Inventor： Pei-Wen Yen , Ting-Yuan Liu , Jye Ren , Chung-Hsien Lin , Joseph Seeger , Calin Miclaus
IPC: B81B7/00
Abstract: A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.
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