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    Method of fabricating a non-volatile memory device having a tunnel-insulating layer including more than two portions of different thickness
    1.
    发明授权
    Method of fabricating a non-volatile memory device having a tunnel-insulating layer including more than two portions of different thickness 有权
    制造具有包括不同厚度的两个以上部分的隧道绝缘层的非易失性存储器件的方法

    公开(公告)号：US06709920B2

    公开(公告)日：2004-03-23

    申请号：US09902243

    申请日：2001-07-10

    申请人： Jae-Phil Boo ,  Soo-Young Tak ,  Kwang-Bok Kim ,  Kyung-Hyun Kim ,  Chang-Ki Hong

    发明人： Jae-Phil Boo ,  Soo-Young Tak ,  Kwang-Bok Kim ,  Kyung-Hyun Kim ,  Chang-Ki Hong

    IPC分类号： H01L218242

    CPC分类号： H01L27/11526 ,  H01L27/11531

    摘要： A method of fabricating a non-volatile memory device, which has a tunnel insulating layer consisting of two or more portions of different thickness, cell transistors, and auxiliary transistors for applying external voltage and for interfacing with peripheral circuits is described. According to the method, the tunnel insulating layer, a conductive layer, and a first insulating layer are sequentially deposited over a semiconductor substrate. The resultant structure is selectively etched to a given depth to form trenches. A second insulating layer is deposited over the substrate including the trenches, and the second insulating layer is selectively removed so as to form element isolation regions consisting of the trenches filled with the second insulating layer. The first insulating layer is selectively removed, and the second insulating layer is selectively removed by a CMP process to expose the conductive layer. The conductive layer is used as the stopping layer during the CMP process.

    摘要翻译： 描述了制造具有由不同厚度的两个或更多个部分组成的隧道绝缘层的单元晶体管和用于施加外部电压并与外围电路接口的辅助晶体管的非易失性存储器件的制造方法。 根据该方法，隧道绝缘层，导电层和第一绝缘层依次沉积在半导体衬底上。 将所得结构选择性地蚀刻到给定的深度以形成沟槽。 在包括沟槽的衬底上沉积第二绝缘层，并且选择性地去除第二绝缘层，以便形成由填充有第二绝缘层的沟槽组成的元件隔离区域。 选择性地去除第一绝缘层，并且通过CMP工艺选择性地去除第二绝缘层以暴露导电层。 在CMP工艺期间，导电层用作停止层。

    Chemical mechanical polishing apparatus
    2.
    发明授权
    Chemical mechanical polishing apparatus 有权
    化学机械抛光装置

    公开(公告)号：US08790158B2

    公开(公告)日：2014-07-29

    申请号：US13033876

    申请日：2011-02-24

    申请人： One-Moon Chang ,  Jae-Phil Boo ,  Jong-Bok Kim ,  Soo-Young Tak ,  Jong-Sun Ahn ,  Shin Kim

    发明人： One-Moon Chang ,  Jae-Phil Boo ,  Jong-Bok Kim ,  Soo-Young Tak ,  Jong-Sun Ahn ,  Shin Kim

    IPC分类号： B24B49/03 ,  B24B49/12 ,  B24B37/04

    CPC分类号： B24B41/06

    摘要： A chemical mechanical polishing apparatus includes a platen having a first region configured to support a wafer, and a second region disposed outside the first region. The chemical mechanical polishing apparatus further includes a polishing pad disposed on the platen, a pad head to which the polishing pad is attached, a slurry supply configured to supply a slurry onto the wafer, and an injection port disposing on the second region of the platen. The injection port is configured to inject a predetermined gas to an edge of a bottom surface of the wafer and toward the outside of the wafer.

    摘要翻译： 化学机械抛光装置包括具有构造成支撑晶片的第一区域的压板和设置在第一区域外的第二区域。 化学机械抛光装置还包括设置在压板上的抛光垫，附接有抛光垫的焊盘头，配置成将浆料供应到晶片上的浆料供应源和设置在压板的第二区域上的注入口 。 注入口被配置为将预定气体注入到晶片的底表面的边缘并朝向晶片的外部。

    CHEMICAL MECHANICAL POLISHING APPARATUS
    5.
    发明申请
    CHEMICAL MECHANICAL POLISHING APPARATUS 有权
    化学机械抛光装置

    公开(公告)号：US20110217910A1

    公开(公告)日：2011-09-08

    申请号：US13033876

    申请日：2011-02-24

    申请人： One-Moon CHANG ,  Jae-Phil Boo ,  Jong-Bok Kim ,  Soo-Young Tak ,  Jong-Sun Ahn ,  Shin Kim

    发明人： One-Moon CHANG ,  Jae-Phil Boo ,  Jong-Bok Kim ,  Soo-Young Tak ,  Jong-Sun Ahn ,  Shin Kim

    IPC分类号： B24B41/06

    CPC分类号： B24B41/06

    摘要： A chemical mechanical polishing apparatus includes a platen having a first region configured to support a wafer, and a second region disposed outside the first region. The chemical mechanical polishing apparatus further includes a polishing pad disposed on the platen, a pad head to which the polishing pad is attached, a slurry supply configured to supply a slurry onto the wafer, and an injection port disposing on the second region of the platen. The injection port is configured to inject a predetermined gas to an edge of a bottom surface of the wafer and toward the outside of the wafer.

    摘要翻译： 化学机械抛光装置包括具有构造成支撑晶片的第一区域的压板和设置在第一区域外的第二区域。 化学机械抛光装置还包括设置在压板上的抛光垫，附接有抛光垫的焊盘头，配置成将浆料供应到晶片上的浆料供应源和设置在压板的第二区域上的注入口 。 注入口被配置为将预定气体注入到晶片的底表面的边缘并朝向晶片的外部。

    Apparatus for polishing a semiconductor wafer
    6.
    发明授权
    Apparatus for polishing a semiconductor wafer 失效
    用于抛光半导体晶片的装置

    公开(公告)号：US07081045B2

    公开(公告)日：2006-07-25

    申请号：US11052275

    申请日：2005-02-07

    申请人： Jae-Phil Boo ,  Jun-Gyu Ryu ,  Sang-Seon Lee ,  Sun-Wung Lee

    发明人： Jae-Phil Boo ,  Jun-Gyu Ryu ,  Sang-Seon Lee ,  Sun-Wung Lee

    IPC分类号： B24B49/00

    CPC分类号： B24B37/30 ,  B24B37/32 ,  H01L21/304

    摘要： An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower edge of the carrier, forming a space for receiving the wafer, a supporter disposed in the carrier, and a flexible membrane disposed to be in contact with the wafer. The supporter has an upper surface portion, a lower surface portion, a plurality of first holes, a plurality of second holes, and a first chamber. The upper surface portion of the supporter forms a second chamber along with an inner surface of the carrier. The second chamber is in communication with one of the two fluid passages of the carrier and the second holes are formed in a lower surface portion of the supporter to communicate with the second chamber. The first chamber is in communication with the other one of the two fluid passages and the first holes are formed in the lower surface portion of the supporter to communicate with the first chamber. The lower surface portion of the supporter has a flat surface and a chamfered or rounded edge. The membrane disposed to enclose the lower surface portion of the supporter has a plurality of third holes formed at positions corresponding to the first holes to absorb and hold the wafer by vacuum.

    摘要翻译： 用于抛光晶片的装置包括具有设置在其上的研磨垫的支撑部分和设置在研磨垫上方的抛光头。 抛光头包括具有至少两个流体通道的载体，设置在载体的下边缘上的保持环，形成用于接收晶片的空间，设置在载体中的支撑体和设置成与载体接触的柔性膜 晶圆。 支撑体具有上表面部分，下表面部分，多个第一孔，多个第二孔和第一室。 支撑件的上表面部分与载体的内表面一起形成第二室。 第二室与载体的两个流体通道中的一个连通，并且第二孔形成在支撑件的下表面部分中以与第二室连通。 第一室与两个流体通道中的另一个连通，并且第一孔形成在支撑件的下表面部分中以与第一室连通。 支撑体的下表面部分具有平坦表面和倒角或圆形边缘。 设置成包围支撑体的下表面部分的膜具有形成在与第一孔对应的位置处的多个第三孔，以通过真空吸收和保持晶片。

    POLISHING HEAD OF CHEMICAL MECHANICAL POLISHING APPARATUS AND POLISHING METHOD USING THE SAME
    7.
    发明申请
    POLISHING HEAD OF CHEMICAL MECHANICAL POLISHING APPARATUS AND POLISHING METHOD USING THE SAME 有权
    化学机械抛光装置的抛光头和使用其的抛光方法

    公开(公告)号：US20050153635A1

    公开(公告)日：2005-07-14

    申请号：US11075635

    申请日：2005-03-08

    申请人： Jae-Phil Boo ,  Jong-Soo Kim ,  Jun-Gyu Ryu ,  Sang-Seon Lee ,  Sun-Wung Lee

    发明人： Jae-Phil Boo ,  Jong-Soo Kim ,  Jun-Gyu Ryu ,  Sang-Seon Lee ,  Sun-Wung Lee

    IPC分类号： B24B41/06 ,  B24B1/00

    CPC分类号： B24B37/30 ,  B24B41/061

    摘要： A chemical mechanical polishing (CMP) apparatus includes a polishing head that is composed of a carrier and a membrane, and is positioned on a polishing pad of a supporting part. The polishing head has a supporter installed at an internal center of the carrier, a chucking ring positioned between the carrier and the supporter, and means for moving the chucking ring up and down in a vertical direction. The supporter forms a sealed space together with the membrane, and the chucking ring chucks the wafer in vacuum.

    摘要翻译： 化学机械抛光（CMP）装置包括由载体和膜构成的抛光头，并且位于支撑部件的抛光垫上。 抛光头具有安装在载体的内部中心的支撑件，位于载体和支撑件之间的卡环，以及用于沿垂直方向上下移动夹紧环的装置。 支撑件与膜一起形成密封空间，夹紧环将真空中的晶片夹紧。

    Carrier head of chemical mechanical polishing apparatus having barriers dividing pressure chamber into a plurality of pressure zones
    8.
    发明授权
    Carrier head of chemical mechanical polishing apparatus having barriers dividing pressure chamber into a plurality of pressure zones 失效
    具有将压力室分隔成多个压力区的障碍的化学机械抛光装置的承载头

    公开(公告)号：US07303466B2

    公开(公告)日：2007-12-04

    申请号：US10959113

    申请日：2004-10-07

    申请人： Jae-Phil Boo ,  Jue-Young Lee

    发明人： Jae-Phil Boo ,  Jue-Young Lee

    IPC分类号： B24B5/00 ,  B24B7/00 ,  B24B41/06

    CPC分类号： B24B37/30

    摘要： A carrier head of a chemical mechanical polishing apparatus has a support, an elastic membrane secured to the support and spaced from the bottom surface of the support so that a pressure chamber is defined between the membrane and the bottom surface of the support; and at least one annular barrier of elastic material extending from the bottom surface of the support. Each barrier has an annular partition portion that extends through the pressure chamber and divides the pressure chamber into respective pressure zones on opposite sides thereof, and an annular contact portion that abuts the membrane such that the barrier contacts the membrane but is not fixedly attached thereto. The contact portion includes a pair of annular flanges extending laterally in opposite directions at the lower end of the partition portion.

    摘要翻译： 化学机械抛光装置的承载头具有支撑件，弹性膜固定到支撑件并且与支撑件的底表面间隔开，使得在膜和支撑件的底表面之间限定压力室; 以及弹性材料的至少一个环形屏障，其从所述支撑件的底表面延伸。 每个挡板具有环形分隔部分，其延伸穿过压力室并将压力室分成相对侧的相应的压力区域，以及环形接触部分，该环形接触部分邻接膜，使得阻挡件接触膜而不固定地附接到膜片上。 接触部分包括在分隔部分的下端沿相反方向横向延伸的一对环形凸缘。

    Method for polishing a semiconductor wafer
    9.
    发明授权
    Method for polishing a semiconductor wafer 失效
    抛光半导体晶片的方法

    公开(公告)号：US07223158B2

    公开(公告)日：2007-05-29

    申请号：US11326555

    申请日：2006-01-05

    申请人： Jae-Phil Boo ,  Jun-Gyu Ryu ,  Sang-Seon Lee ,  Sun-Wung Lee

    发明人： Jae-Phil Boo ,  Jun-Gyu Ryu ,  Sang-Seon Lee ,  Sun-Wung Lee

    IPC分类号： B24B49/00

    CPC分类号： B24B37/30 ,  B24B37/32 ,  H01L21/304

    摘要： An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower edge of the carrier, forming a space for receiving the wafer, a supporter disposed in the carrier, and a flexible membrane disposed to be in contact with the wafer. The supporter has an upper surface portion, a lower surface portion, a plurality of first holes, a plurality of second holes, and a first chamber. The upper surface portion of the supporter forms a second chamber along with an inner surface of the carrier. The second chamber is in communication with one of the two fluid passages of the carrier and the second holes are formed in a lower surface portion of the supporter to communicate with the second chamber. The first chamber is in communication with the other one of the two fluid passages and the first holes are formed in the lower surface portion of the supporter to communicate with the first chamber. The lower surface portion of the supporter has a flat surface and a chamfered or rounded edge. The membrane disposed to enclose the lower surface portion of the supporter has a plurality of third holes formed at positions corresponding to the first holes to absorb and hold the wafer by vacuum.

    摘要翻译： 用于抛光晶片的装置包括具有设置在其上的研磨垫的支撑部分和设置在研磨垫上方的抛光头。 抛光头包括具有至少两个流体通道的载体，设置在载体的下边缘上的保持环，形成用于接收晶片的空间，设置在载体中的支撑体和设置成与载体接触的柔性膜 晶圆。 支撑体具有上表面部分，下表面部分，多个第一孔，多个第二孔和第一室。 支撑件的上表面部分与载体的内表面一起形成第二室。 第二室与载体的两个流体通道中的一个连通，并且第二孔形成在支撑件的下表面部分中以与第二室连通。 第一室与两个流体通道中的另一个连通，并且第一孔形成在支撑件的下表面部分中以与第一室连通。 支撑体的下表面部分具有平坦表面和倒角或圆形边缘。 设置成包围支撑体的下表面部分的膜具有形成在与第一孔对应的位置处的多个第三孔，以通过真空吸收和保持晶片。

    Apparatus and methods for polishing a semiconductor wafer
    10.
    发明申请
    Apparatus and methods for polishing a semiconductor wafer 失效
    用于抛光半导体晶片的装置和方法

    公开(公告)号：US20060116056A1

    公开(公告)日：2006-06-01

    申请号：US11326555

    申请日：2006-01-05

    申请人： Jae-Phil Boo ,  Jun-Gyu Ryu ,  Sang-Seon Lee ,  Sun-Wung Lee

    发明人： Jae-Phil Boo ,  Jun-Gyu Ryu ,  Sang-Seon Lee ,  Sun-Wung Lee

    IPC分类号： B24B1/00 ,  B24B7/30 ,  B24B29/00

    CPC分类号： B24B37/30 ,  B24B37/32 ,  H01L21/304

    摘要： An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower edge of the carrier, forming a space for receiving the wafer, a supporter disposed in the carrier, and a flexible membrane disposed to be in contact with the wafer. The supporter has an upper surface portion, a lower surface portion, a plurality of first holes, a plurality of second holes, and a first chamber. The upper surface portion of the supporter forms a second chamber along with an inner surface of the carrier. The second chamber is in communication with one of the two fluid passages of the carrier and the second holes are formed in a lower surface portion of the supporter to communicate with the second chamber. The first chamber is in communication with the other one of the two fluid passages and the first holes are formed in the lower surface portion of the supporter to communicate with the first chamber. The lower surface portion of the supporter has a flat surface and a chamfered or rounded edge. The membrane disposed to enclose the lower surface portion of the supporter has a plurality of third holes formed at positions corresponding to the first holes to absorb and hold the wafer by vacuum.

    摘要翻译： 用于抛光晶片的装置包括具有设置在其上的研磨垫的支撑部分和设置在研磨垫上方的抛光头。 抛光头包括具有至少两个流体通道的载体，设置在载体的下边缘上的保持环，形成用于接收晶片的空间，设置在载体中的支撑体和设置成与载体接触的柔性膜 晶圆。 支撑体具有上表面部分，下表面部分，多个第一孔，多个第二孔和第一室。 支撑件的上表面部分与载体的内表面一起形成第二室。 第二室与载体的两个流体通道中的一个连通，并且第二孔形成在支撑件的下表面部分中以与第二室连通。 第一室与两个流体通道中的另一个连通，并且第一孔形成在支撑件的下表面部分中以与第一室连通。 支撑体的下表面部分具有平坦表面和倒角或圆形边缘。 设置成包围支撑体的下表面部分的膜具有形成在与第一孔对应的位置处的多个第三孔，以通过真空吸收和保持晶片。