公开(公告)号：US08067256B2

公开(公告)日：2011-11-29

申请号：US11864279

申请日：2007-09-28

申请人： Sabina J. Houle ,  James P. Mellody

发明人： Sabina J. Houle ,  James P. Mellody

IPC分类号： H01L21/00

CPC分类号： H01L23/36 ,  H01L21/563 ,  H01L23/4334 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73253 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2224/81 ,  H01L2924/00

摘要： A method of making a microelectronic package, and a microelectronic package made according to the method. The method includes: bonding and thermally coupling a plurality of IC dies to an IHS panel to yield a die-carrying IHS panel; mounting the die-carrying IHS panel onto a substrate panel including a plurality of package substrates to yield a combination including the die-carrying IHS panel mounted to the substrate panel; and singulating the combination to yield a plurality of microelectronic packages, each of the packages including: an IHS component of the IHS panel, one of the plurality IC dies bonded and thermally coupled to said IHS component and one of the plurality of package substrates, said IHS component and said one of the plurality of IC dies being mounted to said one of the plurality of package substrates to form said each of the packages.

摘要翻译： 一种制造微电子封装的方法，以及根据该方法制造的微电子封装。 该方法包括：将多个IC管芯结合并热耦合到IHS面板以产生携带芯片的IHS面板; 将带芯片的IHS面板安装到包括多个封装衬底的衬底面板上，以产生包括安装到衬底面板的芯片承载IHS面板的组合; 并且单独组合以产生多个微电子封装，每个封装包括：IHS面板的IHS部件，所述多个IC管芯中的一个结合并热耦合到所述IHS部件和所述多个封装基板中的一个，所述多个封装基板中的一个 IHS组件，并且所述多个IC管芯中的所述一个安装到所述多个封装衬底中的所述一个，以形成所述每个封装。

公开(公告)号：US20100079957A1

公开(公告)日：2010-04-01

申请号：US12242060

申请日：2008-09-30

申请人： Sabina J. Houle ,  James P. Mellody

发明人： Sabina J. Houle ,  James P. Mellody

IPC分类号： H05K7/20 ,  H01L21/50

CPC分类号： H01L23/3675 ,  H01L21/50 ,  H01L23/28 ,  H01L23/3142 ,  H01L23/34 ,  H01L23/3736 ,  H01L23/42 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2224/81 ,  H01L2224/0401

摘要： A method of making a microelectronic package, and a microelectronic package made according to the method. The method includes: bonding and thermally coupling a plurality of IC dies to an IHS panel to yield a die-carrying IHS panel, and mounting the die-carrying IHS panel onto a substrate panel including a plurality of package substrates by mounting perimeter ribs of the IHS panel to a corresponding pattern of sealant on the substrate panel and by mounting each of the plurality of dies to a corresponding one of the plurality of package substrates to yield a combination including the die-carrying IHS panel mounted to the substrate panel. Other embodiments are also disclosed and claimed.

摘要翻译： 一种制造微电子封装的方法，以及根据该方法制造的微电子封装。 该方法包括：将多个IC管芯结合并热耦合到IHS面板以产生载流子IHS面板，以及通过将周边肋条安装在包含多个封装衬底的衬底面板上来将芯片承载IHS面板安装 IHS面板到基板面板上的相应的密封剂图案，并且通过将多个模具中的每一个安装到多个封装衬底中的对应的一个封装衬底中，以产生包括安装到衬底面板的芯片承载IHS面板的组合。 还公开并要求保护其他实施例。

公开(公告)号：US20140312487A1

公开(公告)日：2014-10-23

申请号：US14320210

申请日：2014-06-30

申请人： Sabina J. Houle ,  James P. Mellody

发明人： Sabina J. Houle ,  James P. Mellody

IPC分类号： H01L23/28 ,  H01L23/34

CPC分类号： H01L23/3675 ,  H01L21/50 ,  H01L23/28 ,  H01L23/3142 ,  H01L23/34 ,  H01L23/3736 ,  H01L23/42 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2224/81 ,  H01L2224/0401

摘要： A method of making a microelectronic package, and a microelectronic package made according to the method. The method includes: bonding and thermally coupling a plurality of IC dies to an IHS panel to yield a die-carrying IHS panel, and mounting the die-carrying IHS panel onto a substrate panel including a plurality of package substrates by mounting perimeter ribs of the IHS panel to a corresponding pattern of sealant on the substrate panel and by mounting each of the plurality of dies to a corresponding one of the plurality of package substrates to yield a combination including the die-carrying IHS panel mounted to the substrate panel. Other embodiments are also disclosed and claimed.

摘要翻译： 一种制造微电子封装的方法，以及根据该方法制造的微电子封装。 该方法包括：将多个IC管芯结合并热耦合到IHS面板以产生载流子IHS面板，以及通过将周边肋条安装在包含多个封装衬底的衬底面板上来将芯片承载IHS面板安装 IHS面板到基板面板上的相应的密封剂图案，并且通过将多个模具中的每一个安装到多个封装衬底中的对应的一个封装衬底中，以产生包括安装到衬底面板的芯片承载IHS面板的组合。 还公开并要求保护其他实施例。

公开(公告)号：US08765528B2

公开(公告)日：2014-07-01

申请号：US13784528

申请日：2013-03-04

申请人： Sabina J. Houle ,  James P Mellody

发明人： Sabina J. Houle ,  James P Mellody

IPC分类号： H01L21/00

CPC分类号： H01L23/3675 ,  H01L21/50 ,  H01L23/28 ,  H01L23/3142 ,  H01L23/34 ,  H01L23/3736 ,  H01L23/42 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2224/81 ,  H01L2224/0401

摘要： A method of making a microelectronic package, and a microelectronic package made according to the method. The method includes: bonding and thermally coupling a plurality of IC dies to an IHS panel to yield a die-carrying IHS panel, and mounting the die-carrying IHS panel onto a substrate panel including a plurality of package substrates by mounting perimeter ribs of the IHS panel to a corresponding pattern of sealant on the substrate panel and by mounting each of the plurality of dies to a corresponding one of the plurality of package substrates to yield a combination including the die-carrying IHS panel mounted to the substrate panel. Other embodiments are also disclosed and claimed.

摘要翻译： 一种制造微电子封装的方法，以及根据该方法制造的微电子封装。 该方法包括：将多个IC管芯结合并热耦合到IHS面板以产生载流子IHS面板，以及通过将周边肋条安装在包含多个封装衬底的衬底面板上来将芯片承载IHS面板安装 IHS面板到基板面板上的相应的密封剂图案，并且通过将多个模具中的每一个安装到多个封装衬底中的对应的一个封装衬底中，以产生包括安装到衬底面板的芯片承载IHS面板的组合。 还公开并要求保护其他实施例。

公开(公告)号：US20130168846A1

公开(公告)日：2013-07-04

申请号：US13784528

申请日：2013-03-04

申请人： Sabina J. Houle ,  James P. Mellody

发明人： Sabina J. Houle ,  James P. Mellody

IPC分类号： H01L23/34 ,  H01L21/50

CPC分类号： H01L23/3675 ,  H01L21/50 ,  H01L23/28 ,  H01L23/3142 ,  H01L23/34 ,  H01L23/3736 ,  H01L23/42 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2224/81 ,  H01L2224/0401

摘要： A method of making a microelectronic package, and a microelectronic package made according to the method. The method includes: bonding and thermally coupling a plurality of IC dies to an IHS panel to yield a die-carrying IHS panel, and mounting the die-carrying IHS panel onto a substrate panel including a plurality of package substrates by mounting perimeter ribs of the IHS panel to a corresponding pattern of sealant on the substrate panel and by mounting each of the plurality of dies to a corresponding one of the plurality of package substrates to yield a combination including the die-carrying IHS panel mounted to the substrate panel. Other embodiments are also disclosed and claimed.

摘要翻译： 一种制造微电子封装的方法，以及根据该方法制造的微电子封装。 该方法包括：将多个IC管芯结合并热耦合到IHS面板以产生载流子IHS面板，以及通过将周边肋条安装在包含多个封装衬底的衬底面板上来将芯片承载IHS面板安装 IHS面板到基板面板上的相应的密封剂图案，并且通过将多个模具中的每一个安装到多个封装衬底中的对应的一个封装衬底中，以产生包括安装到衬底面板的芯片承载IHS面板的组合。 还公开并要求保护其他实施例。

公开(公告)号：US20080156895A1

公开(公告)日：2008-07-03

申请号：US11617819

申请日：2006-12-29

申请人： James P. Mellody ,  Sabina J. Houle ,  James C. Matayabas ,  Oswald L. Skeete

发明人： James P. Mellody ,  Sabina J. Houle ,  James C. Matayabas ,  Oswald L. Skeete

IPC分类号： B05B5/00

CPC分类号： H05K3/0091 ,  H05K3/3489 ,  H05K2203/105 ,  H05K2203/1366

摘要： Apparatus and systems, as well as methods and articles, may operate to charge a quantity of flux using a first charge to provide a charged flux portion, dispense the charged flux portion toward a circuit, and direct distribution of the charged flux portion using a second charge to attract or repel the charged flux portion. Other embodiments are described and claimed.

摘要翻译： 设备和系统以及方法和物品可以操作以使用第一电荷对一定量的通量进行充电以提供电荷通量部分，将电荷通量部分分配给电路，并且使用第二电荷直接分配电荷通量部分 充电以吸引或排斥电荷通量部分。 描述和要求保护其他实施例。

公开(公告)号：US08390112B2

公开(公告)日：2013-03-05

申请号：US12242060

申请日：2008-09-30

申请人： Sabina J. Houle ,  James P. Mellody

发明人： Sabina J. Houle ,  James P. Mellody

IPC分类号： H01L23/34

CPC分类号： H01L23/3675 ,  H01L21/50 ,  H01L23/28 ,  H01L23/3142 ,  H01L23/34 ,  H01L23/3736 ,  H01L23/42 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2224/81 ,  H01L2224/0401

摘要： A method of making a microelectronic package, and a microelectronic package made according to the method. The method includes: bonding and thermally coupling a plurality of IC dies to an IHS panel to yield a die-carrying IHS panel, and mounting the die-carrying IHS panel onto a substrate panel including a plurality of package substrates by mounting perimeter ribs of the IHS panel to a corresponding pattern of sealant on the substrate panel and by mounting each of the plurality of dies to a corresponding one of the plurality of package substrates to yield a combination including the die-carrying IHS panel mounted to the substrate panel. Other embodiments are also disclosed and claimed.

公开(公告)号：US20110291304A1

公开(公告)日：2011-12-01

申请号：US13206408

申请日：2011-08-09

申请人： Sabina J. Houle ,  James P. Mellody

发明人： Sabina J. Houle ,  James P. Mellody

IPC分类号： H01L23/31

CPC分类号： H01L23/36 ,  H01L21/563 ,  H01L23/4334 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73253 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2224/81 ,  H01L2924/00

摘要： A method of making a microelectronic package, and a microelectronic package made according to the method. The method includes: bonding and thermally coupling a plurality of IC dies to an IHS panel to yield a die-carrying IHS panel; mounting the die-carrying IHS panel onto a substrate panel including a plurality of package substrates to yield a combination including the die-carrying IHS panel mounted to the substrate panel; and singulating the combination to yield a plurality of microelectronic packages, each of the packages including: an IHS component of the IHS panel, one of the plurality IC dies bonded and thermally coupled to said IHS component, and one of the plurality of package substrates, said IHS component and said one of the plurality of IC dies being mounted to said one of the plurality of package substrates to form said each of the packages.

摘要翻译： 一种制造微电子封装的方法，以及根据该方法制造的微电子封装。 该方法包括：将多个IC管芯结合并热耦合到IHS面板以产生携带芯片的IHS面板; 将带芯片的IHS面板安装到包括多个封装衬底的衬底面板上，以产生包括安装到衬底面板的芯片承载IHS面板的组合; 并且单独组合以产生多个微电子封装，每个封装包括：IHS面板的IHS部件，所述多个IC管芯中的一个结合并热耦合到所述IHS部件，并且所述多个封装衬底之一， 所述IHS部件和所述多个IC管芯中的所述一个安装到所述多个封装衬底中的所述一个，以形成所述每个封装。

公开(公告)号：US20090085195A1

公开(公告)日：2009-04-02

申请号：US11864279

申请日：2007-09-28

申请人： Sabina J. Houle ,  James P. Mellody

发明人： Sabina J. Houle ,  James P. Mellody

IPC分类号： H01L23/34 ,  H01L21/00

CPC分类号： H01L23/36 ,  H01L21/563 ,  H01L23/4334 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73253 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2224/81 ,  H01L2924/00

摘要： A method of making a microelectronic package, and a microelectronic package made according to the method. The method includes: bonding and thermally coupling a plurality of IC dies to an IHS panel to yield a die-carrying IHS panel; mounting the die-carrying IHS panel onto a substrate panel including a plurality of package substrates to yield a combination including the die-carrying IHS panel mounted to the substrate panel; and singulating the combination to yield a plurality of microelectronic packages, each of the packages including: an IHS component of the IHS panel, one of the plurality IC dies bonded and thermally coupled to said IHS component and one of the plurality of package substrates, said IHS component and said one of the plurality of IC dies being mounted to said one of the plurality of package substrates to form said each of the packages.

摘要翻译： 一种制造微电子封装的方法，以及根据该方法制造的微电子封装。 该方法包括：将多个IC管芯结合并热耦合到IHS面板以产生携带芯片的IHS面板; 将带芯片的IHS面板安装到包括多个封装衬底的衬底面板上，以产生包括安装到衬底面板的芯片承载IHS面板的组合; 并且单独组合以产生多个微电子封装，每个封装包括：IHS面板的IHS部件，所述多个IC管芯中的一个结合并热耦合到所述IHS部件和所述多个封装基板中的一个，所述多个封装基板中的一个 IHS组件，并且所述多个IC管芯中的所述一个安装到所述多个封装衬底中的所述一个，以形成所述每个封装。

公开(公告)号：US07364943B2

公开(公告)日：2008-04-29

申请号：US11133009

申请日：2005-05-18

申请人： James P. Mellody ,  Sabina J. Houle

发明人： James P. Mellody ,  Sabina J. Houle

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01L23/485 ,  H01L23/488 ,  H01L23/52 ,  H01L23/48

CPC分类号： H01L21/563 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/81193 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method and an arrangement to bond a die to a substrate of a die-substrate combination to form a microelectronic package. The method comprises: providing the die-substrate combination including a die, a substrate, pre-connection bumps and an underfill material, the pre-connection bumps and underfill material being disposed between the die and the substrate; forming joints from the pre-connection bumps at a joint formation site to obtain an intermediate package; curing the underfill material of the intermediate package at an underfill curing site to obtain the microelectronic package; using a conveying device to transfer the intermediate package from the joint formation site to the underfill curing site; and applying heat energy to the intermediate package during at least part of a transfer thereof from the joint formation site to the underfill curing site to control a temperature of the intermediate package.

摘要翻译： 一种将管芯结合到管芯 - 衬底组合的衬底以形成微电子封装的方法和装置。 该方法包括：提供包括模具，基板，预连接凸块和底部填充材料的模具 - 基板组合，预连接凸块和底部填充材料设置在模具和基板之间; 在接头形成位置从预连接凸起形成接头以获得中间包装; 在底部填充固化位置固化中间包装的底部填充材料以获得微电子封装; 使用输送装置将中间包装从接合形成位置转移到底部填充固化位点; 以及在其从接合形成部位至底部填充固化部位的至少部分转移期间将热能施加到中间包装，以控制中间包装的温度。