公开(公告)号：US09659737B2

公开(公告)日：2017-05-23

申请号：US13183255

申请日：2011-07-14

申请人： J. Gary Eden ,  Sung-Jin Park ,  JeKwon Yoon ,  Kwang-Soo Kim

发明人： J. Gary Eden ,  Sung-Jin Park ,  JeKwon Yoon ,  Kwang-Soo Kim

IPC分类号： H01J1/62 ,  B05D3/02 ,  B32B17/00 ,  H01J29/20 ,  H01J9/22 ,  H01J61/44

CPC分类号： H01J29/20 ,  H01J9/222 ,  H01J61/44 ,  Y10T428/24421

摘要： Microstructured, irregular surfaces pose special challenges but coatings of the invention can uniformly coat irregular and microstructured surfaces with one or more thin layers of phosphor. Preferred embodiment coatings are used in microcavity plasma devices and the substrate is, for example, a device electrode with a patterned and microstructured dielectric surface. A method for forming a thin encapsulated phosphor coating of the invention applies a uniform paste of metal or polymer layer to the substrate. In another embodiment, a low temperature melting point metal is deposited on the substrate. Polymer particles are deposited on a metal layer, or a mixture of a phosphor particles and a solvent are deposited onto the uniform glass, metal or polymer layer. Sequential soft and hard baking with temperatures controlled to drive off the solvent will then soften or melt the lowest melting point constituents of the glass, metal or polymer layer, partially or fully embed the phosphor particles into glass, polymer, or metal layers, which partially or fully encapsulate the phosphor particles and/or serve to anchor the particles to a surface.

公开(公告)号：US20120025696A1

公开(公告)日：2012-02-02

申请号：US13183255

申请日：2011-07-14

申请人： J. Gary Eden ,  Sung-Jin Park ,  JeKwon Yoon ,  Kwang-Soo Kim

发明人： J. Gary Eden ,  Sung-Jin Park ,  JeKwon Yoon ,  Kwang-Soo Kim

IPC分类号： H01J1/62 ,  B05D3/02 ,  B32B17/00 ,  B05D1/18 ,  B05D3/12 ,  B05D5/06 ,  B05D1/02

CPC分类号： H01J29/20 ,  H01J9/222 ,  H01J61/44 ,  Y10T428/24421

摘要： Microstructured, irregular surfaces pose special challenges but coatings of the invention can uniformly coat irregular and microstructured surfaces with one or more thin layers of phosphor. Preferred embodiment coatings are used in microcavity plasma devices and the substrate is, for example, a device electrode with a patterned and microstructured dielectric surface. A method for forming a thin encapsulated phosphor coating of the invention applies a uniform paste of metal or polymer layer to the substrate. In another embodiment, a low temperature melting point metal is deposited on the substrate. Polymer particles are deposited on a metal layer, or a mixture of a phosphor particles and a solvent are deposited onto the uniform glass, metal or polymer layer. Sequential soft and hard baking with temperatures controlled to drive off the solvent will then soften or melt the lowest melting point constituents of the glass, metal or polymer layer, partially or fully embed the phosphor particles into glass, polymer, or metal layers, which partially or fully encapsulate the phosphor particles and/or serve to anchor the particles to a surface.

摘要翻译： 微结构化的不规则表面构成特殊挑战，但是本发明的涂层可以用一层或多层磷光体均匀地涂覆不规则和微结构化的表面。 优选的实施方案涂层用于微腔等离子体装置，并且衬底是例如具有图案化和微结构化电介质表面的器件电极。 用于形成本发明的薄封装磷光体涂层的方法将均匀的金属或聚合物层糊料施加到基底上。 在另一个实施方案中，低温熔点金属沉积在基底上。 聚合物颗粒沉积在金属层上，或者将荧光体颗粒和溶剂的混合物沉积在均匀的玻璃，金属或聚合物层上。 随后温度控制以驱除溶剂的顺序软和硬烘烤将使玻璃，金属或聚合物层的最低熔点成分软化或熔化，部分或完全将磷光体颗粒嵌入玻璃，聚合物或金属层中，部分 或完全包封荧光体颗粒和/或用于将颗粒锚定到表面。

公开(公告)号：US20110148282A1

公开(公告)日：2011-06-23

申请号：US12640884

申请日：2009-12-17

申请人： J. Gary Eden ,  Sung-Jin Park ,  Jason D. Readle ,  Jekwon Yoon ,  Andrew Price ,  Jeffrey Putney

发明人： J. Gary Eden ,  Sung-Jin Park ,  Jason D. Readle ,  Jekwon Yoon ,  Andrew Price ,  Jeffrey Putney

IPC分类号： H01J61/30 ,  H01J61/42 ,  H01J9/38

CPC分类号： H01J17/49 ,  H01J17/16 ,  H01J65/046

摘要： Preferred embodiments of the invention provide microcavity plasma lamps having a plurality of metal and metal oxide layers defining a plurality of arrays of microcavities and encapsulated thin metal electrodes. Packaging encloses the plurality of metal and metal oxide layers in plasma medium. The metal and metal oxide layers are configured and arranged to vary the electric field strength and total gas pressure (E/p) in the lamp. The invention also provides methods of manufacturing a microcavity plasma lamp that simultaneously evacuate the volume within the packaging and a volume surrounding the packaging to maintain an insignificant or zero pressure differential across the packaging. The packaging is backfilled with a plasma medium while also maintaining an insignificant or zero pressure differential across the packaging.

摘要翻译： 本发明的优选实施例提供了具有限定多个微腔阵列和封装的薄金属电极的多个金属和金属氧化物层的微腔等离子体灯。 包装在等离子体介质中包围多个金属和金属氧化物层。 金属和金属氧化物层被配置和布置成改变灯中的电场强度和总气体压力（E / p）。 本发明还提供了制造微腔等离子体灯的方法，其同时抽空包装内的体积和围绕包装的体积，以保持整个包装上的微不足道或零压差。 包装用等离子体介质回填，同时在整个包装上保持不显着或零压差。

公开(公告)号：US08541946B2

公开(公告)日：2013-09-24

申请号：US12640884

申请日：2009-12-17

申请人： J. Gary Eden ,  Sung-Jin Park ,  Jason D. Readle ,  Jekwon Yoon ,  Andrew Price ,  Jeffrey Putney

发明人： J. Gary Eden ,  Sung-Jin Park ,  Jason D. Readle ,  Jekwon Yoon ,  Andrew Price ,  Jeffrey Putney

IPC分类号： H01J17/04

CPC分类号： H01J17/49 ,  H01J17/16 ,  H01J65/046

摘要： Preferred embodiments of the invention provide microcavity plasma lamps having a plurality of metal and metal oxide layers defining a plurality of arrays of microcavities and encapsulated thin metal electrodes. Packaging encloses the plurality of metal and metal oxide layers in plasma medium. The metal and metal oxide layers are configured and arranged to vary the electric field strength and total gas pressure (E/p) in the lamp. The invention also provides methods of manufacturing a microcavity plasma lamp that simultaneously evacuate the volume within the packaging and a volume surrounding the packaging to maintain an insignificant or zero pressure differential across the packaging. The packaging is backfilled with a plasma medium while also maintaining an insignificant or zero pressure differential across the packaging.

摘要翻译： 本发明的优选实施例提供了具有限定多个微腔阵列和封装的薄金属电极的多个金属和金属氧化物层的微腔等离子体灯。 包装在等离子体介质中包围多个金属和金属氧化物层。 金属和金属氧化物层被配置和布置成改变灯中的电场强度和总气体压力（E / p）。 本发明还提供了制造微腔等离子体灯的方法，其同时抽空包装内的体积和围绕包装的体积，以保持整个包装上的微不足道或零压差。 包装用等离子体介质回填，同时在整个包装上保持不显着或零压差。

公开(公告)号：US08547004B2

公开(公告)日：2013-10-01

申请号：US13188715

申请日：2011-07-22

申请人： J. Gary Eden ,  Sung-Jin Park ,  JeKwon Yoon ,  Brian Chung

发明人： J. Gary Eden ,  Sung-Jin Park ,  JeKwon Yoon ,  Brian Chung

IPC分类号： H01J61/04 ,  H01J17/49

CPC分类号： H01T21/00 ,  B01D53/32 ,  B01D2257/104 ,  B01D2257/91 ,  B01D2258/06 ,  B01D2259/818 ,  C01B13/10 ,  C02F1/32 ,  C02F1/4608 ,  C02F1/46109 ,  C02F1/48 ,  C02F1/78 ,  C02F2001/46133 ,  C02F2001/46152 ,  C02F2303/04 ,  H05H1/2406 ,  H05H2001/2418 ,  H05H2245/121

摘要： An embodiment of the invention is a microtip microplasma device having a first metal microtip opposing a second metal microtip with a gap therebetween. The first and second metal microtips are encapsulated in metal oxide that electrically isolates and physically connects the first and second metal microtips. In preferred devices, the first and second metal microtips and metal oxide comprise a monolithic, unitary structure. Arrays can be flexible, can be arranged in stacks, and can be formed into cylinders, for example, for gas and liquid processing devices, air filters and other applications. A preferred method of to forming an array of microtip microplasma devices provides a metal mesh with an array of micro openings therein. Electrode areas of the metal mesh are masked leaving planned connecting metal oxide areas of the metal mesh unmasked. Planned connecting metal oxide areas are electrochemically etched to convert the planned connecting metal oxide areas to metal oxide that encapsulates opposing metal microtips therein. The mask is removed. The electrode areas are electrochemically etched to encapsulate the electrode areas in metal oxide.

摘要翻译： 本发明的一个实施例是一种微尖端微型装置，其具有与第二金属微尖端相对的第一金属微尖端，其间具有间隙。 第一和第二金属微尖端被封装在金属氧化物中，其电隔离并物理地连接第一和第二金属微尖端。 在优选的装置中，第一和第二金属微尖端和金属氧化物包括整体的单一结构。 阵列可以是柔性的，可以堆叠布置，并且可以形成为气缸，例如用于气体和液体处理装置，空气过滤器等应用。 形成微尖锐微量器件阵列的优选方法提供了金属网，其中具有微孔开口阵列。 金属网的电极区域被掩蔽，留下金属网的计划连接的金属氧化物区域未被掩蔽。 计算的连接金属氧化物区域进行电化学蚀刻，以将计划的连接金属氧化物区域转换成在其中封装相对的金属微尖端的金属氧化物。 去除面具。 电化学蚀刻电极区域以将电极区域包封在金属氧化物中。

公开(公告)号：US20120074830A1

公开(公告)日：2012-03-29

申请号：US13188715

申请日：2011-07-22

申请人： J. Gary Eden ,  Sung-Jin Park ,  JeKwon Yoon ,  Brian Chung

发明人： J. Gary Eden ,  Sung-Jin Park ,  JeKwon Yoon ,  Brian Chung

IPC分类号： H05H1/24 ,  H01T21/00

CPC分类号： H01T21/00 ,  B01D53/32 ,  B01D2257/104 ,  B01D2257/91 ,  B01D2258/06 ,  B01D2259/818 ,  C01B13/10 ,  C02F1/32 ,  C02F1/4608 ,  C02F1/46109 ,  C02F1/48 ,  C02F1/78 ,  C02F2001/46133 ,  C02F2001/46152 ,  C02F2303/04 ,  H05H1/2406 ,  H05H2001/2418 ,  H05H2245/121

摘要： An embodiment of the invention is a microtip microplasma device having a first metal microtip opposing a second metal microtip with a gap therebetween. The first and second metal microtips are encapsulated in metal oxide that electrically isolates and physically connects the first and second metal microtips. In preferred devices, the first and second metal microtips and metal oxide comprise a monolithic, unitary structure. Arrays can be flexible, can be arranged in stacks, and can be formed into cylinders, for example, for gas and liquid processing devices, air filters and other applications. A preferred method of to forming an array of microtip microplasma devices provides a metal mesh with an array of micro openings therein. Electrode areas of the metal mesh are masked leaving planned connecting metal oxide areas of the metal mesh unmasked. Planned connecting metal oxide areas are electrochemically etched to convert the planned connecting metal oxide areas to metal oxide that encapsulates opposing metal microtips therein. The mask is removed. The electrode areas are electrochemically etched to encapsulate the electrode areas in metal oxide.

摘要翻译： 本发明的一个实施例是一种微尖端微型装置，其具有与第二金属微尖端相对的第一金属微尖端，其间具有间隙。 第一和第二金属微尖端被封装在金属氧化物中，其电隔离并物理地连接第一和第二金属微尖端。 在优选的装置中，第一和第二金属微尖端和金属氧化物包括整体的单一结构。 阵列可以是柔性的，可以堆叠布置，并且可以形成为气缸，例如用于气体和液体处理装置，空气过滤器等应用。 形成微尖锐微量器件阵列的优选方法提供了金属网，其中具有微孔开口阵列。 金属网的电极区域被掩蔽，留下金属网的计划连接的金属氧化物区域未被掩蔽。 计算的连接金属氧化物区域进行电化学蚀刻，以将计划的连接金属氧化物区域转换成在其中封装相对的金属微尖端的金属氧化物。 去除面具。 电化学蚀刻电极区域以将电极区域包封在金属氧化物中。

公开(公告)号：US20110181169A1

公开(公告)日：2011-07-28

申请号：US12991237

申请日：2009-05-14

申请人： J. Gary Eden ,  Sung-Jin Park ,  Taek-Lim Kim ,  Kwang-Soo Kim

发明人： J. Gary Eden ,  Sung-Jin Park ,  Taek-Lim Kim ,  Kwang-Soo Kim

IPC分类号： H05H1/24 ,  C25D11/02

CPC分类号： H05H1/24 ,  H01J11/36 ,  H01J61/86 ,  H05H1/2406 ,  H05H2001/2418

摘要： An array of microcavity plasma devices is formed in a unitary sheet of oxide with embedded microcavities or microchannels and embedded metal driving electrodes isolated by oxide from the microcavities or microchannels and arranged so as to generate sustain a plasma in the embedded microcavities or microchannels upon application of time-varying voltage when a plasma medium is contained in the microcavities or microchannels.

摘要翻译： 微腔等离子体装置的阵列形成在具有嵌入的微腔或微通道的一体的氧化物片和由微腔或微通道中的氧化物隔离的嵌入的金属驱动电极中，并且被布置成在施加了微腔或微通道时在嵌入的微腔或微通道中产生维持等离子体 当等离子体介质包含在微通道或微通道中时，具有时变电压。

公开(公告)号：US08890409B2

公开(公告)日：2014-11-18

申请号：US12991237

申请日：2009-05-14

申请人： J. Gary Eden ,  Sung-Jin Park ,  Taek-Lim Kim ,  Kwang-Soo Kim

发明人： J. Gary Eden ,  Sung-Jin Park ,  Taek-Lim Kim ,  Kwang-Soo Kim

IPC分类号： H01J17/49 ,  H01J9/26 ,  H01J9/32 ,  H05H1/24 ,  H01J61/86 ,  H01J11/36

CPC分类号： H05H1/24 ,  H01J11/36 ,  H01J61/86 ,  H05H1/2406 ,  H05H2001/2418

摘要： An array of microcavity plasma devices is formed in a unitary sheet of oxide with embedded microcavities or microchannels and encapsulated metal driving electrodes isolated by oxide from the microcavities or microchannels and arranged so as to generate sustain a plasma in the embedded microcavities or microchannels upon application of time-varying voltage when a plasma medium is contained in the microcavities or microchannels.

摘要翻译： 微腔等离子体装置的阵列形成在具有嵌入的微腔或微通道的一体的氧化物片材中，并且被封装的金属驱动电极由氧化物从微腔或微通道分离，并被布置成在施加了微腔或微通道时在嵌入的微腔或微通道中产生维持等离子体 当等离子体介质包含在微通道或微通道中时，具有时变电压。

公开(公告)号：US08404558B2

公开(公告)日：2013-03-26

申请号：US13188712

申请日：2011-07-22

申请人： J. Gary Eden ,  Sung-Jin Park ,  Kwang-Soo Kim

发明人： J. Gary Eden ,  Sung-Jin Park ,  Kwang-Soo Kim

IPC分类号： H01L33/16 ,  H01J17/04 ,  H01J17/49

CPC分类号： H01J11/18 ,  G09F9/313

摘要： In a preferred method of formation embodiment, a metal foil or film is obtained or formed with micro-holes. The foil is anodized to form metal oxide. One or more self-patterned metal electrodes are automatically formed and buried in the metal oxide created by the anodization process. The electrodes form in a closed circumference around each microcavity in a plane(s) transverse to the microcavity axis, and can be electrically isolated or connected. Preferred embodiments provide inexpensive microplasma device electrode structures and a fabrication method for realizing microplasma arrays that are lightweight and scalable to large areas. Electrodes buried in metal oxide and complex patterns of electrodes can also be formed without reference to microplasma devices—that is, for general electrical circuitry.

摘要翻译： 在优选的形成实施方案中，获得或形成有微孔的金属箔或膜。 箔被阳极化以形成金属氧化物。 自动形成一个或多个自图形金属电极并将其埋在通过阳极氧化处理产生的金属氧化物中。 电极在横截于微腔轴的平面中围绕每个微腔的封闭圆周形成，并且可以电隔离或连接。 优选实施例提供廉价的微型器件电极结构和用于实现轻量级并且可扩展到大面积的微等离子体阵列的制造方法。 掩埋在金属氧化物中的电极和电极的复杂图案也可以形成，而不参考微等离子体装置，即用于一般的电路。

公开(公告)号：US20110275272A1

公开(公告)日：2011-11-10

申请号：US13188712

申请日：2011-07-22

申请人： J. Gary Eden ,  Sung-Jin Park ,  Kwang-Soo Kim

发明人： J. Gary Eden ,  Sung-Jin Park ,  Kwang-Soo Kim

IPC分类号： H01J9/02

CPC分类号： H01J11/18 ,  G09F9/313

摘要： In a preferred method of formation embodiment, a metal foil or film is obtained or formed with micro-holes. The foil is anodized to form metal oxide. One or more self-patterned metal electrodes are automatically formed and buried in the metal oxide created by the anodization process. The electrodes form in a closed circumference around each microcavity in a plane(s) transverse to the microcavity axis, and can be electrically isolated or connected. Preferred embodiments provide inexpensive microplasma device electrode structures and a fabrication method for realizing microplasma arrays that are lightweight and scalable to large areas. Electrodes buried in metal oxide and complex patterns of electrodes can also be formed without reference to microplasma devices—that is, for general electrical circuitry.

摘要翻译： 在优选的形成实施方案中，获得或形成有微孔的金属箔或膜。 箔被阳极化以形成金属氧化物。 自动形成一个或多个自图形金属电极并将其埋在通过阳极氧化处理产生的金属氧化物中。 电极在横截于微腔轴的平面中围绕每个微腔的封闭圆周形成，并且可以电隔离或连接。 优选实施例提供廉价的微型器件电极结构和用于实现轻量级并且可扩展到大面积的微等离子体阵列的制造方法。 掩埋在金属氧化物中的电极和电极的复杂图案也可以形成，而不参考微等离子体装置，即用于一般的电路。