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公开(公告)号：US20230030211A1
公开(公告)日：2023-02-02
申请号：US17964520
申请日：2022-10-12
Applicant: InvenSense, Inc.
Inventor： Calin Miclaus , Chung-Hsien Lin , Jye Ren , Tim Piessens , Pei-Wen Yen , Manish Sharma-Kulamarva
Abstract: A device includes a housing unit with an internal volume. The device further includes a sensor coupled to a substrate via an electrical coupling, wherein the sensor is disposed within the internal volume of the housing unit, and wherein the sensor is in communication with an external environment of the housing unit from a side other than a side associated with the substrate. The device also includes a moisture detection unit electrically coupled to the sensor, wherein the moisture detection unit comprises at least two looped wires forming electrodes, and wherein the moisture detection unit is configured to detect presence of a moisture within an interior environment of the housing unit by measuring a capacitance between the electrodes and by detecting a change between the measured capacitance and a capacitance between the electrodes in absence of moisture.
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公开(公告)号：US20230035487A1
公开(公告)日：2023-02-02
申请号：US17964501
申请日：2022-10-12
Applicant: InvenSense, Inc.
Inventor： Calin Miclaus , Chung-Hsien Lin , Jye Ren , Tim Piessens , Pei-Wen Yen , Manish Sharma-Kulamarva
Abstract: A device includes a housing unit with an internal volume. The device further includes a sensor coupled to a substrate via an electrical coupling, wherein the sensor is disposed within the internal volume of the housing unit, and wherein the sensor is in communication with an external environment of the housing unit from a side other than a side associated with the substrate. The device also includes a moisture detection unit electrically coupled to the sensor, wherein the moisture detection unit comprises at least two looped wires at different heights, and wherein the moisture detection unit is configured to detect presence of a moisture within an interior environment of the housing unit when the moisture detection unit becomes in direct contact with the moisture.
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公开(公告)号：US11027967B2
公开(公告)日：2021-06-08
申请号：US16108858
申请日：2018-08-22
Applicant: InvenSense, Inc.
Inventor： Chung-Hsien Lin , Joseph Seeger , Calin Miclaus , Tsung Lin Tang , Pei-Wen Yen
Abstract: A sensor includes a substrate, an electrode, a deformable membrane, and a compensating structure. The substrate includes a first side and a second side. The first side is opposite to the second side. The substrate comprises a cavity on the first side. The electrode is positioned at a bottom of the cavity on the first side of the substrate. The deformable membrane is positioned on the first side of the substrate. The deformable membrane encloses the cavity and deforms responsive to external stimuli. The compensation structure is connected to outer periphery of the deformable membrane. The compensation structure creates a bending force that is opposite to a bending force of the deformable membrane responsive to temperature changes and thermal coefficient mismatch.
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公开(公告)号：US11768122B2
公开(公告)日：2023-09-26
申请号：US17964501
申请日：2022-10-12
Applicant: InvenSense, Inc.
Inventor： Calin Miclaus , Chung-Hsien Lin , Jye Ren , Tim Piessens , Pei-Wen Yen , Manish Sharma-Kulamarva
CPC classification number: G01L19/0654 , G01L9/0041 , G01L19/0092 , G01N25/56 , G01N27/048 , G01N27/223
Abstract: A device includes a housing unit with an internal volume. The device further includes a sensor coupled to a substrate via an electrical coupling, wherein the sensor is disposed within the internal volume of the housing unit, and wherein the sensor is in communication with an external environment of the housing unit from a side other than a side associated with the substrate. The device also includes a moisture detection unit electrically coupled to the sensor, wherein the moisture detection unit comprises at least two looped wires at different heights, and wherein the moisture detection unit is configured to detect presence of a moisture within an interior environment of the housing unit when the moisture detection unit becomes in direct contact with the moisture.
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公开(公告)号：US11326972B2
公开(公告)日：2022-05-10
申请号：US16875918
申请日：2020-05-15
Applicant: InvenSense, Inc.
Inventor： Pei-Wen Yen , Yu-Tao Lee , Chung-Hsien Lin
Abstract: A sensor includes a substrate, an oxide layer, a membrane, an electrode, and a trench. The oxide layer is disposed on the substrate. The membrane is positioned on the oxide layer. The membrane with the oxide layer and the substrate forms an enclosed cavity therein. The membrane comprises a rigid portion and a deformable portion wherein the deformable portion of the membrane deforms responsive to stimuli. The oxide layer forms side walls of the cavity. The electrode is positioned on the substrate and within the cavity. The trench is formed in the oxide layer, and wherein the trench is covered with barrier material.
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Patent Agency Ranking
公开(公告)号：US11225409B2
公开(公告)日：2022-01-18
申请号：US16574037
申请日：2019-09-17
Applicant: InvenSense, Inc.
Inventor： Pei-Wen Yen , Ting-Yuan Liu , Jye Ren , Chung-Hsien Lin , Joseph Seeger , Calin Miclaus
IPC: B81B7/00
Abstract: A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.
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公开(公告)号：US12180067B2
公开(公告)日：2024-12-31
申请号：US17549207
申请日：2021-12-13
Applicant: InvenSense, Inc.
Inventor： Pei-Wen Yen , Ting-Yuan Liu , Jye Ren , Chung-Hsien Lin , Joseph Seeger , Calin Miclaus
IPC: B81B7/00
Abstract: A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.
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公开(公告)号：US11499884B2
公开(公告)日：2022-11-15
申请号：US16518879
申请日：2019-07-22
Applicant: InvenSense, Inc.
Inventor： Calin Miclaus , Chung-Hsien Lin , Jye Ren , Tim Piessens , Pei-Wen Yen , Manish Sharma-Kulamarva
Abstract: A device includes a sensor die, an electrical coupling, a substrate, a liquid detection unit, and a housing unit. The sensor die is coupled to the substrate via the electrical coupling. The liquid detection unit electrically is coupled to the sensor die. The housing unit and the substrate are configured to house the sensor die, the liquid detection unit, and the electrical coupling. The housing unit comprises an opening that exposes the sensor die to an environment external to the housing unit. The liquid detection unit detects presence of liquid within an interior environment of the housing unit. In some embodiments, the device further includes a gel filled within the interior environment of the housing unit covering the sensor die and the substrate. The gel, e.g., silicone, fluoro silicone, etc., is configured to protect the sensor die, the electrical coupling, and the substrate from exposure to the liquid.
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公开(公告)号：US20220098030A1
公开(公告)日：2022-03-31
申请号：US17549207
申请日：2021-12-13
Applicant: InvenSense, Inc.
Inventor： Pei-Wen Yen , Ting-Yuan Liu , Jye Ren , Chung-Hsien Lin , Joseph Seeger , Calin Miclaus
IPC: B81B7/00
Abstract: A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.
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公开(公告)号：US20200087142A1
公开(公告)日：2020-03-19
申请号：US16574037
申请日：2019-09-17
Applicant: InvenSense, Inc.
Inventor： Pei-Wen Yen , Ting-Yuan Liu , Jye Ren , Chung-Hsien Lin , Joseph Seeger , Calin Miclaus
IPC: B81B7/00
Abstract: A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.
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