LED PACKAGE WITH CONVERGING EXTRACTOR
    1.
    发明申请
    LED PACKAGE WITH CONVERGING EXTRACTOR 审中-公开
    LED包装与收缩提取器

    公开(公告)号:US20080012034A1

    公开(公告)日:2008-01-17

    申请号:US11778385

    申请日:2007-07-16

    IPC分类号: H01L33/00

    摘要: In one aspect, the present application discloses a light source comprising an LED die optically coupled to an extractor comprising a plurality of optical elements each having a base, an apex smaller than the base, and a converging side extending between the base and the apex. The extractor base is no greater in size than the emitting surface of the LED die. In another aspect, methods of making light sources are disclosed, comprising the steps of providing an LED die having an emitting surface; forming a plurality of optical elements each having a base, an apex smaller than the base, and a converging side extending between the base and the apex; arranging the plurality of optical elements to form an extractor, the extractor having an extractor base no greater in size than the emitting surface; and optically coupling the extractor base to the emitting surface of the LED die.

    摘要翻译: 在一个方面,本申请公开了一种光源,其包括光学耦合到提取器的LED管芯,所述提取器包括多个光学元件,每个光学元件具有基部,比所述基部小的顶点以及在所述基部和所述顶点之间延伸的会聚侧。 提取器基座的尺寸不大于LED管芯的发射表面。 在另一方面,公开了制造光源的方法,包括以下步骤:提供具有发射表面的LED管芯; 形成多个光学元件,每个光学元件具有基部,顶点小于基部,以及在基部和顶点之间延伸的会聚侧; 布置所述多个光学元件以形成提取器,所述提取器具有不大于所述发射表面的尺寸的提取器基座; 并将提取器基底光学耦合到LED管芯的发射表面。

    Methods of Making LED Extractor Arrays
    3.
    发明申请
    Methods of Making LED Extractor Arrays 有权
    制造LED提取器阵列的方法

    公开(公告)号:US20070256453A1

    公开(公告)日:2007-11-08

    申请号:US11381512

    申请日:2006-05-03

    IPC分类号: C03B19/09

    摘要: A molding operation produces an extractor array by providing a mold having a plurality of cavities therein, each cavity being adapted to form an extractor suitable for coupling to an LED die; filling the mold with a plurality of glass particles; heating the glass particles above glass transition temperatures thereof so that the particles are reshaped to conform to the cavity shapes; and forming a land layer that extends between the cavities. The land layer maintains the extractors in a fixed spatial relationship with each other for subsequent handling or processing, such as a simultaneous polishing operation or in attaching the extractor array to a corresponding LED array.

    摘要翻译: 模制操作通过提供其中具有多个空腔的模具来产生提取器阵列,每个空腔适于形成适于耦合到LED管芯的提取器; 用多个玻璃颗粒填充模具; 将玻璃颗粒加热到其玻璃化转变温度之上,使得颗粒重新成形以符合腔体形状; 以及形成在空腔之间延伸的平台层。 地面层将提取器彼此保持固定的空间关系,用于随后的处理或处理,例如同时抛光操作或将提取器阵列附接到相应的LED阵列。

    LED PACKAGE WITH WEDGE-SHAPED OPTICAL ELEMENT
    4.
    发明申请
    LED PACKAGE WITH WEDGE-SHAPED OPTICAL ELEMENT 审中-公开
    LED封装与楔形光学元件

    公开(公告)号:US20070257270A1

    公开(公告)日:2007-11-08

    申请号:US11381293

    申请日:2006-05-02

    IPC分类号: H01L33/00

    摘要: In one aspect, the present application discloses a light source comprising an LED die having an emitting surface and an optical element having a base, two converging sides, and two diverging sides, wherein the base is optically coupled to the emitting surface. In another aspect, the present application discloses a light source comprising an LED die having an emitting surface and a high index optical element optically coupled to the LED die and shaped to direct light emitted by the LED die to produce a side emitting pattern having two lobes.

    摘要翻译: 在一个方面,本申请公开了一种光源,其包括具有发射表面的LED管芯和具有基座,两个会聚侧面和两个发散侧面的光学元件,其中所述基座光学耦合到所述发射表面。 在另一方面,本申请公开了一种光源,其包括具有发射表面的LED管芯和与LED管芯光学耦合的高折射率光学元件,其被成形为引导由LED管芯发射的光以产生具有两个凸角的侧面发射图案 。

    LED PACKAGE WITH COMPOUND CONVERGING OPTICAL ELEMENT
    7.
    发明申请
    LED PACKAGE WITH COMPOUND CONVERGING OPTICAL ELEMENT 有权
    LED封装与复合光学元件

    公开(公告)号:US20070258246A1

    公开(公告)日:2007-11-08

    申请号:US11381329

    申请日:2006-05-02

    IPC分类号: F21Y101/02

    摘要: The present application discloses a light source comprising an LED die having an emitting surface and an optical element including a base, an apex, the base, and a converging side joining the base and the apex, wherein the base is optically coupled to the emitting surface. Furthermore, the optical element comprises a first section including the base and that is composed of a first material and a second section including the apex and that is composed of a second material.

    摘要翻译: 本申请公开了一种光源,其包括具有发射表面的LED管芯和包括基部,顶点,基部和接合基部和顶点的会聚侧的光学元件,其中基部光学耦合到发射表面 。 此外,光学元件包括包括基座的第一部分,并且由第一材料和包括顶点的第二部分组成并且由第二材料构成。

    High brightness LED package with multiple optical elements
    8.
    发明申请
    High brightness LED package with multiple optical elements 有权
    具有多个光学元件的高亮度LED封装

    公开(公告)号:US20060092532A1

    公开(公告)日:2006-05-04

    申请号:US10977248

    申请日:2004-10-29

    IPC分类号: G02B7/02

    CPC分类号: H01L33/54 H01L33/60

    摘要: A light source includes an LED die with an emitting surface and a plurality of optical elements having input surfaces in optical contact with distinct portions of the emitting surface. The optical elements can comprise tapers or concentrators that have reflective side surface(s) and output surfaces larger than the respective input surfaces. The optical elements can couple both light and heat out of the emitting surface of the LED die.

    摘要翻译: 光源包括具有发射表面的LED管芯和具有与发射表面的不同部分光学接触的输入表面的多个光学元件。 光学元件可以包括具有反射侧表面和大于相应输入表面的输出表面的锥形或集中器。 光学元件可以将光和热耦合到LED管芯的发射表面之外。

    High brightness LED package with compound optial element(s)
    9.
    发明申请
    High brightness LED package with compound optial element(s) 有权
    具有复合光学元件的高亮度LED封装

    公开(公告)号:US20060091798A1

    公开(公告)日:2006-05-04

    申请号:US10977225

    申请日:2004-10-29

    IPC分类号: H05B33/00 H05B33/04

    摘要: A light source includes an LED die with an emitting surface and a collimating optical element. The optical element includes an input surface in optical contact with the LED emitting surface, and an output surface. The optical element has a first portion that comprises the input surface, made of a first optical material, and a second portion that comprises the output surface, made of a second optical material. The first optical material, which may include sapphire, diamond, or silicon carbide, has a higher refractive index, thermal conductivity, or both relative to the second optical material.

    摘要翻译: 光源包括具有发射表面的LED管芯和准直光学元件。 光学元件包括与LED发射表面光学接触的输入表面和输出表面。 光学元件具有包括由第一光学材料制成的输入表面的第一部分和包括由第二光学材料制成的输出表面的第二部分。 可以包括蓝宝石,金刚石或碳化硅的第一光学材料相对于第二光学材料具有更高的折射率,导热性或两者。

    High brightness led package
    10.
    发明申请
    High brightness led package 审中-公开
    高亮度LED封装

    公开(公告)号:US20080035945A1

    公开(公告)日:2008-02-14

    申请号:US11973481

    申请日:2007-10-09

    IPC分类号: H01L29/22

    CPC分类号: H01L33/58 H01L33/54 H01L33/60

    摘要: Light sources are disclosed utilizing LED dies that have a light emitting surface. A patterned low refractive index layer that can support total internal reflection within the LED die is provided in optical contact with a first portion of the emitting surface. In optical contact with a second portion of the emitting surface is an input surface of an optical element. The refractive index of the low index layer is below both that of the optical element and the LED die. The optical element can have a variety of shapes and sizes.

    摘要翻译: 利用具有发光表面的LED管芯来公开光源。 提供可以支持LED管芯内的全内反射的图案化低折射率层与发射表面的第一部分光学接触地提供。 在与发光表面的第二部分的光学接触中是光学元件的输入表面。 低折射率层的折射率低于光学元件和LED管芯的折射率。 光学元件可以具有各种形状和尺寸。