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公开(公告)号：US20230089813A1
公开(公告)日：2023-03-23
申请号：US17950007
申请日：2022-09-21
Applicant: InvenSense, Inc.
Inventor： Weng Shen Su , Chung-Hsien Lin , Yaoching Wang , Tsung Lin Tang , Ting-Yuan Liu , Calin Miclaus
Abstract: A method includes depositing a passivation layer on a substrate; depositing and patterning a first polysilicon layer on the passivation layer; depositing and patterning a first oxide layer on the first polysilicon layer forming a patterned first oxide layer; depositing and patterning a second polysilicon layer on the patterned first oxide layer. A portion of the second polysilicon layer directly contacts a portion of the first polysilicon layer. A portion of the patterned second polysilicon layer corresponds to a bottom electrode. A second oxide layer is deposited on the patterned second polysilicon layer and on an exposed portion of the patterned first oxide layer. A portion of the second oxide layer corresponding to a sensing cavity is etched, exposing the bottom electrode. Another substrate is bonded to the second oxide layer enclosing the sensing cavity. A top electrode is disposed within the another substrate and positioned over the bottom electrode.
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公开(公告)号：US20230030211A1
公开(公告)日：2023-02-02
申请号：US17964520
申请日：2022-10-12
Applicant: InvenSense, Inc.
Inventor： Calin Miclaus , Chung-Hsien Lin , Jye Ren , Tim Piessens , Pei-Wen Yen , Manish Sharma-Kulamarva
Abstract: A device includes a housing unit with an internal volume. The device further includes a sensor coupled to a substrate via an electrical coupling, wherein the sensor is disposed within the internal volume of the housing unit, and wherein the sensor is in communication with an external environment of the housing unit from a side other than a side associated with the substrate. The device also includes a moisture detection unit electrically coupled to the sensor, wherein the moisture detection unit comprises at least two looped wires forming electrodes, and wherein the moisture detection unit is configured to detect presence of a moisture within an interior environment of the housing unit by measuring a capacitance between the electrodes and by detecting a change between the measured capacitance and a capacitance between the electrodes in absence of moisture.
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公开(公告)号：US20230035487A1
公开(公告)日：2023-02-02
申请号：US17964501
申请日：2022-10-12
Applicant: InvenSense, Inc.
Inventor： Calin Miclaus , Chung-Hsien Lin , Jye Ren , Tim Piessens , Pei-Wen Yen , Manish Sharma-Kulamarva
Abstract: A device includes a housing unit with an internal volume. The device further includes a sensor coupled to a substrate via an electrical coupling, wherein the sensor is disposed within the internal volume of the housing unit, and wherein the sensor is in communication with an external environment of the housing unit from a side other than a side associated with the substrate. The device also includes a moisture detection unit electrically coupled to the sensor, wherein the moisture detection unit comprises at least two looped wires at different heights, and wherein the moisture detection unit is configured to detect presence of a moisture within an interior environment of the housing unit when the moisture detection unit becomes in direct contact with the moisture.
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公开(公告)号：US11027967B2
公开(公告)日：2021-06-08
申请号：US16108858
申请日：2018-08-22
Applicant: InvenSense, Inc.
Inventor： Chung-Hsien Lin , Joseph Seeger , Calin Miclaus , Tsung Lin Tang , Pei-Wen Yen
Abstract: A sensor includes a substrate, an electrode, a deformable membrane, and a compensating structure. The substrate includes a first side and a second side. The first side is opposite to the second side. The substrate comprises a cavity on the first side. The electrode is positioned at a bottom of the cavity on the first side of the substrate. The deformable membrane is positioned on the first side of the substrate. The deformable membrane encloses the cavity and deforms responsive to external stimuli. The compensation structure is connected to outer periphery of the deformable membrane. The compensation structure creates a bending force that is opposite to a bending force of the deformable membrane responsive to temperature changes and thermal coefficient mismatch.
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公开(公告)号：US11006550B2
公开(公告)日：2021-05-11
申请号：US16104868
申请日：2018-08-17
Applicant: InvenSense, Inc.
Inventor： Sankalp Dayal , Vamshi Gangumalla , Zaryab Hamavand , Calin Miclaus
Abstract: A circuit board cooling system includes a circuit board with a processor disposed thereon, a cooling unit operating according to an operating configuration to generate air flow to cool a portion of the circuit board, and a plurality of pressure sensors that are coupled with a sensor processing unit and configured to measure air pressure data at their respective locations. The pressure sensors include a first pressure sensor located between the processor and the cooling unit and a second pressure sensor located such that the processor is between the second pressure sensor and the cooling unit. Air pressure data measured by the plurality of pressure sensors is obtained by the sensor processing unit. The sensor processing unit compares the obtained air pressure data to reference air pressure data for the operating configuration and, based on the comparison, determines that a disturbance to the air flow exists.
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Patent Agency Ranking
公开(公告)号：US12139398B2
公开(公告)日：2024-11-12
申请号：US17950007
申请日：2022-09-21
Applicant: InvenSense, Inc.
Inventor： Weng Shen Su , CHung-Hsien Lin , Yaoching Wang , Tsung Lin Tang , Ting-Yuan Liu , Calin Miclaus
Abstract: A method includes depositing a passivation layer on a substrate; depositing and patterning a first polysilicon layer on the passivation layer; depositing and patterning a first oxide layer on the first polysilicon layer forming a patterned first oxide layer; depositing and patterning a second polysilicon layer on the patterned first oxide layer. A portion of the second polysilicon layer directly contacts a portion of the first polysilicon layer. A portion of the patterned second polysilicon layer corresponds to a bottom electrode. A second oxide layer is deposited on the patterned second polysilicon layer and on an exposed portion of the patterned first oxide layer. A portion of the second oxide layer corresponding to a sensing cavity is etched, exposing the bottom electrode. Another substrate is bonded to the second oxide layer enclosing the sensing cavity. A top electrode is disposed within the another substrate and positioned over the bottom electrode.
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公开(公告)号：US11768122B2
公开(公告)日：2023-09-26
申请号：US17964501
申请日：2022-10-12
Applicant: InvenSense, Inc.
Inventor： Calin Miclaus , Chung-Hsien Lin , Jye Ren , Tim Piessens , Pei-Wen Yen , Manish Sharma-Kulamarva
CPC classification number: G01L19/0654 , G01L9/0041 , G01L19/0092 , G01N25/56 , G01N27/048 , G01N27/223
Abstract: A device includes a housing unit with an internal volume. The device further includes a sensor coupled to a substrate via an electrical coupling, wherein the sensor is disposed within the internal volume of the housing unit, and wherein the sensor is in communication with an external environment of the housing unit from a side other than a side associated with the substrate. The device also includes a moisture detection unit electrically coupled to the sensor, wherein the moisture detection unit comprises at least two looped wires at different heights, and wherein the moisture detection unit is configured to detect presence of a moisture within an interior environment of the housing unit when the moisture detection unit becomes in direct contact with the moisture.
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公开(公告)号：US11225409B2
公开(公告)日：2022-01-18
申请号：US16574037
申请日：2019-09-17
Applicant: InvenSense, Inc.
Inventor： Pei-Wen Yen , Ting-Yuan Liu , Jye Ren , Chung-Hsien Lin , Joseph Seeger , Calin Miclaus
IPC: B81B7/00
Abstract: A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.
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公开(公告)号：US12180067B2
公开(公告)日：2024-12-31
申请号：US17549207
申请日：2021-12-13
Applicant: InvenSense, Inc.
Inventor： Pei-Wen Yen , Ting-Yuan Liu , Jye Ren , Chung-Hsien Lin , Joseph Seeger , Calin Miclaus
IPC: B81B7/00
Abstract: A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.
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公开(公告)号：US10964613B2
公开(公告)日：2021-03-30
申请号：US16378322
申请日：2019-04-08
Applicant: InvenSense, Inc.
Inventor： Calin Miclaus
Abstract: A device includes a die comprising a sensor. The device also includes a substrate that is coupled to the die via the electrical coupling. The device further includes a packaging container. The packaging container and the substrate form a housing for the die. The packaging container comprises an opening that exposes at least a portion of the die to an environment external to the housing. The exposed surfaces of the die, interior of the housing, the electrical coupling, and the substrate to the environment external to the housing through the opening are coated with a conformal film. The conformal film prevents liquid, e.g., water, gas, etc., contact to the exposed surfaces of the die, the electrical coupling and the substrate.
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