Abstract:
Described embodiments provide an X-ray detector and a method for driving the same. The X-ray detector includes: a sensor panel in which a plurality of pixels are defined, the plurality of pixels each including a photodiode for converting light corresponding to incident X-ray into an electric signal, and a switching element connected to one terminal of the photodiode to control the output of the electric signal; a light emitting unit for providing light to the photodiode; and a voltage supply unit connected to the other terminal of the photodiode to selectively supply first and second voltages different from each other.
Abstract:
A printed circuit board and a manufacturing method of the same are disclosed. The method includes: preparing a carrier including a primer resin layer formed thereon; forming a circuit pattern on the primer resin layer; stacking the carrier onto an insulating layer such that the circuit pattern is buried in the insulating layer; removing the carrier; forming a via hole in the insulating layer on which the primer resin layer is stacked; and forming a conductive via in the via hole. The conductive via is formed by forming a plating layer in the via hole and on the primer resin layer and removing a portion of the plating layer formed over the primer resin layer.
Abstract:
The present invention provides an apparatus for detecting metal concentration from an area including compounding a solution that includes a metal dissolved by a solvent, and a reagent combined with metal ions dissolved in the solution and referring a difference of absorption rates between a compound of the solvent and reagent and a compound of the solution and reagent.
Abstract:
The present invention provides methods for detecting metal concentration from an area including compounding a solution that includes a metal dissolved by a solvent, and a reagent combined with metal ions dissolved in the solution and referring a difference of absorption rates between a compound of the solvent and reagent and a compound of the solution and reagent. An apparatus for carrying out the processes described herein are also provided.
Abstract:
Disclosed is a sterilizing apparatus for footwear. The sterilizing apparatus includes a plane heater having a carbon fiber embedded heating paper, a pair of electrodes installed at one side of the carbon fiber embedded heating paper while being spaced from each other, and insulating members stacked on upper and lower portions of the carbon fiber embedded heating paper and edge portions of which are thermally bonded to each other; a housing made of a flexible material and formed at an inner peripheral portion thereof with an insertion groove, in which the housing has a power line receiving hole at a lower end of a bottom surface thereof, a cation generating material receiving hole, and a plurality of corrugated grooves; an AC/DC converter having a time display section and a timer setting section; and a cation generating material fixedly inserted into the cation generating material receiving hole by adhesive.
Abstract:
In one embodiment, a sample of chemical solution is provided. A first optical property of the sample is detected at a first wavelength and an expected optical property is predicted at a second wavelength, using the first optical property. A second optical property of the sample is detected at the second wavelength. The second optical property is compared with the expected optical property to measure a contamination level of a particular contaminant in the sample.
Abstract:
Disclosed is a sterilizing apparatus for footwear. The sterilizing apparatus includes a plane heater having a carbon fiber embedded heating paper, a pair of electrodes installed at one side of the carbon fiber embedded heating paper while being spaced from each other, and insulating members stacked on upper and lower portions of the carbon fiber embedded heating paper and edge portions of which are thermally bonded to each other; a housing made of a flexible material and formed at an inner peripheral portion thereof with an insertion groove, in which the housing has a power line receiving hole at a lower end of a bottom surface thereof, a cation generating material receiving hole, and a plurality of corrugated grooves; an AC/DC converter having a time display section and a timer setting section; and a cation generating material fixedly inserted into the cation generating material receiving hole by adhesive.
Abstract:
Disclosed herein are slurry compositions for use in CMP(chemical mechanical polishing) process of metal wiring in manufacturing semiconductor devices, comprising a peroxide, an inorganic acid, a propylenediaminetetraacetate(PDTA)-metal complex, a carboxylic acid, a metal oxide powder, and de-ionized water, wherein the PDTA-metal complex plays a major role in improving overall polishing performance and reproducibility thereof by preventing abraded tungsten oxide from readhesion onto the polished surface, as well as in improving the dispersion stability of the slurry composition.
Abstract:
There is disclosed a process for preparing a metal oxide CMP slurry suitable for semiconductor devices, wherein a mixture comprising 1 to 50 weight % of a metal oxide and 50 to 99 weight % of water is mixed in a pre-mixing tank, transferred to a dispersion chamber with the aid of a transfer pump, allowed to have a flow rate of not less than 100 m/sec by pressurization with a high pressure pump, and subjected to counter collision for dispersion through two orifices in the dispersion chamber. The slurry has particles which are narrow in particle size distribution, showing an ultrafine size ranging from 30 to 500 nm. Also, the slurry is not polluted at all during its preparation and shows no tailing phenomena, so that it is preventive of &mgr;-scratching. Therefore, it can be used in the planarization for shallow trench isolation, interlayer dielectrics and inter metal dielectrics through a CMP process.
Abstract:
Disclosed is a polishing composition which comprises an Al2O3/SiO2 composite-based metal oxide powder, deionized water and an additive, said metal oxide powder comprising an Al2O3/SiO2 composite as an essential component. The polishing composition is superior in removal rate and free of causing microscratches after polishing and thus, suitable for use in the global planarization of device wafer surfaces.
Abstract translation:公开了一种抛光组合物,其包含Al 2 O 3 / SiO 2复合基金属氧化物粉末,去离子水和添加剂,所述金属氧化物粉末包含Al 2 O 3 / SiO 2复合材料作为必要组分。 抛光组合物在去除速度上优异,并且在抛光后不会引起微细化,因此适用于器件晶片表面的全局平面化。