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    DIAMOND BONDED CONSTRUCTION WITH THERMALLY STABLE REGION
    8.
    发明申请
    DIAMOND BONDED CONSTRUCTION WITH THERMALLY STABLE REGION 有权
    金刚石结构与热稳定区域

    公开(公告)号：US20100084197A1

    公开(公告)日：2010-04-08

    申请号：US12245582

    申请日：2008-10-03

    申请人： Georgiy Voronin ,  J. Daniel Belnap ,  Feng Yu ,  Benjamin Randall

    发明人： Georgiy Voronin ,  J. Daniel Belnap ,  Feng Yu ,  Benjamin Randall

    IPC分类号： E21B10/46 ,  B24D3/02

    CPC分类号： E21B10/567 ,  B22F7/062 ,  B22F2003/244 ,  B22F2005/001 ,  B22F2998/10 ,  B24D3/10 ,  C22C26/00 ,  C22C2204/00 ,  E21B10/46 ,  E21B10/5673 ,  E21B10/5676 ,  B22F3/24 ,  B22F3/26

    摘要： Diamond bonded constructions comprise a polycrystalline diamond body having a matrix phase of bonded-together diamond grains and a plurality of interstitial regions between the diamond grains including a catalyst material used to form the diamond body disposed within the interstitial regions. A sintered thermally stable diamond element is disposed within and bonded to the diamond body, and is configured and positioned to form part of a working surface. The thermally stable diamond element is bonded to the polycrystalline diamond body, and a substrate is bonded to the polycrystalline diamond body. The thermally stable diamond element comprises a plurality of bonded-together diamond grains and interstitial regions, wherein the interstitial regions are substantially free of a catalyst material used to make or sinter the thermally stable diamond element. A barrier material may be disposed over or infiltrated into one or more surfaces of the thermally stable diamond element.

    摘要翻译： 金刚石结合结构包括具有结合金刚石晶粒的基体相和金刚石晶粒之间的多个间隙区域的多晶金刚石体，包括用于形成设置在间隙区域内的金刚石体的催化剂材料。 烧结的热稳定金刚石元件设置在金刚石体内并结合到金刚石体上，并被构造和定位以形成工作表面的一部分。 热稳定金刚石元件结合到多晶金刚石体上，并且将基底结合到多晶金刚石体。 热稳定金刚石元件包括多个接合在一起的金刚石晶粒和间隙区域，其中间隙区域基本上不含用于制造或烧结热稳定金刚石元件的催化剂材料。 阻挡材料可以设置在热稳定金刚石元件的一个或多个表面上或者渗入其中。

    Diamond bonded construction with thermally stable region
    9.
    发明授权
    Diamond bonded construction with thermally stable region 有权
    具有热稳定区域的金刚石粘结结构

    公开(公告)号：US08083012B2

    公开(公告)日：2011-12-27

    申请号：US12245582

    申请日：2008-10-03

    申请人： Georgiy Voronin ,  J. Daniel Belnap ,  Feng Yu ,  Benjamin Randall

    发明人： Georgiy Voronin ,  J. Daniel Belnap ,  Feng Yu ,  Benjamin Randall

    IPC分类号： E21B10/46

    CPC分类号： E21B10/567 ,  B22F7/062 ,  B22F2003/244 ,  B22F2005/001 ,  B22F2998/10 ,  B24D3/10 ,  C22C26/00 ,  C22C2204/00 ,  E21B10/46 ,  E21B10/5673 ,  E21B10/5676 ,  B22F3/24 ,  B22F3/26

    摘要： Diamond bonded constructions comprise a polycrystalline diamond body having a matrix phase of bonded-together diamond grains and a plurality of interstitial regions between the diamond grains including a catalyst material used to form the diamond body disposed within the interstitial regions. A sintered thermally stable diamond element is disposed within and bonded to the diamond body, and is configured and positioned to form part of a working surface. The thermally stable diamond element is bonded to the polycrystalline diamond body, and a substrate is bonded to the polycrystalline diamond body. The thermally stable diamond element comprises a plurality of bonded-together diamond grains and interstitial regions, wherein the interstitial regions are substantially free of a catalyst material used to make or sinter the thermally stable diamond element. A barrier material may be disposed over or infiltrated into one or more surfaces of the thermally stable diamond element.

    摘要翻译： 金刚石结合结构包括具有结合金刚石晶粒的基体相和金刚石晶粒之间的多个间隙区域的多晶金刚石体，包括用于形成设置在间隙区域内的金刚石体的催化剂材料。 烧结的热稳定金刚石元件设置在金刚石体内并结合到金刚石体上，并被构造和定位以形成工作表面的一部分。 热稳定金刚石元件结合到多晶金刚石体上，并且将基底结合到多晶金刚石体。 热稳定金刚石元件包括多个接合在一起的金刚石晶粒和间隙区域，其中间隙区域基本上不含用于制造或烧结热稳定金刚石元件的催化剂材料。 阻挡材料可以设置在热稳定金刚石元件的一个或多个表面上或者渗入其中。

    Polycrystalline diamond constructions having optimized material composition
    10.
    发明授权
    Polycrystalline diamond constructions having optimized material composition 有权
    具有优化材料成分的多晶金刚石结构

    公开(公告)号：US08689912B2

    公开(公告)日：2014-04-08

    申请号：US12954403

    申请日：2010-11-24

    申请人： J. Daniel Belnap ,  Georgiy Voronin ,  Feng Yu ,  Peter Cariveau

    发明人： J. Daniel Belnap ,  Georgiy Voronin ,  Feng Yu ,  Peter Cariveau

    IPC分类号： E21B10/36

    CPC分类号： B24D18/0009 ,  B22F3/15 ,  B22F2005/001 ,  B24D3/10 ,  C22C26/00 ,  C22C2026/005 ,  C22C2026/006 ,  C22C2026/007 ,  C22C2026/008 ,  C22C2204/00 ,  E21B10/567 ,  Y10T428/249954 ,  Y10T428/249961 ,  Y10T428/30

    摘要： Diamond bonded constructions include a diamond body comprising intercrystalline bonded diamond and interstitial regions. The body has a working surface and an interface surface, and may be joined to a metallic substrate. The body has a gradient diamond volume content greater about 1.5 percent, wherein the diamond content at the interface surface is less than 94 percent, and increases moving toward the working surface. The body may include a region that is substantially free of a catalyst material otherwise disposed within the body and present in a gradient amount. An additional material may be included within the body and be present in a changing amount. The body may be formed by high-pressure HPHT processing, e.g., from 6,200 MPa to 10,000 MPa, to produce a sintered body having a characteristic diamond volume fraction v. average grain size relationship distinguishable from that of diamond bonded constructions form by conventional-pressure HPHT processing.

    摘要翻译： 金刚石粘合结构包括包含晶间结合金刚石和间隙区域的金刚石体。 主体具有工作表面和界面，并且可以连接到金属基底。 身体具有大约1.5％的梯度金刚石体积含量，其中界面处的金刚石含量小于94％，并且增加朝着工作表面移动。 身体可以包括基本上不含催化剂材料的区域，否则其中设置在体内并以梯度量存在。 另外的材料可以包括在体内并以不断变化的量存在。 主体可以通过高压HPHT加工形成，例如从6,200MPa到10,000MPa，以产生具有特征金刚石体积分数v与常规压力形式的金刚石结合结构区别的平均晶粒尺寸关系的烧结体 HPHT加工。