公开(公告)号：US4155650A

公开(公告)日：1979-05-22

申请号：US728971

申请日：1976-10-04

申请人： Itaru Yasue ,  Etsuji Suzuki

发明人： Itaru Yasue ,  Etsuji Suzuki

IPC分类号： G05D3/12 ,  G01B11/02 ,  H01L21/60 ,  H01L21/68 ,  G01B11/00 ,  G01B11/26

CPC分类号： H01L24/85 ,  G01B11/024 ,  H01L21/681 ,  H01L24/78 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01056 ,  H01L2924/01082 ,  H01L2924/12043 ,  H01L2924/14

摘要： A system comprising a detector for detecting a shift of a optical pattern formed on a semiconductor pellet at a distance from the datum point set on both sides of the pattern and giving a signal indicative of said shift, and a bonding device for wire-bonding said pellet with the shift compensated which has been shifted correspondingly to the shift of the pellet.

摘要翻译： 一种系统，包括检测器，用于检测形成在半导体芯片上的距离设置在图案两侧的基准点的距离的偏移并给出指示所述偏移的信号;以及接合装置，用于引线接合所述 具有偏移补偿的颗粒随着颗粒的移动而相应地移动。

公开(公告)号：US4200393A

公开(公告)日：1980-04-29

申请号：US804441

申请日：1977-06-07

申请人： Etsuji Suzuki ,  Itaru Yasue ,  Tomio Kashihama

发明人： Etsuji Suzuki ,  Itaru Yasue ,  Tomio Kashihama

IPC分类号： H01L21/68 ,  G01N21/32 ,  G01B11/26

CPC分类号： H01L21/681

摘要： According to the present method of positioning a semiconductor member by examining it, an optical image of the semiconductor member is focussed on a photoelectric conversion face formed by having a plurality of photoelectric conversion elements arranged thereon in the form of a matrix. By means of the photoelectric conversion elements spotlighted by said optical image, the distributions of the spotlighted elements and the remaining non-spotlighted elements are examined through scanning operation. By using the examination results, a table having said semiconductor members loaded thereon is so moved as to permit one of them to fall under the photoelectric conversion face, thereby to inspect for positioning examination of the semiconductor member the presence or absence of a defect-indicating mark affixed thereto and examine the qualification or non-qualification of the member in terms of outer dimension, in terms of the position taken after moved, and in terms of whether or not the semiconductor member can be subjected to correction of the position, or is damaged, or is cracked, or is stained or is partially oversized. Thus, according to the present method, only each qualified one of the semiconductor members can be positioned precisely in a prescribed position, and a die bonding apparatus of the invention is based on the using of the above method for purpose of positioning the semiconductor member by examining it.

摘要翻译： 根据本发明的通过检查半导体构件的方法，将半导体构件的光学图像聚焦在通过以矩阵形式布置在其上的多个光电转换元件形成的光电转换面上。 通过由所述光学图像聚光的光电转换元件，通过扫描操作来检查聚光元件和剩余的非聚光元件的分布。 通过使用检查结果，将具有装载在其上的半导体部件的工作台移动以允许其中的一个落在光电转换面下方，从而检查半导体部件的定位检查是否存在缺陷指示 标记，并根据外观尺寸，移动后的位置，以及半导体构件是否可以对位置进行修正来检查构件的资质或非资格，或者是 损坏或破裂，或被染色或部分超大。 因此，根据本方法，只有每个合格的一个半导体部件能够精确地定位在规定位置，本发明的芯片接合装置基于上述方法的使用，以便通过以下方式定位半导体部件 检查它