COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, AND PATTERN-FORMING METHOD
    1.
    发明申请
    COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, AND PATTERN-FORMING METHOD 有权
    用于形成电阻膜的组合物和形成图案的方法

    公开(公告)号:US20130233826A1

    公开(公告)日:2013-09-12

    申请号:US13785466

    申请日:2013-03-05

    CPC classification number: G03F7/11 G03F7/0752 G03F7/091 G03F7/094

    Abstract: A composition for forming a resist underlayer film includes a polysiloxane, and an organic solvent composition. The organic solvent composition includes an alkylene glycol monoalkyl ether acetate having a standard boiling point of less than 150.0° C., and an organic solvent having a standard boiling point of no less than 150.0° C. In the organic solvent composition, a content of the alkylene glycol monoalkyl ether acetate is no less than 50% by mass and no greater than 99% by mass, and a content of the organic solvent is no less than 1% by mass and no greater than 50% by mass.

    Abstract translation: 用于形成抗蚀剂下层膜的组合物包括聚硅氧烷和有机溶剂组合物。 有机溶剂组合物包括标准沸点小于150.0℃的亚烷基二醇单烷基醚乙酸酯和标准沸点不低于150.0℃的有机溶剂。在有机溶剂组合物中, 亚烷基二醇单烷基醚乙酸酯的含量为50质量%以上且99质量%以下,有机溶剂的含量为1质量%以上且50质量%以下。

    COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, AND PATTERN-FORMING METHOD
    3.
    发明申请
    COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, AND PATTERN-FORMING METHOD 有权
    用于形成电阻膜的组合物和形成图案的方法

    公开(公告)号:US20130256264A1

    公开(公告)日:2013-10-03

    申请号:US13853131

    申请日:2013-03-29

    CPC classification number: G03F7/094 G03F7/004 G03F7/075 G03F7/0752

    Abstract: A composition for forming a resist underlayer film includes a polysiloxane, and a solvent composition. The solvent composition includes an organic solvent which includes a compound represented by the following formula (1) or a carbonate compound and which has a standard boiling point of no less than 150.0° C. R1 and R2 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms or an acyl group having 1 to 4 carbon atoms. R3 represents a hydrogen atom or a methyl group. n is an integer of 1 to 4. In a case where n is no less than 2, a plurality of R3s are identical or different.

    Abstract translation: 用于形成抗蚀剂下层膜的组合物包括聚硅氧烷和溶剂组合物。 溶剂组合物包括含有由下式(1)表示的化合物或碳酸酯化合物的标准沸点不低于150.0℃的有机溶剂.R 1和R 2各自独立地表示氢原子,烷基 具有1至4个碳原子的基团或具有1至4个碳原子的酰基。 R3表示氢原子或甲基。 n为1〜4的整数。在n为2以上的情况下,多个R3相同或不同。

    COMPOSITION FOR FORMING RESIST UNDERLAYER FILM AND PATTERN-FORMING METHOD
    4.
    发明申请
    COMPOSITION FOR FORMING RESIST UNDERLAYER FILM AND PATTERN-FORMING METHOD 有权
    用于形成电阻膜和图案形成方法的组合物

    公开(公告)号:US20130233825A1

    公开(公告)日:2013-09-12

    申请号:US13787674

    申请日:2013-03-06

    CPC classification number: G03F7/0757 G03F7/0752 G03F7/094

    Abstract: A composition for forming a resist underlayer film includes a polysiloxane and a solvent. The solvent includes an organic solvent having a standard boiling point of no less than 150.0° C., and water. A content of the organic solvent is no less than 1% by mass and no greater than 50% by mass with respect to a total amount of the solvent. A content of water is no less than 1% by mass and no greater than 30% by mass with respect to the total amount of the solvent.

    Abstract translation: 用于形成抗蚀剂下层膜的组合物包括聚硅氧烷和溶剂。 溶剂包括标准沸点不低于150.0℃的有机溶剂和水。 相对于溶剂的总量,有机溶剂的含量为1质量%以上且50质量%以下。 相对于溶剂的总量,水的含量为1质量%以上且30质量%以下。

Patent Agency Ranking