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    Circuit Board Assembly
    6.
    发明申请
    Circuit Board Assembly 审中-公开
    电路板组装

    公开(公告)号：US20140211421A1

    公开(公告)日：2014-07-31

    申请号：US13752584

    申请日：2013-01-29

    申请人： Matthew D. Mishrikey ,  James O'Keeffe ,  Bruce R. Conway ,  Peter J. Dutton

    发明人： Matthew D. Mishrikey ,  James O'Keeffe ,  Bruce R. Conway ,  Peter J. Dutton

    IPC分类号： H05K1/02

    CPC分类号： H05K1/144 ,  H01L2224/16225 ,  H05K1/0209 ,  H05K2201/042 ,  H05K2201/066 ,  H05K2201/10242 ,  H05K2201/2036

    摘要： A circuit board assembly includes first and second circuit boards that each have a substrate and a conductive circuit layer positioned on the substrate. The first and second circuit boards are arranged such that the conductive circuit layers face each other across a gap. Thermal conductor pillars extend lengths across the gap between the conductive circuit layers of the first and second circuit boards. The thermal conductor pillars include opposite first and second ends that are engaged in thermal contact with the conductive circuit layers of the first and second circuit boards, respectively. The thermal conductor pillars provide thermal pathways for heat to travel between the first and second circuit boards.

    摘要翻译： 电路板组件包括第一和第二电路板，每个电路板具有衬底和位于衬底上的导电电路层。 第一和第二电路板布置成使得导电电路层跨越间隙彼此面对。 热导体支柱跨越第一和第二电路板的导电电路层之间的间隙延伸长度。 热导体柱包括分别与第一和第二电路板的导电电路层热接触的相对的第一和第二端。 热导体柱提供用于热在第一和第二电路板之间行进的热路径。