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    Interwoven wire mesh microcavity plasma arrays
    1.
    发明授权
    Interwoven wire mesh microcavity plasma arrays 有权
    交织丝网微腔等离子体阵列

    公开(公告)号：US08362699B2

    公开(公告)日：2013-01-29

    申请号：US12682973

    申请日：2008-10-27

    申请人： J. Gary Eden ,  Sung-Jin Park ,  Andrew J. Price ,  Jason D. Readle ,  Clark J. Wagner

    发明人： J. Gary Eden ,  Sung-Jin Park ,  Andrew J. Price ,  Jason D. Readle ,  Clark J. Wagner

    IPC分类号： H01J17/49 ,  H01J9/00

    CPC分类号： H01J17/49 ,  H01J61/06 ,  H01J61/305 ,  H01J61/52 ,  H01J61/82

    摘要： Embodiments of the invention provide for large arrays of microcavity plasma devices that can be made inexpensively, and can produce large area but thin displays or lighting sources Interwoven metal wire mesh, such as interwoven Al mesh, consists of two sets of wires which are interwoven in such a way that the two wire sets cross each other, typically at πght angles (90 degrees) although other patterns are also available Fabrication is accomplished with a simple and inexpensive wet chemical etching process The wires in each set are spaced from one another such that the finished mesh forms an array of openings that can be, for example, square, rectangular or diamond-shaped The size of the openings or microcavities is a function of the diameter of the wires in the mesh and the spacing between the wires in the mesh used to form the array of microcavity plasma devices.

    摘要翻译： 本发明的实施例提供了可以廉价制造并且可以生产大面积但薄的显示器或照明源的微腔等离子体装置的大阵列。交织的金属丝网如交织的Al网由两组电线组成， 尽管其他图案也是可用的，这两种线组彼此交叉的方式，通常是直角（90度）通过简单和便宜的湿式化学蚀刻工艺完成。每组中的导线彼此间隔开，使得 完成的网格形成可以是例如正方形，矩形或菱形的开口阵列。开口或微腔的尺寸是网中线的直径和网中线之间的间距的函数 用于形成微腔等离子体装置阵列。

    INTERWOVEN WIRE MESH MICROCAVITY PLASMA ARRAYS
    2.
    发明申请
    INTERWOVEN WIRE MESH MICROCAVITY PLASMA ARRAYS 有权
    INTERWOVEN网线微波等离子体阵列

    公开(公告)号：US20110260609A1

    公开(公告)日：2011-10-27

    申请号：US12682973

    申请日：2008-10-27

    申请人： J. Gary Eden ,  Sung-Jin Park ,  Andrew J. Price ,  Jason D. Readle ,  Clark J. Wagner

    发明人： J. Gary Eden ,  Sung-Jin Park ,  Andrew J. Price ,  Jason D. Readle ,  Clark J. Wagner

    IPC分类号： H01J17/49 ,  C23C28/04 ,  B65B63/08 ,  C25D11/02

    CPC分类号： H01J17/49 ,  H01J61/06 ,  H01J61/305 ,  H01J61/52 ,  H01J61/82

    摘要： Embodiments of the invention provide for large arrays of microcavity plasma devices that can be made inexpensively, and can produce large area but thin displays or lighting sources Interwoven metal wire mesh, such as interwoven Al mesh, consists of two sets of wires which are interwoven in such a way that the two wire sets cross each other, typically at πght angles (90 degrees) although other patterns are also available Fabrication is accomplished with a simple and inexpensive wet chemical etching process The wires in each set are spaced from one another such that the finished mesh forms an array of openings that can be, for example, square, rectangular or diamond-shaped The size of the openings or microcavities is a function of the diameter of the wires in the mesh and the spacing between the wires in the mesh used to form the array of microcavity plasma devices.

    摘要翻译： 本发明的实施例提供了可以廉价制造并且可以生产大面积但薄的显示器或照明源的微腔等离子体装置的大阵列。交织的金属丝网如交织的Al网由两组电线组成， 尽管其他图案也是可用的，这两种线组彼此交叉的方式，通常是直角（90度）通过简单和便宜的湿式化学蚀刻工艺完成。每组中的导线彼此间隔开，使得 完成的网格形成可以是例如正方形，矩形或菱形的开口阵列。开口或微腔的尺寸是网中线的直径和网中线之间的间距的函数 用于形成微腔等离子体装置阵列。

    Variable electric field strength metal and metal oxide microplasma lamps and fabrication
    3.
    发明授权
    Variable electric field strength metal and metal oxide microplasma lamps and fabrication 有权
    可变电场强度金属和金属氧化物微米灯和制造

    公开(公告)号：US08541946B2

    公开(公告)日：2013-09-24

    申请号：US12640884

    申请日：2009-12-17

    申请人： J. Gary Eden ,  Sung-Jin Park ,  Jason D. Readle ,  Jekwon Yoon ,  Andrew Price ,  Jeffrey Putney

    发明人： J. Gary Eden ,  Sung-Jin Park ,  Jason D. Readle ,  Jekwon Yoon ,  Andrew Price ,  Jeffrey Putney

    IPC分类号： H01J17/04

    CPC分类号： H01J17/49 ,  H01J17/16 ,  H01J65/046

    摘要： Preferred embodiments of the invention provide microcavity plasma lamps having a plurality of metal and metal oxide layers defining a plurality of arrays of microcavities and encapsulated thin metal electrodes. Packaging encloses the plurality of metal and metal oxide layers in plasma medium. The metal and metal oxide layers are configured and arranged to vary the electric field strength and total gas pressure (E/p) in the lamp. The invention also provides methods of manufacturing a microcavity plasma lamp that simultaneously evacuate the volume within the packaging and a volume surrounding the packaging to maintain an insignificant or zero pressure differential across the packaging. The packaging is backfilled with a plasma medium while also maintaining an insignificant or zero pressure differential across the packaging.

    摘要翻译： 本发明的优选实施例提供了具有限定多个微腔阵列和封装的薄金属电极的多个金属和金属氧化物层的微腔等离子体灯。 包装在等离子体介质中包围多个金属和金属氧化物层。 金属和金属氧化物层被配置和布置成改变灯中的电场强度和总气体压力（E / p）。 本发明还提供了制造微腔等离子体灯的方法，其同时抽空包装内的体积和围绕包装的体积，以保持整个包装上的微不足道或零压差。 包装用等离子体介质回填，同时在整个包装上保持不显着或零压差。

    VARIABLE ELECTRIC FIELD STRENGTH METAL AND METAL OXIDE MICROPLASMA LAMPS AND FABRICATION
    4.
    发明申请
    VARIABLE ELECTRIC FIELD STRENGTH METAL AND METAL OXIDE MICROPLASMA LAMPS AND FABRICATION 有权
    可变电场强度金属和金属氧化物微波炉和制造

    公开(公告)号：US20110148282A1

    公开(公告)日：2011-06-23

    申请号：US12640884

    申请日：2009-12-17

    申请人： J. Gary Eden ,  Sung-Jin Park ,  Jason D. Readle ,  Jekwon Yoon ,  Andrew Price ,  Jeffrey Putney

    发明人： J. Gary Eden ,  Sung-Jin Park ,  Jason D. Readle ,  Jekwon Yoon ,  Andrew Price ,  Jeffrey Putney

    IPC分类号： H01J61/30 ,  H01J61/42 ,  H01J9/38

    CPC分类号： H01J17/49 ,  H01J17/16 ,  H01J65/046

    摘要： Preferred embodiments of the invention provide microcavity plasma lamps having a plurality of metal and metal oxide layers defining a plurality of arrays of microcavities and encapsulated thin metal electrodes. Packaging encloses the plurality of metal and metal oxide layers in plasma medium. The metal and metal oxide layers are configured and arranged to vary the electric field strength and total gas pressure (E/p) in the lamp. The invention also provides methods of manufacturing a microcavity plasma lamp that simultaneously evacuate the volume within the packaging and a volume surrounding the packaging to maintain an insignificant or zero pressure differential across the packaging. The packaging is backfilled with a plasma medium while also maintaining an insignificant or zero pressure differential across the packaging.

    摘要翻译： 本发明的优选实施例提供了具有限定多个微腔阵列和封装的薄金属电极的多个金属和金属氧化物层的微腔等离子体灯。 包装在等离子体介质中包围多个金属和金属氧化物层。 金属和金属氧化物层被配置和布置成改变灯中的电场强度和总气体压力（E / p）。 本发明还提供了制造微腔等离子体灯的方法，其同时抽空包装内的体积和围绕包装的体积，以保持整个包装上的微不足道或零压差。 包装用等离子体介质回填，同时在整个包装上保持不显着或零压差。

    Method of making arrays of thin sheet microdischarge devices
    5.
    发明授权
    Method of making arrays of thin sheet microdischarge devices 有权
    制备薄片微放电器件阵列的方法

    公开(公告)号：US08221179B2

    公开(公告)日：2012-07-17

    申请号：US11981412

    申请日：2007-10-31

    申请人： J. Gary Eden ,  Sung-Jin Park ,  Clark J. Wagner

    发明人： J. Gary Eden ,  Sung-Jin Park ,  Clark J. Wagner

    IPC分类号： H01J17/49

    CPC分类号： H01J17/49 ,  H01J1/025 ,  H01J9/00 ,  H01J9/02 ,  H01J25/50 ,  H01J61/09 ,  H01J61/305 ,  H01J61/62 ,  H01J63/04 ,  H01J65/046

    摘要： The cavity 102 defines an empty volume formed in the insulator 108 has its walls defined by the insulator 108 and may extend through either (or both) the first electrode 106 or the second electrode 104, in which case the first electrode and/or second electrode also define the walls of the cavity 102. The cavity 102 is preferably cylindrical and has a diameter of 0.1 μm-1 mm. More preferably, the diameter ranges from 0.1 μm-500 μm, 1 μm-100 μm, or 100 μm-500 μm. The cavity 102 will be filled with a gas that contacts the cavity walls, fills the entire cavity 102 and is selected for its breakdown voltage or light emission properties at breakdown. Light is produced when the voltage difference between the first electrode 106 and the second electrode 104 creates an electric field sufficiently large to electrically break down the gas (nominally about 104 V-cm). This light escapes from the microcavity 102 through at least one end of the cavity 102.

    摘要翻译： 空腔102限定在绝缘体108中形成的空的体积具有由绝缘体108限定的壁，并且可延伸穿过第一电极106或第二电极104（或两者）中的一个或两者，在这种情况下，第一电极和/或第二电极 还限定空腔102的壁。空腔102优选是圆柱形的并且具有0.1μm-1mm的直径。 更优选的是，直径为0.1μm〜500μm，1μm〜100μm或100μm〜500μm。 空腔102将填充有与空腔壁接触的气体，填充整个空腔102，并且在击穿时选择其击穿电压或发光特性。 当第一电极106和第二电极104之间的电压差产生足够大的电场以电气分解气体（标称约为104V-cm）时产生光。 该光通过空腔102的至少一端从微腔102逸出。

    Roll to roll method of making microdischarge devices and arrays
    6.
    发明授权
    Roll to roll method of making microdischarge devices and arrays 有权
    制作微放电器件和阵列的卷对卷方法

    公开(公告)号：US07638937B2

    公开(公告)日：2009-12-29

    申请号：US11070100

    申请日：2005-03-01

    申请人： J. Gary Eden ,  Sung-Jin Park ,  Clark J. Wagner

    发明人： J. Gary Eden ,  Sung-Jin Park ,  Clark J. Wagner

    IPC分类号： H01J63/04 ,  H01J61/09 ,  H01J13/46

    CPC分类号： H01J17/49 ,  H01J1/025 ,  H01J9/00 ,  H01J9/02 ,  H01J25/50 ,  H01J61/09 ,  H01J61/305 ,  H01J61/62 ,  H01J63/04 ,  H01J65/046

    摘要： Roll to roll fabrication methods of the invention enable low cost mass production of microdischarge devices and arrays. A preferred embodiment method of fabricating a discharge device includes providing a dielectric layer sheet, a first electrode, and a second electrode sheet. A cavity is provided through at least a portion of the dielectric layer sheet. At least the dielectric layer sheet and second electrode sheet are rolled together. Another preferred embodiment method of fabrication a discharge device includes method of fabricating a discharge device includes providing a dielectric layer sheet and a cavity through at least a portion of the dielectric layer sheet. A first electrode is disposed as a film of conducting material on the dielectric layer sheet around a rim of the cavity. A second electrode sheet is provided. The dielectric layer sheet is rolled together with first electrode and second electrode sheets.

    摘要翻译： 本发明的卷对卷制造方法能够实现微量放电装置和阵列的低成本批量生产。 制造放电装置的优选实施例的方法包括提供介电层片，第一电极和第二电极片。 通过介电层片材的至少一部分提供空腔。 至少将电介质层片和第二电极片卷成一体。 制造放电器件的另一个优选实施例的方法包括制造放电器件的方法包括通过至少一部分电介质层片提供介电层片和空腔。 第一电极作为导电材料的膜设置在该空腔的边缘周围的介电层片上。 提供第二电极片。 介电层片与第一电极和第二电极片一起卷绕。

    Method of making arrays of thin sheet microdischarge devices
    7.
    发明申请
    Method of making arrays of thin sheet microdischarge devices 有权
    制备薄片微放电器件阵列的方法

    公开(公告)号：US20080119105A1

    公开(公告)日：2008-05-22

    申请号：US11981412

    申请日：2007-10-31

    申请人： J. Gary Eden ,  Sung-Jin Park ,  Clark J. Wagner

    发明人： J. Gary Eden ,  Sung-Jin Park ,  Clark J. Wagner

    IPC分类号： H01J9/02

    CPC分类号： H01J17/49 ,  H01J1/025 ,  H01J9/00 ,  H01J9/02 ,  H01J25/50 ,  H01J61/09 ,  H01J61/305 ,  H01J61/62 ,  H01J63/04 ,  H01J65/046

    摘要： The invention provides methods of making arrays of thin sheet microdischarge devices. In a preferred method of fabricating an array of microdischarge devices, a multi-layer dielectric layer thin sheet is position with respect to a first thin electrode. A second electrode thin sheet is joined on the dielectric layer sheet. An array of microcavities is provided through at least a portion of the dielectric layer sheet. The method can produce thin large arrays inexpensively. In preferred embodiments, each of the multi-layer dielectric layer thin sheet, the first thin electrode and the second electrode thin sheet have a thickness of less than less than 100 μm. In preferred embodiments, the multi-layer dielectric is formed of polymer, and in other embodiments from oxides and/or nitrides. In a particular preferred embodiment, the multilayer dielectric is formed from oxide and nitride films.

    摘要翻译： 本发明提供了制备薄片微放电器件阵列的方法。 在制造微放电器件阵列的优选方法中，多层介电层薄片相对于第一薄电极位置。 第二电极薄片接合在电介质层片上。 通过介电层片材的至少一部分提供微腔阵列。 该方法可以廉价地生产薄的大阵列。 在优选实施例中，多层介电层薄片，第一薄电极和第二电极薄片中的每一个具有小于小于100μm的厚度。 在优选实施例中，多层电介质由聚合物形成，在其它实施例中由氧化物和/或氮化物形成。 在特别优选的实施例中，多层电介质由氧化物和氮化物膜形成。