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公开(公告)号：US12014012B2
公开(公告)日：2024-06-18
申请号：US17370461
申请日：2021-07-08
发明人： Akitoshi Sakaue
CPC分类号： G06F3/0445 , G06F3/04164 , G06F3/0446 , H05K1/092 , H05K3/12 , G06F2203/04103 , G06F2203/04112 , H05K2201/09236 , H05K2201/09245 , H05K2201/09263
摘要： In printed wiring that is formed, on a surface of a base member, by a film of cured electrically conductive ink and that includes: a wavy line; a first wiring element located at one side of both sides sandwiching the wavy line in a width direction; and a second wiring element located at the other side of the both sides and adjacently to the wavy line; a surplus wavy line is provided which is another wavy line, which extends along the wavy line adjacently to the wavy line between the wavy line and the first wiring element, and which is connected to the wavy line to have the same potential.
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公开(公告)号：US10928951B2
公开(公告)日：2021-02-23
申请号：US16412975
申请日：2019-05-15
发明人： Akitoshi Sakaue , Hiroshi Okumura
IPC分类号： G06F3/041
摘要： A touch panel includes two ground wires. One end portion (an end portion X1) of one of the two ground wires and one end portion (an end portion Y1) of the other of the two ground wires form a gap. When the touch panel is viewed from front, the following condition as an example is satisfied: a line segment Z1 intersects at least one of the two ground wires. The line segment Z1 is a line segment which connects any one point P1 on a first line segment and any one point Q1 on a second line segment, the first line segment connecting a site of the end portion X1 and a site of the end portion Y1 which are located on two sides of an outer gate of the gap, the second line segment connecting a site of the end portion X1 and a site of the end portion Y1.
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公开(公告)号：US12052831B2
公开(公告)日：2024-07-30
申请号：US18140769
申请日：2023-04-28
发明人： Akitoshi Sakaue
CPC分类号： H05K3/46 , H05K1/0298 , H05K3/10 , H05K2203/0502 , Y10T29/49147
摘要： A wiring board includes a conductor pattern formed on a board, and an insulating film that covers at least part of the conductor pattern. A first insulating film is provided in a first region on the board, the first region covering at least part of the conductor pattern and having a first border segment. A second insulating film is provided in a second region on the board, the second region covering at least part of the first region and having a second border segment. The second border segment is located outside the first region, and the shortest distance from any point belonging to the second border segment to the first border segment is not more than 400 μm.
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公开(公告)号：US11310909B2
公开(公告)日：2022-04-19
申请号：US16932025
申请日：2020-07-17
摘要： A printed wiring line formed on a substrate connects two different points on the substrate which are connectable by another printed wiring line with a shape of a straight-line segment and has a shape corresponding to at least one of: 1) a shape with no linear part parallel to the straight-line segment; 2) a shape with line segments connected in series, each line segment having a shape with no linear part parallel to the straight-line segment; 3) a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment, length of the part parallel to the straight-line segment being not more than length of the straight-line segment; and 4) a shape in which line segments are connected in series, each line segment having a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment.
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公开(公告)号：US11209945B2
公开(公告)日：2021-12-28
申请号：US16921129
申请日：2020-07-06
发明人： Akitoshi Sakaue
摘要： In printed wiring that is formed, on a surface of a base member. by a film of cured electrically conductive ink and that includes: a wavy line; a first wiring element located at one side of both sides sandwiching the wavy line in a width direction; and a second wiring element located at the other side of the both sides and adjacently to the wavy line; a surplus wavy line is provided which is another wavy line, which extends along the wavy line adjacently to the wavy line between the wavy line and the first wiring element, and which is connected to the wavy line to have the same potential.
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公开(公告)号：US10725603B2
公开(公告)日：2020-07-28
申请号：US16173379
申请日：2018-10-29
摘要： A method for manufacturing a touch panel having a sensing area that includes a conductive part made up of thin-line mesh includes a step of designing the thin-line mesh, the thin-line mesh including a plurality of intersections, wherein the intersection forms therearound an acute angular area and an obtuse angular area, the acute angular area being defined between a pair of adjacently converging thin lines that forms an acute angle therebetween, the obtuse angular area being defined between a pair of adjacently converging thin lines that forms an obtuse angle therebetween, a step of filling electrically conductive ink into a printing plate by a squeezing process using a doctor blade, the printing plate having a groove pattern that conforms with the thin-line mesh, and a step of forming the conductive part by printing, in which the electrically conductive ink is transferred to a surface of a base member.
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公开(公告)号：US10675902B2
公开(公告)日：2020-06-09
申请号：US15246873
申请日：2016-08-25
发明人： Akitoshi Sakaue , Naoki Iwao , Mitsunori Sato , Yutaka Takezawa , Yutaro Kogawa , Mitsutoshi Naito
IPC分类号： B41M3/00 , B41F5/24 , B41M1/04 , B41N1/00 , B41N1/16 , G02F1/1337 , G06F3/044 , B41N1/12 , B41N1/22 , B41F19/00 , G02F1/13 , B41M1/26
摘要： A method of forming an insulator film by flexographic printing is provided with which an insulator film is formed on a printing object by using ink as an insulator film material and a flexographic printing plate with halftone dots convexly formed on a convex portion thereof that defines a printing pattern. A halftone dot condition change region with a condition of the halftone dots varied such that an ink retention volume therein is smaller than that in other region on the convex portion is provided on a part of the convex portion corresponding to an edge of the printing pattern.
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公开(公告)号：US11751340B2
公开(公告)日：2023-09-05
申请号：US17547576
申请日：2021-12-10
发明人： Akitoshi Sakaue
CPC分类号： H05K3/46 , H05K1/0298 , H05K3/10 , H05K2203/0502 , Y10T29/49147
摘要： A wiring board includes a conductor pattern formed on a board, and an insulating film that covers at least part of the conductor pattern. A first insulating film is provided in a first region on the board, the first region covering at least part of the conductor pattern and having a first border segment. A second insulating film is provided in a second region on the board, the second region covering at least part of the first region and having a second border segment. The second border segment is located outside the first region, and the shortest distance from any point belonging to the second border segment to the first border segment is not more than 400 μm.
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公开(公告)号：US11582868B2
公开(公告)日：2023-02-14
申请号：US17062284
申请日：2020-10-02
摘要： A printed wiring line formed on a substrate connects two different points on the substrate which are connectable by another printed wiring line with a shape of a straight-line segment and has a shape corresponding to at least one of: 1) a shape with no linear part parallel to the straight-line segment; 2) a shape with line segments connected in series, each line segment having a shape with no linear part parallel to the straight-line segment; 3) a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment, length of the part parallel to the straight-line segment being not more than length of the straight-line segment; and 4) a shape in which line segments are connected in series, each line segment having a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment.
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公开(公告)号：US11301104B2
公开(公告)日：2022-04-12
申请号：US17239755
申请日：2021-04-26
发明人： Akitoshi Sakaue , Yutaka Takezawa
摘要： A wiring structure that includes first wiring parts which are formed of conductive wires and second wiring parts which are formed of thicker conductive wires than the conductive wires of the first wiring parts and are connected to the first wiring parts is formed by offset printing which includes the following processes. First printing process: First conductive ink for forming the first wiring parts is transferred from a first blanket to a base. Second printing process: Second conductive ink for forming the second wiring parts is transferred from a second blanket, which is different from the first blanket, to the base.
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