公开(公告)号：US20110088930A1

公开(公告)日：2011-04-21

申请号：US12651191

申请日：2009-12-31

Applicant: Jae-Seok LEE

Inventor： Jae-Seok LEE

IPC: H05K1/02 ,  B32B37/00

CPC classification number: H05K3/10 ,  H05K3/0097 ,  H05K3/061 ,  H05K3/205 ,  H05K3/22 ,  H05K3/28 ,  H05K3/421 ,  H05K3/428 ,  H05K3/4658 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2203/054 ,  H05K2203/0571 ,  H05K2203/0574

Abstract: A printed circuit board and a manufacturing method of the same are disclosed. The method includes: preparing a carrier including a primer resin layer formed thereon; forming a circuit pattern on the primer resin layer; stacking the carrier onto an insulating layer such that the circuit pattern is buried in the insulating layer; removing the carrier; forming a via hole in the insulating layer on which the primer resin layer is stacked; and forming a conductive via in the via hole. The conductive via is formed by forming a plating layer in the via hole and on the primer resin layer and removing a portion of the plating layer formed over the primer resin layer.

Abstract translation: 公开了一种印刷电路板及其制造方法。 该方法包括：制备其上形成有底漆树脂层的载体; 在底漆树脂层上形成电路图案; 将载体堆叠在绝缘层上，使得电路图案埋在绝缘层中; 移除载体; 在其上层叠有底漆树脂层的绝缘层中形成通孔; 以及在所述通孔中形成导电通孔。 导电孔通过在通孔中和底漆树脂层上形成镀层而除去在底漆树脂层上形成的镀层的一部分而形成。

公开(公告)号：US20080149827A1

公开(公告)日：2008-06-26

申请号：US11963662

申请日：2007-12-21

Applicant: Jae-Seok LEE ,  Heung-Bin LIM ,  Won-Kyung RYU ,  Seung-Ki CHAE ,  Yang-Koo LEE ,  Hun-Jung YI

Inventor： Jae-Seok LEE ,  Heung-Bin LIM ,  Won-Kyung RYU ,  Seung-Ki CHAE ,  Yang-Koo LEE ,  Hun-Jung YI

IPC: H01J49/26 ,  G01N21/00

CPC classification number: G01N21/94 ,  G01N21/718 ,  G01N21/9501 ,  H01L21/6838 ,  H01L21/68728 ,  H01L21/68785

Abstract: Provided is an apparatus and method for analyzing contaminants on a wafer. The apparatus includes: a wafer holder for supporting a wafer on which contaminants to be analyzed are located, a laser ablation device for irradiating a laser to the wafer to extract a discrete specimen from the wafer, an analysis cell for collecting a discrete specimen from the surface of the wafer by irradiating the laser, and an analysis device connected to the analysis cell for analyzing contaminants from the collected discrete specimen.

Abstract translation: 提供了一种用于分析晶片上的污染物的装置和方法。 该装置包括：晶片保持器，用于支撑要分析的污染物所在的晶片;激光烧蚀装置，用于将激光照射到晶片以从晶片提取离散的样本;分析单元，用于从 通过照射激光的晶片的表面，以及连接到分析单元的分析装置，用于分析来自收集的离散样本的污染物。