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    Image sensor and method for packaging the same
    1.
    发明申请
    Image sensor and method for packaging the same 审中-公开
    图像传感器和包装方法

    公开(公告)号：US20050012025A1

    公开(公告)日：2005-01-20

    申请号：US10621986

    申请日：2003-07-16

    申请人： Jackson Hsieh ,  Jichen Wu ,  Bruce Chen ,  Abnet Chen

    发明人： Jackson Hsieh ,  Jichen Wu ,  Bruce Chen ,  Abnet Chen

    IPC分类号： H01L27/00 ,  H01L31/00 ,  H01L31/0203

    CPC分类号： H01L31/0203 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/16195 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An image sensor includes lower and upper metal sheet sets, an encapsulant, a photosensitive chip, wires, and a transparent layer. The lower metal sheet set includes plural lower metal sheets and a middle board among and flush with the lower metal sheets. The upper metal sheet set includes plural upper metal sheets stacked on the lower metal sheets, respectively. The encapsulant encapsulates the upper and lower metal sheets and the middle board with upper surfaces of the upper sheets, lower surfaces of the lower sheets, and upper and lower surfaces of the middle board exposed from the encapsulant, and with a frame layer formed around the upper sheets to define a chamber. The chip is mounted to the middle board and located within the chamber. The wires electrically connect the chip to the upper metal sheets. The transparent layer is arranged on the frame layer to cover the chip.

    摘要翻译： 图像传感器包括下部和上部金属片组，密封剂，感光芯片，导线和透明层。 下金属片组包括多个下金属片和中间板，并与下金属片齐平。 上部金属片组分别包括堆叠在下部金属片上的多个上部金属片。 密封剂封装上，下金属片和中间板，上板的上表面，下片的下表面，以及从密封剂暴露的中间板的上表面和下表面，以及围绕 上部板材定义一个室。 芯片安装在中间板并位于腔室内。 电线将芯片电连接到上金属片。 透明层布置在框架层上以覆盖芯片。

    STACKED SMALL MEMORY CARD
    2.
    发明申请
    STACKED SMALL MEMORY CARD 失效
    堆叠的小存储卡

    公开(公告)号：US20050077362A1

    公开(公告)日：2005-04-14

    申请号：US10683838

    申请日：2003-10-09

    申请人： Jackson Hsieh ,  Jichen Wu ,  Abnet Chen

    发明人： Jackson Hsieh ,  Jichen Wu ,  Abnet Chen

    IPC分类号： G06K19/02 ,  G06K19/077 ,  H05K1/02 ,  H05K1/14 ,  H05K3/28 ,  G06K19/06

    CPC分类号： G06K19/0773 ,  G06K19/02 ,  G06K19/077 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0206 ,  H05K1/144 ,  H05K3/0061 ,  H05K3/284 ,  H05K2201/043 ,  H01L2924/00014

    摘要： A stacked small memory card includes an upper memory card and a lower memory card, the upper memory card and the lower memory card respectively formed a first heat sink and a second heat sink, the first heat sink and the second heat sink are stacked together, so that, the heat of the upper memory card and the lower memory card may be dispersed via the first heat sink and the second heat sink. Thus, the stacked small memory card of present invention having high function of disperses heat to promote its durability and lifetime effectively.

    摘要翻译： 堆叠式小存储卡包括上存储卡和下存储卡，上存储卡和下存储卡分别形成第一散热器和第二散热器，第一散热器和第二散热器堆叠在一起， 使得上存储卡和下存储卡的热量可以经由第一散热器和第二散热器分散。 因此，本发明的堆叠式小型存储卡具有高散热功能，有效地提高了其耐久性和寿命。

    Image sensor package
    3.
    发明申请
    Image sensor package 审中-公开
    图像传感器封装

    公开(公告)号：US20050098865A1

    公开(公告)日：2005-05-12

    申请号：US10705377

    申请日：2003-11-10

    申请人： Jackson Hsieh ,  Jichen Wu ,  Worrell Tsai ,  Abnet Chen

    发明人： Jackson Hsieh ,  Jichen Wu ,  Worrell Tsai ,  Abnet Chen

    IPC分类号： H01L23/02 ,  H01L23/48 ,  H01L31/0203

    CPC分类号： H01L31/0203 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： An image sensor package includes plural lower metal sheets, plural upper metal sheets stacked on the lower metal sheets, and an encapsulant for encapsulating the lower and upper metal sheets. The lower metal formed with a first hole, the upper metal sheets formed a second hole penetrated from the upper surface to the lower surface. Wherein the encapsulant filled into the second hole and first hole to tighten the upper metal sheets and the lower metal sheets. A photosensitive chip arranged within the chamber, plural wires for electrically connecting the chip to the upper surfaces of the lower metal sheets, and a transparent layer arranged on the frame layer to cover the chip.

    摘要翻译： 图像传感器封装包括多个下金属片，堆叠在下金属片上的多个上金属片，以及用于封装下金属片和上金属片的密封剂。 形成有第一孔的下部金属，上部金属板形成从上表面向下表面贯穿的第二孔。 其中密封剂填充到第二孔和第一孔中以收紧上金属片和下金属片。 布置在室内的感光芯片，用于将芯片电连接到下金属片的上表面的多根电线以及布置在框架层上以覆盖芯片的透明层。

    Small memory card
    4.
    发明申请
    Small memory card 审中-公开
    小存储卡

    公开(公告)号：US20050078457A1

    公开(公告)日：2005-04-14

    申请号：US10683839

    申请日：2003-10-09

    申请人： Jackson Hsieh ,  Jichen Wu ,  Abnet Chen

    发明人： Jackson Hsieh ,  Jichen Wu ,  Abnet Chen

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20463

    摘要： A small memory card includes a first substrate, a heat sink, a second substrate, at least one upper memory chip, at least one bottom memory chip and a glue layer. The heat sink is arranged between the first substrate and second substrate, and contacted with the metal, which are filled within the plurality of through holes, which formed between the first substrate and second substrate. And each of the upper memory chips and bottom memory chips are mounted on the first substrate and the second substrate, so that the heat of the upper and bottom memory chips may be traveled to the heat sink via the metal, which is filled within the through hole, then the heat will be dispersed. Thus, the small memory card of present invention having high function of disperses heat to promote its durability and lifetime effectively, the manufacturing processes must be simplified and the manufacturing cost must decrease also.

    摘要翻译： 小型存储卡包括第一基板，散热器，第二基板，至少一个上部存储器芯片，至少一个底部存储器芯片和胶合层。 散热器布置在第一基板和第二基板之间，并且与形成在第一基板和第二基板之间的多个通孔中填充的金属接触。 并且上部存储器芯片和底部存储器芯片中的每一个安装在第一基板和第二基板上，使得上部和下部存储器芯片的热量可以经由金属行进到散热器，该金属填充在通孔 孔，那么热会分散。 因此，本发明的小型存储卡具有高散热功能以有效提高其耐用性和寿命，因此制造工艺必须简化，制造成本也必须降低。

    Image sensor module and method for manufacturing the same
    6.
    发明申请
    Image sensor module and method for manufacturing the same 审中-公开
    图像传感器模块及其制造方法

    公开(公告)号：US20050012024A1

    公开(公告)日：2005-01-20

    申请号：US10621985

    申请日：2003-07-16

    申请人： Jackson Hsieh ,  Jichen Wu ,  Abnet Chen

    发明人： Jackson Hsieh ,  Jichen Wu ,  Abnet Chen

    IPC分类号： H01L27/00 ,  H01L27/146 ,  H01L31/00 ,  H01L31/0203 ,  H01L31/0232

    CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/16195 ,  H04N5/2257 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An image sensor module includes an image sensor, and a lens holder and a lens barrel on the image sensor. The image sensor includes plural lower metal sheets, plural upper metal sheets stacked on the lower metal sheets, and an encapsulant for encapsulating the lower and upper metal sheets, wherein the upper surfaces of the upper metal sheets are exposed from the encapsulant, the lower surfaces of the lower metal sheets are exposed from the encapsulant, and the encapsulant is formed with a frame layer around the upper surfaces of the upper metal sheets to define a chamber together with the upper metal sheets. The image sensor further includes a photosensitive chip arranged within the chamber, plural wires for electrically connecting the chip to the upper surfaces of the upper metal sheets, and a transparent layer arranged on the frame layer to cover the chip.

    摘要翻译： 图像传感器模块包括图像传感器，以及在图像传感器上的透镜保持器和镜筒。 图像传感器包括多个下金属片，堆叠在下金属片上的多个上金属片，以及用于封装下金属片和上金属片的密封剂，其中上金属片的上表面从密封剂露出，下表面 的下部金属片从密封剂露出，并且密封剂在上金属片的上表面周围形成有框架层，以与上金属片一起限定室。 图像传感器还包括布置在腔室内的感光芯片，用于将芯片电连接到上金属片的上表面的多根电线以及布置在框架层上以覆盖芯片的透明层。

    Stacked structure of an image sensor
    8.
    发明授权
    Stacked structure of an image sensor 失效
    图像传感器的堆叠结构

    公开(公告)号：US06680525B1

    公开(公告)日：2004-01-20

    申请号：US10340251

    申请日：2003-01-09

    申请人： Jackson Hsieh ,  Jichen Wu ,  Bruce Chen

    发明人： Jackson Hsieh ,  Jichen Wu ,  Bruce Chen

    IPC分类号： H01L2302

    CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： An image sensor to be mounted to a printed circuit board. The module includes a substrate, an integrated circuit, a frame layer, a photosensitive chip, a plurality of wires, and a transparent layer. The substrate is composed of metal sheets arranged in a matrix, and a middle board positioned in a central region surrounded by the metal sheets. Each metal sheet has a first board and a second board connected to the printed circuit board. A slot is formed under the substrate. The integrated circuit is arranged within the slot and electrically connected to the substrate. The chip is placed on the middle board. The wires electrically connect the first boards, to the chip. The transparent layer is placed on the frame layer to cover the chip.

    摘要翻译： 要安装到印刷电路板的图像传感器。 该模块包括基板，集成电路，框架层，感光芯片，多根导线和透明层。 基板由布置成矩阵状的金属板和位于由金属板包围的中央区域的中间板构成。 每个金属片具有连接到印刷电路板的第一板和第二板。 在基底下方形成槽。 集成电路布置在槽内并与衬底电连接。 芯片放在中间板上。 电线将第一板电连接到芯片。 透明层被放置在框架层上以覆盖芯片。

    Image sensor having shortened wires
    9.
    发明授权
    Image sensor having shortened wires 失效
    图像传感器具有缩短的电线

    公开(公告)号：US06747261B1

    公开(公告)日：2004-06-08

    申请号：US10340333

    申请日：2003-01-09

    申请人： Jackson Hsieh ,  Jichen Wu ,  Bruce Chen ,  Jack Chuang

    发明人： Jackson Hsieh ,  Jichen Wu ,  Bruce Chen ,  Jack Chuang

    IPC分类号： H01L2348

    CPC分类号： H01L31/0203 ,  H01L23/49861 ,  H01L27/14601 ,  H01L2224/16245

    摘要： An image sensor having shortened wires. The image sensor includes a substrate composed of metal sheets arranged in a matrix, a photosensitive chip, bonding pads on the chip, a frame layer, wires and a transparent layer placed on the frame layer. Each metal sheet has a first board and a second board. A chamber is defined under the substrate to accommodate the chip. Each pad is arranged between first boards. The frame layer is formed on a periphery and the bottom surface to encapsulate the chip. The bottom faces of the second boards are electrically connected to a printed circuit board. Each wire has a first terminal and a second terminal. The first terminals are electrically connected to the pads, and the second terminals are electrically connected to the first boards, respectively.

    摘要翻译： 具有缩短电线的图像传感器。 图像传感器包括由矩阵状的金属板构成的基板，感光芯片，芯片上的接合焊盘，框架层，布线和布置在框架层上的透明层。 每个金属板具有第一板和第二板。 在基底下方限定一个腔室以容纳芯片。 每个垫布置在第一板之间。 框架层形成在周边和底面上以封装芯片。 第二板的底面电连接到印刷电路板。 每条线具有第一端子和第二端子。 第一端子电连接到焊盘，并且第二端子分别电连接到第一板。