公开(公告)号：US5950306A

公开(公告)日：1999-09-14

申请号：US763953

申请日：1996-12-11

申请人： Etsuji Suzuki ,  Akira Yonezawa ,  Hidehisa Yamazaki

发明人： Etsuji Suzuki ,  Akira Yonezawa ,  Hidehisa Yamazaki

IPC分类号： H05K1/11 ,  H05K1/14 ,  H05K3/18 ,  H05K3/34 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H05K3/36

CPC分类号： H05K3/462 ,  H05K3/423 ,  H05K2201/0355 ,  H05K2203/0733 ,  H05K2203/1189 ,  H05K3/3484 ,  H05K3/4038 ,  H05K3/4069 ,  H05K3/4623 ,  H05K3/4647 ,  H05K3/4652 ,  Y10T29/49126 ,  Y10T29/49158 ,  Y10T29/49165

摘要： A circuit board includes a wiring board which includes an insulative board having a wiring pattern on one surface thereof, a connection hole being formed in the insulative board such that the connection hole reaches the wiring pattern, a conductive bump, which is formed by growing a plating on the wiring pattern, being embedded in the connection hole, and the conductive bump serves as a connection to a wiring pattern which is intimately attached to the other surface of the insulative board.

摘要翻译： 电路板包括布线板，该布线板包括在其一个表面上具有布线图形的绝缘板，连接孔形成在绝缘板上，使得连接孔到达布线图案，导电凸块通过生长形成 布线图案上的电镀被嵌入连接孔中，并且导电凸起用作与紧密连接在绝缘板的另一个表面上的布线图案的连接。

公开(公告)号：US4516673A

公开(公告)日：1985-05-14

申请号：US426754

申请日：1982-09-29

申请人： Tomio Kashihara ,  Toshiro Tsuruta ,  Masayoshi Yamaguchi ,  Kiyotachi Yokoi ,  Etsuji Suzuki

发明人： Tomio Kashihara ,  Toshiro Tsuruta ,  Masayoshi Yamaguchi ,  Kiyotachi Yokoi ,  Etsuji Suzuki

IPC分类号： H01L21/50 ,  H01L21/677 ,  B65G43/00

CPC分类号： H01L21/67706 ,  H01L21/50 ,  H01L21/67721 ,  Y10T29/49121 ,  Y10T29/53261

摘要： An apparatus for conveying a lead frame mounting semiconductor pellets comprises a guide path for guiding the lead frame, and a feed member. The feed member is moved by a solenoid mechanism from a first position where the feed member is separated from the lead frame to a second position where the feed member engages with the lead frame. The feed member positioned in the second position is moved by a X-Y table from an initial position to a forward position along the guide path, whereby the lead frame is conveyed along the guide path by a predetermined distance.

摘要翻译： 用于输送引线框安装半导体芯片的装置包括用于引导引线框架的引导路径和馈送构件。 进给构件通过螺线管机构从第一位置移动，其中进给构件从引导框架分离到第二位置，在该位置，进给构件与引线框架接合。 定位在第二位置的进给构件通过X-Y工作台沿着引导路径从初始位置移动到前进位置，由此引导框架沿着引导路径传送预定距离。

公开(公告)号：US06392530B1

公开(公告)日：2002-05-21

申请号：US09866711

申请日：2001-05-30

申请人： Etsuji Suzuki

发明人： Etsuji Suzuki

IPC分类号： H01L101

摘要： A plurality of protective resistors can be easily inserted between circuit forming elements, and opposite ends of each protective resistor can be properly press-contacted to each circuit forming element. The protective resistor can be easily replaced when broken. A resistor array board comprises a porous plate having a plurality of through-holes arranged in array and opening at opposite surfaces thereof; and a plurality of protective resistors removably loosely inserted into the through-holes, respectively. Each of the protective resistors are resiliently retained by an electrically conductive spring element, and opposite ends of each of the protective resistors are press-contacted with the circuit forming elements which are arranged in opposing relation on surfaces of the porous plates.

公开(公告)号：US4155650A

公开(公告)日：1979-05-22

申请号：US728971

申请日：1976-10-04

申请人： Itaru Yasue ,  Etsuji Suzuki

发明人： Itaru Yasue ,  Etsuji Suzuki

IPC分类号： G05D3/12 ,  G01B11/02 ,  H01L21/60 ,  H01L21/68 ,  G01B11/00 ,  G01B11/26

CPC分类号： H01L24/85 ,  G01B11/024 ,  H01L21/681 ,  H01L24/78 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01056 ,  H01L2924/01082 ,  H01L2924/12043 ,  H01L2924/14

摘要： A system comprising a detector for detecting a shift of a optical pattern formed on a semiconductor pellet at a distance from the datum point set on both sides of the pattern and giving a signal indicative of said shift, and a bonding device for wire-bonding said pellet with the shift compensated which has been shifted correspondingly to the shift of the pellet.

摘要翻译： 一种系统，包括检测器，用于检测形成在半导体芯片上的距离设置在图案两侧的基准点的距离的偏移并给出指示所述偏移的信号;以及接合装置，用于引线接合所述 具有偏移补偿的颗粒随着颗粒的移动而相应地移动。

公开(公告)号：US5973395A

公开(公告)日：1999-10-26

申请号：US848585

申请日：1997-04-29

申请人： Etsuji Suzuki ,  Akira Yonezawa ,  Hidehisa Yamazaki ,  Hiroshi Odaira

发明人： Etsuji Suzuki ,  Akira Yonezawa ,  Hidehisa Yamazaki ,  Hiroshi Odaira

IPC分类号： H01L21/60 ,  H01L23/12 ,  H01L23/28 ,  H01L23/31 ,  H01L23/36 ,  H01L23/498 ,  H01L23/48 ,  H01L23/52

CPC分类号： H01L23/4985 ,  H01L23/3128 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181

摘要： An IC package is provided that has a flexible wiring sheet, including an upper portion, a lower portion and a side portion which is wound around a base member over an upper surface, side surfaces and a lower surface of the base member. An IC is loaded on an upper surface of the upper flexible wiring sheet covering the upper surface of the base member. The IC is connected to an electrode provided on an upper lead pattern portion laid along the upper surface of the flexible wiring sheet. The lead pattern is extended from the upper flexible wiring sheet to the lower flexible wiring sheet via the side surfaces of the flexible wiring sheet covering side surfaces of the base member. An electrode to be connected with an object is arranged on the lower lead pattern portion which is formed on the lower flexible wiring sheet, and overall the IC or an IC connection portion is sealed on the upper surface of the upper flexible wiring sheet.

摘要翻译： 提供了一种IC封装，其具有柔性布线片，该布线片包括上部，下部和在基底部件的上表面，侧表面和下表面上缠绕在基底构件上的侧部。 IC被装载在覆盖基材的上表面的上柔性布线板的上表面上。 IC连接到设置在沿着柔性布线板的上表面放置的上引线图案部分上的电极。 引线图案通过覆盖基材的侧表面的柔性布线板的侧表面从上柔性布线片延伸到下柔性布线片。 与物体连接的电极被布置在形成在下柔性布线板上的下引线图案部分上，并且IC或IC连接部分整体被密封在上柔性布线片的上表面上。

公开(公告)号：US4601577A

公开(公告)日：1986-07-22

申请号：US534119

申请日：1983-09-20

申请人： Yukihiro Gotou ,  Etsuji Suzuki

发明人： Yukihiro Gotou ,  Etsuji Suzuki

IPC分类号： G01N21/956 ,  G01N21/47

CPC分类号： G01N21/956

摘要： A method and apparatus for detecting defects in a pattern are disclosed. The defect detecting method is comprised of a step of dark-field illuminating a patterned object with a directionality and a step for detecting only the defect component by erasing the pattern component in a pattern image formed by the dark-field illumination. The apparatus comprises an illuminating device for dark-field illuminating a patterned object with parallel rays, an image pick-up device for picking up a pattern image, which is disposed just above the pattern, and a data processing circuit for processing the picked up image signal to detect a defect.

摘要翻译： 公开了一种用于检测图案中的缺陷的方法和装置。 缺陷检测方法包括：通过消除由暗场照明形成的图案图像中的图案分量来仅仅检测缺陷分量的方向性和步骤的暗场照射图案化物体的步骤。 该装置包括用于以平行光线对图案化物体进行暗场照明的照明装置，用于拾取图案的正上方的图案图像的图像拾取装置，以及用于处理拾取图像的数据处理电路 信号来检测缺陷。

公开(公告)号：US4473842A

公开(公告)日：1984-09-25

申请号：US393653

申请日：1982-06-30

申请人： Etsuji Suzuki ,  Shinichi Uno ,  Kiyomu Chiyoda ,  Mitsugi Nakanoya

发明人： Etsuji Suzuki ,  Shinichi Uno ,  Kiyomu Chiyoda ,  Mitsugi Nakanoya

IPC分类号： G01N21/956 ,  H04N7/18

CPC分类号： G01N21/95607 ,  Y10T29/4913

摘要： Image data of lead terminals and a chip element provided on a circuit board are stored on a video memory. Part of the video data stored in the video memory is read out and stored in a RAM by a microprocessor to be compared with reference pattern data stored in an external memory. The position of the chip element is checked in this way by having reference to the lead terminals.

摘要翻译： 引线端子和设置在电路板上的芯片元件的图像数据被存储在视频存储器中。 存储在视频存储器中的视频数据的一部分被微处理器读出并存储在RAM中，以与存储在外部存储器中的参考图形数据进行比较。 通过参考引线端子，以这种方式检查芯片元件的位置。

公开(公告)号：US4200393A

公开(公告)日：1980-04-29

申请号：US804441

申请日：1977-06-07

申请人： Etsuji Suzuki ,  Itaru Yasue ,  Tomio Kashihama

发明人： Etsuji Suzuki ,  Itaru Yasue ,  Tomio Kashihama

IPC分类号： H01L21/68 ,  G01N21/32 ,  G01B11/26

CPC分类号： H01L21/681

摘要： According to the present method of positioning a semiconductor member by examining it, an optical image of the semiconductor member is focussed on a photoelectric conversion face formed by having a plurality of photoelectric conversion elements arranged thereon in the form of a matrix. By means of the photoelectric conversion elements spotlighted by said optical image, the distributions of the spotlighted elements and the remaining non-spotlighted elements are examined through scanning operation. By using the examination results, a table having said semiconductor members loaded thereon is so moved as to permit one of them to fall under the photoelectric conversion face, thereby to inspect for positioning examination of the semiconductor member the presence or absence of a defect-indicating mark affixed thereto and examine the qualification or non-qualification of the member in terms of outer dimension, in terms of the position taken after moved, and in terms of whether or not the semiconductor member can be subjected to correction of the position, or is damaged, or is cracked, or is stained or is partially oversized. Thus, according to the present method, only each qualified one of the semiconductor members can be positioned precisely in a prescribed position, and a die bonding apparatus of the invention is based on the using of the above method for purpose of positioning the semiconductor member by examining it.

摘要翻译： 根据本发明的通过检查半导体构件的方法，将半导体构件的光学图像聚焦在通过以矩阵形式布置在其上的多个光电转换元件形成的光电转换面上。 通过由所述光学图像聚光的光电转换元件，通过扫描操作来检查聚光元件和剩余的非聚光元件的分布。 通过使用检查结果，将具有装载在其上的半导体部件的工作台移动以允许其中的一个落在光电转换面下方，从而检查半导体部件的定位检查是否存在缺陷指示 标记，并根据外观尺寸，移动后的位置，以及半导体构件是否可以对位置进行修正来检查构件的资质或非资格，或者是 损坏或破裂，或被染色或部分超大。 因此，根据本方法，只有每个合格的一个半导体部件能够精确地定位在规定位置，本发明的芯片接合装置基于上述方法的使用，以便通过以下方式定位半导体部件 检查它

公开(公告)号：US06398561B1

公开(公告)日：2002-06-04

申请号：US09902262

申请日：2001-07-11

申请人： Toshio Okuno ,  Etsuji Suzuki

发明人： Toshio Okuno ,  Etsuji Suzuki

IPC分类号： H01R1200

CPC分类号： G01R1/06755 ,  G01R1/0735 ,  G01R3/00 ,  H05K3/205 ,  H05K3/4007 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09509 ,  H05K2203/0113 ,  H05K2203/0338 ,  Y10T29/49128

摘要： A contact structure of a lead in which a contact structure having a lead and a bump made of suitable metals, respectively, can be formed easily and the bump and the lead can be soundly connected together in terms of electricity and strength. The contact structure of the lead comprises a lead 12 formed by etching a conductive foil 11, and a bump 5 formed by electric casting by means of plating. The bump 5 and the lead 12 are formed of different metals, respectively, and the bump 5 is connected to a surface of the lead 12 through a conductive connecting material 10. The lead 12 is intimately contacted at a surface, on which the bump 5 is disposed, with a first main surface 15 of a holeless insulative sheet 8. A basal portion of the bump 5 is forcibly pierced into and extended all the way through the thickness of a material of the holeless insulative sheet 8 and a side surface of the basal portion of the bump 5 is fusion-adhered to an inner wall surface of the through-hole 17. A distal portion of the bump 5 is projected from a second main surface 16 of the insulative sheet 8.

摘要翻译： 引线的接触结构可以容易地形成具有引线和由合适金属制成的凸块的接触结构，并且凸起和引线可以在电力和强度方面牢固地连接在一起。 引线的接触结构包括通过蚀刻导电箔11形成的引线12和通过电镀的电铸形成的凸块5。 凸块5和引线12分别由不同的金属形成，并且凸块5通过导电连接材料10连接到引线12的表面。引线12在表面处紧密接触，凸块5 配置有无孔绝缘片8的第一主表面15.凸块5的基部被强制地穿透并延伸穿过无孔绝缘片8的材料的厚度，并且 凸块5的基部熔合粘附到通孔17的内壁表面。凸块5的远端部分从绝缘片8的第二主表面16突出。

公开(公告)号：US06351885B2

公开(公告)日：2002-03-05

申请号：US09079857

申请日：1998-05-15

申请人： Etsuji Suzuki ,  Akira Yonezawa ,  Toshio Okuno

发明人： Etsuji Suzuki ,  Akira Yonezawa ,  Toshio Okuno

IPC分类号： H05K302

CPC分类号： H01R12/57 ,  H01L21/4853 ,  H01L23/13 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15173 ,  H05K1/0284 ,  H05K3/025 ,  H05K3/205 ,  H05K3/4007 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/09045 ,  H05K2203/0113 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49208 ,  H01L2224/05599

摘要： A wiring board structure has an insulating base having at least one projection located thereon, wherein the insulating base and the at least one projection are integrally formed from a same piece of insulating material. The wiring board structure also has at least one lead located on the insulating base, wherein a part of the at least one lead covers the at least one projection to form at least one conductive bump.

摘要翻译： 布线板结构具有绝缘基底，其上具有位于其上的至少一个突起，其中所述绝缘基底和所述至少一个突出部由相同的绝缘材料构成。 所述布线板结构还具有位于所述绝缘基底上的至少一个引线，其中所述至少一个引线的一部分覆盖所述至少一个突起以形成至少一个导电凸块。