摘要:
Disclosed herein is a thermoplastic resin composition with good heat stability, light stability and impact strength. In an exemplary embodiment, the thermoplastic resin composition comprises (A) about 10 to about 99 parts by weight of an epoxy group-containing styrenic resin; (B) about 1 to about 90 parts by weight of a polyester resin; (C) about 0.1 to about 10 parts by weight of a thermoplastic polyester resin comprising a cycloaliphatic diol such as cyclohexane dimethanol, per about 100 parts by weight of a base resin comprising (A)+(B); (D) about 0.05 to about 2 parts by weight of a hindered phenolic compound, per about 100 parts by weight of a base resin comprising (A)+(B); (E) about 0.05 to about 4 parts by weight of a phosphite compound, per about 100 parts by weight of a base resin comprising (A)+(B); and (F) about 0.2 to about 6 parts by weight of a compound comprising a HALS compound, benzotriazol based compound, or a combination thereof, per about 100 parts by weight of a base resin comprising (A)+(B).
摘要:
The present invention provides a chemical and impact resistant thermoplastic resin composition that can have improved extrudability. In one embodiment, the thermoplastic resin composition comprises a base resin including (A) about 1 to about 98% by weight of an epoxy group-containing vinyl copolymer resin; (B) about 1 to about 98% by weight of a rubber modified styrene copolymer resin; and (C) about 1 to about 98% by weight of a polyester resin; and about 1 to about 6 parts by weight of an aromatic vinyl-vinyl cyanide copolymer resin having a weight average molecular weight of about 1,000,000 to about 5,000,000, per 100 parts by weight of the base resin comprising (A)+(B)+(C). In another embodiment, the thermoplastic resin composition comprises a base resin including (A) about 1 to about 98% by weight of an epoxy group-containing vinyl copolymer resin; (B) about 1 to about 98% by weight of a rubber modified styrene copolymer resin; and (C) about 1 to about 98% by weight of a polyester resin; and (E) about 0.01 to about 1 part by weight of an epoxy-based additive, per 100 parts by weight of the base resin comprising (A)+(B)+(C).
摘要:
A styrenic thermoplastic resin composition of the present invention comprises about 100 parts by weight of base resin comprising (A) about 10 to about 99 parts by weight of styrenic resin containing an epoxy group and (B) about 1 to about 90 parts by weight of polyester resin; and (C) about 0.1 to about 97 parts by weight of amorphous modified polyester resin, based on the total weight of the base resin. A molded article produced from the styrenic thermoplastic resin composition of the present invention can have excellent impact resistance and paintability.
摘要:
Disclosed herein is a chemical-resistant and impact-resistant thermoplastic resin composition having excellent hydrolysis resistance. The thermoplastic resin composition comprises (A) about 1 to about 97.9% by weight of an epoxy group-containing vinyl copolymer resin; (B) about 1 to about 97.9% by weight of a rubber modified aromatic vinyl copolymer resin; (C) about 1 to about 97.9% by weight of a polyester resin; and (D) about 0.1 to about 97% by weight of an amorphous cycloaliphatic diol modified polyester.
摘要:
The present invention provides a thermoplastic resin composition that can have excellent impact resistance, chemical resistance, fluidity and high gloss, which comprises about 1 to about 80 parts by weight of a styrene-acrylonitrile resin (A) including one or more functional groups capable of reacting with polyester; about 1 to about 98 parts by weight of an acrylonitrile-butadiene-styrene resin (B) including about 5 to about 40% by weight of a graft polymerized acrylonitrile-butadiene-styrene resin (B1) and about 60 to about 95% by weight of a styrene-acrylonitrile resin (B2) and including about 20% by weight or less of acrylonitrile; and about 1 to about 98 parts by weight of a polyester resin (C), wherein the resin composition comprises acrylonitrile in a total amount of about 1 to about 13% by weight.
摘要:
A molded article for an electronic device housing having a thickness of about 0.2 to about 2 mm and an apparent specific gravity of about 0.8 to about 2.5 g/ml is provided. A method for preparing the molded article for an electronic device housing includes extrusion molding a thermoplastic resin composition to form a continuous profile extrudate with a prescribed cross-sectional shape; and vacuum forming the continuous profile extrudate to form a molded article with a thickness of about 0.2 to about 2 mm and an apparent specific gravity of about 0.8 to about 2.5 g/ml.