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27 条记录 (耗时 0.025 秒)

    Handover parameter range control
    4.
    发明授权
    Handover parameter range control 有权
    切换参数范围控制

    公开(公告)号：US09392513B2

    公开(公告)日：2016-07-12

    申请号：US14383842

    申请日：2012-03-13

    申请人： Min Huang ,  Petter Bergman ,  Guo Chen ,  Xiaodong Yang

    发明人： Min Huang ,  Petter Bergman ,  Guo Chen ,  Xiaodong Yang

    IPC分类号： H04W36/00 ,  H04W36/24 ,  H04W36/18 ,  H04W28/08

    CPC分类号： H04W36/0094 ,  H04W28/08 ,  H04W36/0083

    摘要： The invention relates to a method and device (32) for adapting a range for a handover parameter used in a mobility function and a load balancing function for a first cell in relation to a second cell, where the device is implemented in a node (14) in the wireless communication network and comprises an event monitoring unit (34) configured to monitor handover events and a range setting unit (36) configured to determine the handover parameter range as well as to adapt the handover parameter range based on the monitored handover events.

    摘要翻译： 本发明涉及一种方法和装置（32），用于根据移动性功能中使用的切换参数的范围和相对于第二小区的第一小区的负载平衡功能来适配，其中所述设备在节点（14 ），并且包括被配置为监视切换事件的事件监视单元（34）和配置为确定切换参数范围的范围设置单元（36），并且基于所监视的切换事件来适配切换参数范围 。

    Heat sink and method of manufacturing the same
    5.
    发明授权
    Heat sink and method of manufacturing the same 有权
    散热器及其制造方法

    公开(公告)号：US08296947B2

    公开(公告)日：2012-10-30

    申请号：US12506213

    申请日：2009-07-20

    申请人： Peng Liu ,  Guo Chen ,  Shi-Wen Zhou ,  Chun-Chi Chen

    发明人： Peng Liu ,  Guo Chen ,  Shi-Wen Zhou ,  Chun-Chi Chen

    IPC分类号： B21D53/02 ,  H05K7/20

    CPC分类号： B21D53/085 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

    摘要： A heat sink includes a base with a plurality of recesses defined therein, a plurality of columned fins each having a head and a body extending from the head, and a cover joining with the base. Each head is received in and higher than a corresponding recess of the base. The heads are sandwiched between the cover and the base, whereby the columned fins are secured on the base. A portion of the cover contacting the head of each of the columned fins protrudes to form a deformed part. A method of manufacturing the heat sink is also disclosed.

    摘要翻译： 散热器包括：基部，其具有限定在其中的多个凹部;多个柱状散热片，各自具有从头部延伸的头部和主体;以及与基部接合的盖。 每个头部被接收在基座的相应凹部中并且高于基座的相应凹部。 头部被夹在盖和基座之间，由此将柱状翅片固定在基座上。 接触每个柱状翅片的头部的盖的一部分突出以形成变形部分。 还公开了一种制造散热器的方法。

    Electronic system with heat dissipation device
    6.
    发明授权
    Electronic system with heat dissipation device 有权
    具有散热装置的电子系统

    公开(公告)号：US07990719B2

    公开(公告)日：2011-08-02

    申请号：US12610388

    申请日：2009-11-02

    申请人： Guo Chen ,  Shi-Wen Zhou ,  Chun-Chi Chen

    发明人： Guo Chen ,  Shi-Wen Zhou ,  Chun-Chi Chen

    IPC分类号： H05K7/20 ,  G06F1/20

    CPC分类号： H05K7/20154

    摘要： A heat dissipation device is provided for dissipating heat generated by electronic components mounted on a printed circuit board in an electronic system. The electronic components have different heights. The heat dissipation device includes a connecting plate, at least two elastic members mounted on the connecting plate, and a heat sink having a substrate mounted on the connecting plate and located above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the substrate to attach the substrate on the one electronic component on the printed circuit board. A distance between the substrate and the connecting plate is adjustable by adjusting the joining members to make the substrate intimately contact the one electronic component.

    摘要翻译： 散热装置用于散发电子系统中安装在印刷电路板上的电子元件产生的热量。 电子元件具有不同的高度。 所述散热装置包括连接板，安装在所述连接板上的至少两个弹性部件和散热器，所述散热器具有安装在所述连接板上且位于所述电子部件之一上方的基板。 多个接合构件延伸穿过印刷电路板并与衬底接合以将衬底附着在印刷电路板上的一个电子部件上。 基板和连接板之间的距离可通过调节连接部件来调节，以使基板与一个电子部件紧密接触。

    Heat dissipation device having mounting brackets
    7.
    发明授权
    Heat dissipation device having mounting brackets 失效
    具有安装支架的散热装置

    公开(公告)号：US07493940B2

    公开(公告)日：2009-02-24

    申请号：US11309841

    申请日：2006-10-10

    申请人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Guo Chen ,  Li He ,  Peng Liu

    发明人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Guo Chen ,  Li He ,  Peng Liu

    IPC分类号： F24H3/02 ,  F28F9/00 ,  H05K7/20

    CPC分类号： H01L23/467 ,  H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat dissipation device (100) includes a heat sink (10) having a plurality of fins (14) and a plurality of mounting brackets (20) buckled with the fins of the heat sink. Each of the mounting brackets includes a mounting plate (22) mounted on a top of the heat sink and a baffle plate (26) extending from one side of the mounting plate to a bottom of the heat sink. The baffle plate terminates with a retaining plate (28). A plurality of fasteners (50) extends through the retaining plates to mount the heat dissipation device onto a printed circuit board. Self-tapping screws (40) are used to extend through the fan and the mounting plates of the mounting brackets and threadedly engage with the fins thereby mounting the fan on the heat sink.

    摘要翻译： 散热装置（100）包括散热片（10），散热片（10）具有多个散热片（14）和多个与散热片的翅片相互扣合的安装支架（20）。 每个安装支架包括安装在散热器顶部的安装板（22）和从安装板的一侧延伸到散热器底部的挡板（26）。 挡板终止于保持板（28）。 多个紧固件（50）延伸穿过保持板以将散热装置安装到印刷电路板上。 自攻螺钉（40）用于延伸通过风扇和安装支架的安装板，并与翅片螺纹接合，从而将风扇安装在散热器上。

    Electromotive toy processor with voice synchronisation
    8.
    发明申请
    Electromotive toy processor with voice synchronisation 审中-公开
    电动玩具处理器与语音同步

    公开(公告)号：US20060094326A1

    公开(公告)日：2006-05-04

    申请号：US11049701

    申请日：2005-02-04

    申请人： Guo Chen

    发明人： Guo Chen

    IPC分类号： A63H30/00

    CPC分类号： A63H3/28 ,  A63H11/18

    摘要： A toy typically in the form of a stuffed animal or character includes an electric motor adapted to animate parts of the toy, a sound transducer for reproducing sound signals, and a voice processor and amplifier connected to the sound transducer, an output of the voice processor and amplifier activating the electric motor to effect animation in synchronisation with sound signals reproduced by the sound transducer.

    摘要翻译： 通常以填充动物或字符的形式的玩具包括适于使玩具的部分动画生成动画的电动马达，用于再现声音信号的声音传感器，以及连接到声音传感器的语音处理器和放大器，语音处理器的输出 以及放大器激活电动机以与由声音传感器再现的声音信号同步地进行动画。

    Method of manufacturing heat sink
    10.
    发明授权
    Method of manufacturing heat sink 有权
    制造散热片的方法

    公开(公告)号：US08341842B2

    公开(公告)日：2013-01-01

    申请号：US12537267

    申请日：2009-08-07

    申请人： Guo Chen ,  Peng Liu ,  Shi-Wen Zhou ,  Chun-Chi Chen

    发明人： Guo Chen ,  Peng Liu ,  Shi-Wen Zhou ,  Chun-Chi Chen

    IPC分类号： B21D53/00

    CPC分类号： H01L21/4882 ,  H01L23/3672 ,  H01L23/3677 ,  H01L2924/0002 ,  Y10T29/4935 ,  Y10T29/49368 ,  H01L2924/00

    摘要： A method of manufacturing a heat sink includes, firstly, providing a plurality of fins each having a head and a body extending from the head, providing a base having a plurality of studs protruding from a top surface thereof, and providing a cover defining a plurality of recesses in a bottom thereof for receiving the heads of the fins and a plurality of orfices for receiving the studs. Next, the cover and the base are pressed to sandwich the heads of the fins therebetween. Then the studs of the base are punched to expand the studs and cause the studs to intimately engage with the cover.

    摘要翻译： 一种制造散热片的方法，首先是提供多个翅片，每个翅片均具有从头部延伸的头部和主体，提供具有从其顶表面突出的多个螺柱的基座，以及提供限定多个 的底部中的凹部用于接收翅片的头部和用于接收螺栓的多个凸起部。 接下来，按压盖和基座以将翅片的头部夹在其间。 然后冲压底座的螺栓以扩展螺柱，并使螺柱与盖子紧密接合。