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    LED PACKAGE WITH WEDGE-SHAPED OPTICAL ELEMENT
    1.
    发明申请
    LED PACKAGE WITH WEDGE-SHAPED OPTICAL ELEMENT 审中-公开
    LED封装与楔形光学元件

    公开(公告)号：US20070257270A1

    公开(公告)日：2007-11-08

    申请号：US11381293

    申请日：2006-05-02

    Applicant: Dong Lu ,  Andrew Ouderkirk ,  Catherine Leatherdale

    Inventor： Dong Lu ,  Andrew Ouderkirk ,  Catherine Leatherdale

    IPC: H01L33/00

    CPC classification number: H01L33/58 ,  G02B19/0028 ,  G02B19/0061 ,  G02B19/0071 ,  G02B21/33 ,  H01L25/0753 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: In one aspect, the present application discloses a light source comprising an LED die having an emitting surface and an optical element having a base, two converging sides, and two diverging sides, wherein the base is optically coupled to the emitting surface. In another aspect, the present application discloses a light source comprising an LED die having an emitting surface and a high index optical element optically coupled to the LED die and shaped to direct light emitted by the LED die to produce a side emitting pattern having two lobes.

    Abstract translation: 在一个方面，本申请公开了一种光源，其包括具有发射表面的LED管芯和具有基座，两个会聚侧面和两个发散侧面的光学元件，其中所述基座光学耦合到所述发射表面。 在另一方面，本申请公开了一种光源，其包括具有发射表面的LED管芯和与LED管芯光学耦合的高折射率光学元件，其被成形为引导由LED管芯发射的光以产生具有两个凸角的侧面发射图案 。

    ARRAYS OF LIGHT EMITTING ARTICLES AND METHOD OF MANUFACTURING SAME
    2.
    发明申请
    ARRAYS OF LIGHT EMITTING ARTICLES AND METHOD OF MANUFACTURING SAME 有权
    发光体系的阵列及其制造方法

    公开(公告)号：US20070176192A1

    公开(公告)日：2007-08-02

    申请号：US11561154

    申请日：2006-11-17

    Applicant: Catherine Leatherdale ,  Timothy Fletcher ,  Paul Lugg

    Inventor： Catherine Leatherdale ,  Timothy Fletcher ,  Paul Lugg

    IPC: H01L33/00

    CPC classification number: H01L33/58 ,  G02B19/0028 ,  G02B19/0061 ,  G02B19/0066 ,  H01L27/153 ,  H01L33/0079 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Light-emitting articles and methods of manufacturing such articles are disclosed. In one aspect, a light emitting article includes an optical element having an input and an output aperture, each having a size. An LED die having a size is optically coupled to the optical element. The output aperture size of the optical element matches the LED die size. In another aspect, an array of light-emitting articles includes an array of optical elements having a lapped input aperture surface, and an array of LED dies optically coupled to the optical elements at the input aperture. In another aspect, an array of light-emitting articles includes an array of optical elements, and an array of LED dies, each LED die having a size. Each LED die is optically coupled to an optical element at the input aperture. The output aperture size of the optical element is matched to the LED die size.

    Abstract translation: 公开了发光制品及其制造方法。 在一个方面，发光物品包括具有输入和输出孔径的光学元件，每个具有一个尺寸。 具有尺寸的LED管芯光学耦合到光学元件。 光学元件的输出孔径尺寸与LED管芯尺寸相匹配。 在另一方面，发光制品阵列包括具有重叠的输入孔表面的光学元件阵列，以及在输入孔光学耦合到光学元件的LED管芯阵列。 在另一方面，一种发光制品阵列包括一组光学元件和一个LED管芯阵列，每个LED管芯具有一个尺寸。 每个LED管芯在输入孔处光耦合到光学元件。 光学元件的输出孔径尺寸与LED管芯尺寸相匹配。

    High brightness LED package with multiple optical elements
    4.
    发明申请
    High brightness LED package with multiple optical elements 有权
    具有多个光学元件的高亮度LED封装

    公开(公告)号：US20060092532A1

    公开(公告)日：2006-05-04

    申请号：US10977248

    申请日：2004-10-29

    Applicant: Andrew Ouderkirk ,  Catherine Leatherdale

    Inventor： Andrew Ouderkirk ,  Catherine Leatherdale

    IPC: G02B7/02

    CPC classification number: H01L33/54 ,  H01L33/60

    Abstract: A light source includes an LED die with an emitting surface and a plurality of optical elements having input surfaces in optical contact with distinct portions of the emitting surface. The optical elements can comprise tapers or concentrators that have reflective side surface(s) and output surfaces larger than the respective input surfaces. The optical elements can couple both light and heat out of the emitting surface of the LED die.

    Abstract translation: 光源包括具有发射表面的LED管芯和具有与发射表面的不同部分光学接触的输入表面的多个光学元件。 光学元件可以包括具有反射侧表面和大于相应输入表面的输出表面的锥形或集中器。 光学元件可以将光和热耦合到LED管芯的发射表面之外。

    High brightness LED package with compound optial element(s)
    5.
    发明申请
    High brightness LED package with compound optial element(s) 有权
    具有复合光学元件的高亮度LED封装

    公开(公告)号：US20060091798A1

    公开(公告)日：2006-05-04

    申请号：US10977225

    申请日：2004-10-29

    Applicant: Andrew Ouderkirk ,  Catherine Leatherdale

    Inventor： Andrew Ouderkirk ,  Catherine Leatherdale

    IPC: H05B33/00 ,  H05B33/04

    CPC classification number: H01L33/54 ,  H01L33/44 ,  Y10S362/80

    Abstract: A light source includes an LED die with an emitting surface and a collimating optical element. The optical element includes an input surface in optical contact with the LED emitting surface, and an output surface. The optical element has a first portion that comprises the input surface, made of a first optical material, and a second portion that comprises the output surface, made of a second optical material. The first optical material, which may include sapphire, diamond, or silicon carbide, has a higher refractive index, thermal conductivity, or both relative to the second optical material.

    Abstract translation: 光源包括具有发射表面的LED管芯和准直光学元件。 光学元件包括与LED发射表面光学接触的输入表面和输出表面。 光学元件具有包括由第一光学材料制成的输入表面的第一部分和包括由第二光学材料制成的输出表面的第二部分。 可以包括蓝宝石，金刚石或碳化硅的第一光学材料相对于第二光学材料具有更高的折射率，导热性或两者。

    High brightness led package
    7.
    发明申请
    High brightness led package 审中-公开
    高亮度LED封装

    公开(公告)号：US20080035945A1

    公开(公告)日：2008-02-14

    申请号：US11973481

    申请日：2007-10-09

    Applicant: Andrew Ouderkirk ,  Catherine Leatherdale ,  Arlie Connor

    Inventor： Andrew Ouderkirk ,  Catherine Leatherdale ,  Arlie Connor

    IPC: H01L29/22

    CPC classification number: H01L33/58 ,  H01L33/54 ,  H01L33/60

    Abstract: Light sources are disclosed utilizing LED dies that have a light emitting surface. A patterned low refractive index layer that can support total internal reflection within the LED die is provided in optical contact with a first portion of the emitting surface. In optical contact with a second portion of the emitting surface is an input surface of an optical element. The refractive index of the low index layer is below both that of the optical element and the LED die. The optical element can have a variety of shapes and sizes.

    Abstract translation: 利用具有发光表面的LED管芯来公开光源。 提供可以支持LED管芯内的全内反射的图案化低折射率层与发射表面的第一部分光学接触地提供。 在与发光表面的第二部分的光学接触中是光学元件的输入表面。 低折射率层的折射率低于光学元件和LED管芯的折射率。 光学元件可以具有各种形状和尺寸。

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