Protecting cot packaged ICs during wave solder operations
    1.
    发明授权
    Protecting cot packaged ICs during wave solder operations 失效
    在波峰焊操作期间保护小童包装的IC

    公开(公告)号:US5488539A

    公开(公告)日:1996-01-30

    申请号:US184015

    申请日:1994-01-21

    IPC分类号: H05K1/11 H05K3/34 H05K7/20

    摘要: A method and apparatus is disclosed for protecting a solder pad for a chip on tape packaged integrated circuit mounted on a surface of a printed circuit board that is exposed to a wave soldering operation. A pad cover may be used to protect the solder pad. The pad cover is mounted over the solder pad in a manner that protects the solder pad from being exposed to solder during the wave solder operation. After the wave solder is completed, the cover is removed and the leads of the chip on tape packaged integrated circuit are connected to associated solder pad traces on the printed circuit board. This type of arrangement is particularly useful in arrangements which require a heat sink to cool the chip on tape packaged integrated circuit.

    摘要翻译: 公开了一种用于保护安装在暴露于波峰焊接操作的印刷电路板的表面上的带封装集成电路上的芯片的焊盘的方法和装置。 可以使用焊盘盖来保护焊盘。 焊盘盖安装在焊盘上,以便在波峰焊接操作期间保护焊垫不被暴露于焊料。 波峰焊完成后,盖子被移除,并且磁带封装集成电路上的芯片的引线连接到印刷电路板上的相关焊盘轨迹。 这种布置在需要散热器来冷却磁带封装集成电路上的芯片的布置中特别有用。

    Computer system motherboard stiffener
    2.
    发明授权
    Computer system motherboard stiffener 有权
    电脑系统主板加强筋

    公开(公告)号:US06362968B1

    公开(公告)日:2002-03-26

    申请号:US09340961

    申请日:1999-06-28

    IPC分类号: H05K714

    摘要: A stiffener for a printed circuit board where the stiffener is placed between the printed circuit board and a wall of the metal chassis in a computer system housing. The loaded printed circuit board may first be mounted on the stiffener, which, in turn, may then be mounted on the appropriate wall of the chassis along with the circuit board. Alternately, the stiffener may first be mounted on the appropriate chassis wall, and the circuit board may then be mounted on the stiffener. Additional circuit components may then be added onto the circuit board. The lies between the circuit board and the wall of the chassis on which the circuit board is being mounted. The back plane support provided by the stiffener may reduce damage to the conducting paths of the printed circuit board due to pressures exerted during component mounting, manufacture, transportation, etc. Additionally, a circuit board carrying densely populated electronic components may be easily mounted on or removed from the chassis without damage. Adequate board-to-chassis grounding may also be accomplished through the sheet metal stiffener frame. Horizontal and vertical struts in the stiffener frame may provide additional stiffness and rigidity in the vicinity of the high density connectors on the circuit board. Besides increased stability, unusually tight tolerances on the flatness of the circuit board surface near high density connectors may be achieved with the support provided by the stiffener.

    摘要翻译: 用于印刷电路板的加强件,其中加强件位于印刷电路板和计算机系统外壳中金属底盘的壁之间。 装载的印刷电路板可以首先安装在加强件上,然后可以将其与电路板一起安装在底盘的适当壁上。 或者,加强件可以首先安装在适当的底盘壁上,然后将电路板安装在加强件上。 然后可以将附加的电路部件添加到电路板上。 电路板和电路板正在安装的底盘的墙壁之间。 由加强件提供的背板支撑件可能由于在部件安装,制造,运输等过程中施加的压力而降低对印刷电路板的导电路径的损坏。此外,携带密集的电子部件的电路板可以容易地安装在 从机箱中取出而不损坏。 还可以通过金属板加强筋框架来实现足够的板对底盘接地。 加强框架中的水平和垂直支柱可以在电路板上的高密度连接器附近提供额外的刚度和刚性。 除了增加的稳定性之外,通过加强件提供的支撑可以实现在高密度连接器附近的电路板表面的平坦度上的非常紧密的公差。

    Method and apparatus for undirectional coolant flow control unit for pressurized cooling systems
    3.
    发明授权
    Method and apparatus for undirectional coolant flow control unit for pressurized cooling systems 有权
    用于加压冷却系统的不定向冷却剂流量控制单元的方法和装置

    公开(公告)号:US06502628B1

    公开(公告)日:2003-01-07

    申请号:US09639959

    申请日:2000-08-16

    IPC分类号: F28F1312

    摘要: The present invention is a method and apparatus for unidirectional coolant flow control unit for pressurized cooling systems. The invention comprises a valve on a coolant flow control unit. The valve remains in the open position during normal function of the coolant flow control unit. If the coolant flow control unit fails, the valve closes. Thus, the cooling system performs better than prior art cooling systems in the event of a failure of one or more coolant flow control units. In one embodiment, multiple improved coolant flow control units can be implemented wherein a flow of coolant enters one side of the system and exits the other side. In the even of a failure, the closure of the valve is caused by the shifting pressure within the system, which forestalls the cooling problems associated with prior art redundant coolant control flow systems.

    摘要翻译: 本发明是用于加压冷却系统的单向冷却剂流量控制单元的方法和装置。 本发明包括在冷却剂流量控制单元上的阀。 在冷却剂流量控制单元的正常功能期间阀保持在打开位置。 如果冷却液流量控制单元出现故障,阀门关闭。 因此,在一个或多个冷却剂流量控制单元发生故障的情况下,冷却系统的性能优于现有技术的冷却系统。 在一个实施例中,可以实现多个改进的冷却剂流量控制单元,其中冷却剂流进入系统的一侧并离开另一侧。 即使发生故障,阀门的关闭是由系统内的换档压力引起的,这将阻止与现有技术的冗余冷却剂控制流系统相关的冷却问题。

    Insertion and extraction mechanism for circuit boards
    4.
    发明授权
    Insertion and extraction mechanism for circuit boards 有权
    电路板的插拔机构

    公开(公告)号:US06975519B2

    公开(公告)日:2005-12-13

    申请号:US10417634

    申请日:2003-04-17

    IPC分类号: H05K7/14 H05K7/12

    CPC分类号: H05K7/1409

    摘要: A mechanism for insertion of a circuit board into a rack assembly and extraction of a circuit board from the rack assembly. The mechanism may include a pair of levers coupled to a circuit board assembly. First and second members may be coupled to each of the levers. The first member may be positionable to engage an engaging formation on a rack for insertion of the circuit board into the rack assembly. The second member may be positionable to engage the engaging formation for extraction of the circuit board from the rack assembly.

    摘要翻译: 用于将电路板插入机架组件并从机架组件提取电路板的机构。 该机构可以包括耦合到电路板组件的一对杆。 第一和第二构件可以联接到每个杠杆。 第一构件可以定位成将接合构件接合在齿条上以将电路板插入到机架组件中。 第二构件可以定位成接合用于从机架组件提取电路板的接合结构。

    Mechanical heat sink attachment having two pin headers and a spring clip
    5.
    发明授权
    Mechanical heat sink attachment having two pin headers and a spring clip 失效
    具有两个针头和弹簧夹的机械散热器附件

    公开(公告)号:US5734556A

    公开(公告)日:1998-03-31

    申请号:US670663

    申请日:1996-06-26

    IPC分类号: H01L23/40 H05K7/20

    摘要: An assembly for clamping a heat sink to an integrated circuit package that is mounted to printed circuit board. The assembly includes a pair of pin headers that are mounted to the printed circuit board. The assembly also contains a clip that is snapped onto the pin headers and presses the heat sink into the package. The pin headers each have a pair of posts that extend from a spacer. The posts are soldered to the printed circuit board to secure the headers to the board. The headers also have wire loops that extend from the spacers and capture the ends of the clip.

    摘要翻译: 用于将散热器夹持到安装到印刷电路板的集成电路封装的组件。 组件包括安装到印刷电路板的一对针头。 组件还包含一个卡扣,卡扣头部并将散热器压入包装中。 针头每个都具有从间隔件延伸的一对柱。 柱子焊接到印刷电路板上以将插头固定到电路板上。 集管还具有从间隔件延伸并捕获夹子的端部的线环。