Abstract:
The present inventive concept provides a substrate treating apparatus and an exposing apparatus that a chuck member, a chuck cleaning member including a cleaning tool removing a foreign substance on a substrate loading surface of the chuck member and a tool cleaning member cleaning a cleaning tool are disposed to be adjacent to each other inside a treating room. The present inventive concept also provides a method of cleaning a cleaning tool using a tool cleaning member. According to the above the apparatuses and the method, contamination of a chuck member by a cleaning tool is prevented and a defocus phenomenon caused by a particle on a chuck member during an exposing process can be minimized.
Abstract:
In a composition for etching silicon oxide, and a method of forming a contact hole using the composition, the composition which includes from about 0.01 to about 2 percent by weight of ammonium bifluoride, from about 2 to about 35 percent by weight of an organic acid, from about 0.05 to about 1 percent by weight of an inorganic acid, and a remainder of a low polar organic solvent. The composition may reduce damages to a metal silicide pattern that may be exposed in an etching process performed for forming the contact hole.
Abstract:
A cleaning solution for an immersion photolithography system according to example embodiments may include an ether-based solvent, an alcohol-based solvent, and a semi-aqueous-based solvent. In the immersion photolithography system, a plurality of wafers coated with photoresist films may be exposed pursuant to an immersion photolithography process using an immersion fluid. The area contacted by the immersion fluid during the exposure process may accumulate contaminants. Accordingly, the area contacted by the immersion fluid during the exposure process may be washed with the cleaning solution according to example embodiments so as to reduce or prevent defects in the immersion photolithography system.
Abstract:
A cleaning composition is disclosed. The cleaning composition comprises about 80 to 99.8999 percent by weight of an ammonium fluoride aqueous solution, about 0.1 to 5 percent by weight of a buffering agent, and about 0.0001 to 15 percent by weight of a corrosion-inhibiting agent. A method of preparing the cleaning composition, a method of cleaning a substrate using the cleaning composition, and a method of manufacturing a semiconductor device using the cleaning composition are also disclosed.
Abstract:
A hydraulic circuit for an excavator is provided, which includes at least one first working device control valve having a first traveling control valve and a first boom control valve successively installed along a first center bypass line from a downstream side of a first hydraulic pump, at least one second working device control valve having a second traveling control valve and a second boom control valve successively installed along a second center bypass line from a downstream side of a second hydraulic pump, a third hydraulic pump providing fluid pressure to a swing motor installed on a third center bypass line, a swing control valve installed on a downstream side of the third hydraulic pump and shifted, in accordance with a valve switching signal input from the outside, to supply hydraulic fluid discharged from the third hydraulic pump to the swing motor, and a boom confluence line connected between an output port of the swing control valve and an input port of the boom control value to make the hydraulic fluid discharged from the third hydraulic pump join hydraulic fluid on the input port side of the boom control valve through the third center bypass line when the direction of the boom control valve is changed.
Abstract:
Provided is an apparatus and method for analyzing contaminants on a wafer. The apparatus includes: a wafer holder for supporting a wafer on which contaminants to be analyzed are located, a laser ablation device for irradiating a laser to the wafer to extract a discrete specimen from the wafer, an analysis cell for collecting a discrete specimen from the surface of the wafer by irradiating the laser, and an analysis device connected to the analysis cell for analyzing contaminants from the collected discrete specimen.
Abstract:
A hydraulic circuit for an excavator is provided, which includes at least one first working device control valve having a first traveling control valve and a first boom control valve successively installed along a first center bypass line from a downstream side of a first hydraulic pump, at least one second working device control valve having a second traveling control valve and a second boom control valve successively installed along a second center bypass line from a downstream side of a second hydraulic pump, a third hydraulic pump providing fluid pressure to a swing motor installed on a third center bypass line, a swing control valve installed on a downstream side of the third hydraulic pump and shifted, in accordance with a valve switching signal input from the outside, to supply hydraulic fluid discharged from the third hydraulic pump to the swing motor, and a boom confluence line connected between an output port of the swing control valve and an input port of the boom control value to make the hydraulic fluid discharged from the third hydraulic pump join hydraulic fluid on the input port side of the boom control valve through the third center bypass line when the direction of the boom control valve is changed.
Abstract:
A composition for removing a photoresist includes about 5 to about 20 percent by weight of an alcoholamide compound, about 15 to about 60 percent by weight of a polar aprotic solvent, about 0.1 to about 6 percent by weight of an additive, and pure water. The alcoholamide compound is chemically structured as follows: where R1 is a hydroxyl group or a hydroxyalkyl group, and R2 is a hydrogen atom or a hydroxyalkyl group.
Abstract:
A hydraulic system for construction equipment is provided, which can increase the driving speed of a corresponding working device by making hydraulic fluid of a hydraulic pump, which is added to the hydraulic system having two hydraulic pumps in the construction equipment, join hydraulic fluid on the working device side, and can intercept the supply of hydraulic fluid from the working device side to a traveling apparatus side when the working device and the traveling apparatus are simultaneously manipulated.
Abstract:
The present inventive concept provides a substrate treating apparatus and an exposing apparatus that a chuck member, a chuck cleaning member including a cleaning tool removing a foreign substance on a substrate loading surface of the chuck member and a tool cleaning member cleaning a cleaning tool are disposed to be adjacent to each other inside a treating room. The present inventive concept also provides a method of cleaning a cleaning tool using a tool cleaning member. According to the above the apparatuses and the method, contamination of a chuck member by a cleaning tool is prevented and a defocus phenomenon caused by a particle on a chuck member during an exposing process can be minimized.