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1.发明申请公开(公告)号：US20110181169A1
公开(公告)日：2011-07-28
申请号：US12991237
申请日：2009-05-14
申请人： J. Gary Eden , Sung-Jin Park , Taek-Lim Kim , Kwang-Soo Kim
发明人： J. Gary Eden , Sung-Jin Park , Taek-Lim Kim , Kwang-Soo Kim
CPC分类号： H05H1/24 , H01J11/36 , H01J61/86 , H05H1/2406 , H05H2001/2418
摘要： An array of microcavity plasma devices is formed in a unitary sheet of oxide with embedded microcavities or microchannels and embedded metal driving electrodes isolated by oxide from the microcavities or microchannels and arranged so as to generate sustain a plasma in the embedded microcavities or microchannels upon application of time-varying voltage when a plasma medium is contained in the microcavities or microchannels.
摘要翻译： 微腔等离子体装置的阵列形成在具有嵌入的微腔或微通道的一体的氧化物片和由微腔或微通道中的氧化物隔离的嵌入的金属驱动电极中，并且被布置成在施加了微腔或微通道时在嵌入的微腔或微通道中产生维持等离子体 当等离子体介质包含在微通道或微通道中时，具有时变电压。
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2.发明授权Microcavity and microchannel plasma device arrays in a single, unitary sheet 有权微腔和微通道等离子体器件阵列在单一的单一片材中公开(公告)号：US08890409B2
公开(公告)日：2014-11-18
申请号：US12991237
申请日：2009-05-14
申请人： J. Gary Eden , Sung-Jin Park , Taek-Lim Kim , Kwang-Soo Kim
发明人： J. Gary Eden , Sung-Jin Park , Taek-Lim Kim , Kwang-Soo Kim
CPC分类号： H05H1/24 , H01J11/36 , H01J61/86 , H05H1/2406 , H05H2001/2418
摘要： An array of microcavity plasma devices is formed in a unitary sheet of oxide with embedded microcavities or microchannels and encapsulated metal driving electrodes isolated by oxide from the microcavities or microchannels and arranged so as to generate sustain a plasma in the embedded microcavities or microchannels upon application of time-varying voltage when a plasma medium is contained in the microcavities or microchannels.
摘要翻译： 微腔等离子体装置的阵列形成在具有嵌入的微腔或微通道的一体的氧化物片材中，并且被封装的金属驱动电极由氧化物从微腔或微通道分离，并被布置成在施加了微腔或微通道时在嵌入的微腔或微通道中产生维持等离子体 当等离子体介质包含在微通道或微通道中时，具有时变电压。
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3.发明授权Method for making buried circumferential electrode microcavity plasma device arrays, and electrical interconnects 有权用于制造埋置的圆周电极微腔等离子体器件阵列和电互连的方法公开(公告)号：US08404558B2
公开(公告)日：2013-03-26
申请号：US13188712
申请日：2011-07-22
申请人： J. Gary Eden , Sung-Jin Park , Kwang-Soo Kim
发明人： J. Gary Eden , Sung-Jin Park , Kwang-Soo Kim
摘要： In a preferred method of formation embodiment, a metal foil or film is obtained or formed with micro-holes. The foil is anodized to form metal oxide. One or more self-patterned metal electrodes are automatically formed and buried in the metal oxide created by the anodization process. The electrodes form in a closed circumference around each microcavity in a plane(s) transverse to the microcavity axis, and can be electrically isolated or connected. Preferred embodiments provide inexpensive microplasma device electrode structures and a fabrication method for realizing microplasma arrays that are lightweight and scalable to large areas. Electrodes buried in metal oxide and complex patterns of electrodes can also be formed without reference to microplasma devices—that is, for general electrical circuitry.
摘要翻译： 在优选的形成实施方案中，获得或形成有微孔的金属箔或膜。 箔被阳极化以形成金属氧化物。 自动形成一个或多个自图形金属电极并将其埋在通过阳极氧化处理产生的金属氧化物中。 电极在横截于微腔轴的平面中围绕每个微腔的封闭圆周形成，并且可以电隔离或连接。 优选实施例提供廉价的微型器件电极结构和用于实现轻量级并且可扩展到大面积的微等离子体阵列的制造方法。 掩埋在金属氧化物中的电极和电极的复杂图案也可以形成，而不参考微等离子体装置，即用于一般的电路。
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4.发明申请PHOSPHOR COATING FOR IRREGULAR SURFACES AND METHOD FOR CREATING PHOSPHOR COATINGS 有权用于非正式表面的磷光涂料和创建磷酸盐涂层的方法公开(公告)号：US20120025696A1
公开(公告)日：2012-02-02
申请号：US13183255
申请日：2011-07-14
申请人： J. Gary Eden , Sung-Jin Park , JeKwon Yoon , Kwang-Soo Kim
发明人： J. Gary Eden , Sung-Jin Park , JeKwon Yoon , Kwang-Soo Kim
CPC分类号： H01J29/20 , H01J9/222 , H01J61/44 , Y10T428/24421
摘要： Microstructured, irregular surfaces pose special challenges but coatings of the invention can uniformly coat irregular and microstructured surfaces with one or more thin layers of phosphor. Preferred embodiment coatings are used in microcavity plasma devices and the substrate is, for example, a device electrode with a patterned and microstructured dielectric surface. A method for forming a thin encapsulated phosphor coating of the invention applies a uniform paste of metal or polymer layer to the substrate. In another embodiment, a low temperature melting point metal is deposited on the substrate. Polymer particles are deposited on a metal layer, or a mixture of a phosphor particles and a solvent are deposited onto the uniform glass, metal or polymer layer. Sequential soft and hard baking with temperatures controlled to drive off the solvent will then soften or melt the lowest melting point constituents of the glass, metal or polymer layer, partially or fully embed the phosphor particles into glass, polymer, or metal layers, which partially or fully encapsulate the phosphor particles and/or serve to anchor the particles to a surface.
摘要翻译： 微结构化的不规则表面构成特殊挑战，但是本发明的涂层可以用一层或多层磷光体均匀地涂覆不规则和微结构化的表面。 优选的实施方案涂层用于微腔等离子体装置，并且衬底是例如具有图案化和微结构化电介质表面的器件电极。 用于形成本发明的薄封装磷光体涂层的方法将均匀的金属或聚合物层糊料施加到基底上。 在另一个实施方案中，低温熔点金属沉积在基底上。 聚合物颗粒沉积在金属层上，或者将荧光体颗粒和溶剂的混合物沉积在均匀的玻璃，金属或聚合物层上。 随后温度控制以驱除溶剂的顺序软和硬烘烤将使玻璃，金属或聚合物层的最低熔点成分软化或熔化，部分或完全将磷光体颗粒嵌入玻璃，聚合物或金属层中，部分 或完全包封荧光体颗粒和/或用于将颗粒锚定到表面。
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5.发明申请公开(公告)号：US20110275272A1
公开(公告)日：2011-11-10
申请号：US13188712
申请日：2011-07-22
申请人： J. Gary Eden , Sung-Jin Park , Kwang-Soo Kim
发明人： J. Gary Eden , Sung-Jin Park , Kwang-Soo Kim
IPC分类号： H01J9/02
摘要： In a preferred method of formation embodiment, a metal foil or film is obtained or formed with micro-holes. The foil is anodized to form metal oxide. One or more self-patterned metal electrodes are automatically formed and buried in the metal oxide created by the anodization process. The electrodes form in a closed circumference around each microcavity in a plane(s) transverse to the microcavity axis, and can be electrically isolated or connected. Preferred embodiments provide inexpensive microplasma device electrode structures and a fabrication method for realizing microplasma arrays that are lightweight and scalable to large areas. Electrodes buried in metal oxide and complex patterns of electrodes can also be formed without reference to microplasma devices—that is, for general electrical circuitry.
摘要翻译： 在优选的形成实施方案中，获得或形成有微孔的金属箔或膜。 箔被阳极化以形成金属氧化物。 自动形成一个或多个自图形金属电极并将其埋在通过阳极氧化处理产生的金属氧化物中。 电极在横截于微腔轴的平面中围绕每个微腔的封闭圆周形成，并且可以电隔离或连接。 优选实施例提供廉价的微型器件电极结构和用于实现轻量级并且可扩展到大面积的微等离子体阵列的制造方法。 掩埋在金属氧化物中的电极和电极的复杂图案也可以形成，而不参考微等离子体装置，即用于一般的电路。
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6.发明申请Buried circumferential electrode microcavity plasma device arrays, electrical interconnects, and formation method 有权埋置圆周电极微腔等离子体器件阵列，电气互连和形成方法公开(公告)号：US20080185579A1
公开(公告)日：2008-08-07
申请号：US11880698
申请日：2007-07-24
申请人： J. Gary Eden , Sung-Jin Park , Kwang-Soo Kim
发明人： J. Gary Eden , Sung-Jin Park , Kwang-Soo Kim
摘要： A preferred embodiment microcavity plasma device array of the invention includes a plurality of first metal circumferential metal electrodes that surround microcavities in the device. The first circumferential electrodes are buried in a metal oxide layer and surround the microcavities in a plane transverse to the microcavity axis, while being protected from plasma in the microcavities by the metal oxide. In embodiments of the invention, the circumferential electrodes can be connected in patterns. A second electrode(s) is arranged so as to be isolated from said first electrodes by said first metal oxide layer. In some embodiments, the second electrode(s) is in a second layer, and in other embodiments the second electrode(s) is also within the first metal oxide layer. A containing layer, e.g., a thin layer of glass, quartz, or plastic, seals the discharge medium (plasma) into the microcavities. In a preferred method of formation embodiment, a metal foil or film is obtained or formed with micro-holes. The foil is anodized to form metal oxide. One or more self-patterned metal electrodes are automatically formed and buried in the metal oxide created by the anodization process. The electrodes form in a closed circumference around each microcavity in a plane(s) transverse to the microcavity axis, and can be electrically isolated or connected. Preferred embodiments provide inexpensive microplasma device electrode structures and a fabrication method for realizing microplasma arrays that are lightweight and scalable to large areas. Electrodes buried in metal oxide and complex patterns of electrodes can also be formed without reference to microplasma devices—that is, for general electrical circuitry.
摘要翻译： 本发明的优选实施例微腔等离子体器件阵列包括围绕器件中的微腔的多个第一金属周向金属电极。 第一圆周电极被埋在金属氧化物层中，并且在垂直于微腔轴线的平面中围绕微腔，同时通过金属氧化物保护微腔中的等离子体。 在本发明的实施例中，圆周电极可以以图案连接。 第二电极被布置成通过所述第一金属氧化物层与所述第一电极隔离。 在一些实施例中，第二电极处于第二层，在其它实施例中，第二电极也在第一金属氧化物层内。 含有层，例如玻璃，石英或塑料的薄层，将放电介质（等离子体）密封成微腔。 在优选的形成实施方案中，获得或形成有微孔的金属箔或膜。 箔被阳极化以形成金属氧化物。 自动形成一个或多个自图形金属电极并将其埋在通过阳极氧化处理产生的金属氧化物中。 电极在横截于微腔轴的平面中围绕每个微腔的封闭圆周形成，并且可以电隔离或连接。 优选实施例提供廉价的微型器件电极结构和用于实现轻量级并且可扩展到大面积的微等离子体阵列的制造方法。 掩埋在金属氧化物中的电极和电极的复杂图案也可以形成，而不参考微等离子体装置，即用于一般的电路。
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公开(公告)号：US09659737B2
公开(公告)日：2017-05-23
申请号：US13183255
申请日：2011-07-14
申请人： J. Gary Eden , Sung-Jin Park , JeKwon Yoon , Kwang-Soo Kim
发明人： J. Gary Eden , Sung-Jin Park , JeKwon Yoon , Kwang-Soo Kim
CPC分类号： H01J29/20 , H01J9/222 , H01J61/44 , Y10T428/24421
摘要： Microstructured, irregular surfaces pose special challenges but coatings of the invention can uniformly coat irregular and microstructured surfaces with one or more thin layers of phosphor. Preferred embodiment coatings are used in microcavity plasma devices and the substrate is, for example, a device electrode with a patterned and microstructured dielectric surface. A method for forming a thin encapsulated phosphor coating of the invention applies a uniform paste of metal or polymer layer to the substrate. In another embodiment, a low temperature melting point metal is deposited on the substrate. Polymer particles are deposited on a metal layer, or a mixture of a phosphor particles and a solvent are deposited onto the uniform glass, metal or polymer layer. Sequential soft and hard baking with temperatures controlled to drive off the solvent will then soften or melt the lowest melting point constituents of the glass, metal or polymer layer, partially or fully embed the phosphor particles into glass, polymer, or metal layers, which partially or fully encapsulate the phosphor particles and/or serve to anchor the particles to a surface.
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8.发明授权Buried circumferential electrode microcavity plasma device arrays, electrical interconnects, and formation method 有权埋置圆周电极微腔等离子体器件阵列，电气互连和形成方法公开(公告)号：US08004017B2
公开(公告)日：2011-08-23
申请号：US11880698
申请日：2007-07-24
申请人： J. Gary Eden , Sung-Jin Park , Kwang-Soo Kim
发明人： J. Gary Eden , Sung-Jin Park , Kwang-Soo Kim
摘要： A preferred embodiment microcavity plasma device array of the invention includes a plurality of first metal circumferential metal electrodes that surround microcavities in the device. The first circumferential electrodes are buried in a metal oxide layer and surround the microcavities in a plane transverse to the microcavity axis, while being protected from plasma in the microcavities by the metal oxide. In embodiments of the invention, the circumferential electrodes can be connected in patterns. A second electrode(s) is arranged so as to be isolated from said first electrodes by said first metal oxide layer. In some embodiments, the second electrode(s) is in a second layer, and in other embodiments the second electrode(s) is also within the first metal oxide layer. A containing layer, e.g., a thin layer of glass, quartz, or plastic, seals the discharge medium (plasma) into the microcavities. In a preferred method of formation embodiment, a metal foil or film is obtained or formed with micro-holes. The foil is anodized to form metal oxide. One or more self-patterned metal electrodes are automatically formed and buried in the metal oxide created by the anodization process. The electrodes form in a closed circumference around each microcavity in a plane(s) transverse to the microcavity axis, and can be electrically isolated or connected. Preferred embodiments provide inexpensive microplasma device electrode structures and a fabrication method for realizing microplasma arrays that are lightweight and scalable to large areas. Electrodes buried in metal oxide and complex patterns of electrodes can also be formed without reference to microplasma devices—that is, for general electrical circuitry.
摘要翻译： 本发明的优选实施例微腔等离子体器件阵列包括围绕器件中的微腔的多个第一金属周向金属电极。 第一圆周电极被埋在金属氧化物层中，并且在垂直于微腔轴线的平面中围绕微腔，同时通过金属氧化物保护微腔中的等离子体。 在本发明的实施例中，圆周电极可以以图案连接。 第二电极被布置成通过所述第一金属氧化物层与所述第一电极隔离。 在一些实施例中，第二电极处于第二层，在其它实施例中，第二电极也在第一金属氧化物层内。 含有层，例如玻璃，石英或塑料的薄层，将放电介质（等离子体）密封成微腔。 在优选的形成实施方案中，获得或形成有微孔的金属箔或膜。 箔被阳极化以形成金属氧化物。 自动形成一个或多个自图形金属电极并将其埋在通过阳极氧化处理产生的金属氧化物中。 电极在横截于微腔轴的平面中围绕每个微腔的封闭圆周形成，并且可以电隔离或连接。 优选实施例提供廉价的微型器件电极结构和用于实现轻量级并且可扩展到大面积的微等离子体阵列的制造方法。 掩埋在金属氧化物中的电极和电极的复杂图案也可以形成，而不参考微等离子体装置，即用于一般的电路。
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9.发明授权Arrays of metal and metal oxide microplasma devices with defect free oxide 有权具有缺陷氧化物的金属和金属氧化物微质体装置阵列公开(公告)号：US08968668B2
公开(公告)日：2015-03-03
申请号：US13527842
申请日：2012-06-20
申请人： J. Gary Eden , Sung-Jin Park , Jin Hoon Cho , Seung Hoon Sung , Min Hwan Kim
发明人： J. Gary Eden , Sung-Jin Park , Jin Hoon Cho , Seung Hoon Sung , Min Hwan Kim
IPC分类号： B01J19/08 , H01J37/32 , C25D11/02 , H01J11/18 , C25D11/12 , C25D11/18 , C25D11/26 , H01J17/16
CPC分类号： B01J19/0093 , B01J2219/00783 , B01J2219/00842 , B01J2219/00853 , B01J2219/00891 , C01B13/115 , C25D11/02 , C25D11/022 , C25D11/026 , C25D11/12 , C25D11/18 , C25D11/26 , H01J11/18 , H01J11/22 , H01J11/34 , H01J17/066 , H01J17/16 , H01J37/32055 , H05H2001/2412 , H05H2001/2418
摘要： A microplasma device of the invention includes a microcavity or microchannel defined at least partially within a thick metal oxide layer consisting essentially of defect free oxide. Electrodes are arranged with respect to the microcavity or microchannel to stimulate plasma generation in said microcavity or microchannel upon application of suitable voltage and at least one of the electrodes is encapsulated within the thick metal oxide layer. Large arrays can be formed and are highly robust as lack of microcracks in the oxide avoid dielectric breakdown.
摘要翻译： 本发明的微血管装置包括至少部分地限定在基本上由无缺氧氧化物组成的厚金属氧化物层内的微腔或微通道。 电极相对于微腔或微通道布置，以在施加适当电压时刺激所述微腔或微通道中的等离子体产生，并且至少一个电极被封装在厚金属氧化物层内。 可以形成大阵列，并且由于在氧化物中缺少微裂纹以避免电介质击穿，因此它们具有很强的鲁棒性。
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公开(公告)号：US20100296978A1
公开(公告)日：2010-11-25
申请号：US12682977
申请日：2008-10-27
CPC分类号： H01S3/05 , H01S3/03 , H01S3/063 , H01S3/09 , H01S3/0971
摘要： The invention provides microchannel lasers having a microplasma gain medium. Lasers of the invention can be formed in semiconductor materials, and can also be formed in polymer materials. In a microlaser of the invention, high density plasmas are produced in microchannels. The microplasma acts as a gain medium with the electrodes sustaining the plasma in the microchannel. Reflectors are used with the microchannel for obtaining optical feedback to obtain lasing in the microplasma gain medium in devices of the invention for a wide range of atomic and molecular species. Several atomic and molecular gain media will produce sufficiently high gain coefficients that reflectors (mirrors) are not necessary. Microlasers of the invention are based on microplasma generation in channels of various geometries. Preferred embodiment microlaser designs can be fabricated in semiconductor materials, such as Si wafers, by standard photolithographic techniques, or in polymers by replica molding.
摘要翻译： 本发明提供了具有微质增益介质的微通道激光器。 本发明的激光器可以形成在半导体材料中，也可以形成在聚合物材料中。 在本发明的微型激光器中，在微通道中产生高密度等离子体。 微量体作为增益介质，其中电极在微通道中维持等离子体。 反射器与微通道一起使用以获得光学反馈，以在广泛的原子和分子物种的本发明装置中的微量级增益介质中获得激光。 几个原子和分子增益介质将产生足够高的增益系数，反射器（反射镜）不是必需的。 本发明的微型扫描器基于各种几何形状的通道中的微量生成。 优选实施例微激光器设计可以通过标准光刻技术在半导体材料（例如Si晶片）中或通过复制成型制成聚合物。
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