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公开(公告)号：US5547119A
公开(公告)日：1996-08-20
申请号：US449128
申请日：1995-05-24
CPC分类号： H02K15/03 , H02K1/2793 , H02K21/24
摘要： The method of intimately joining a hard magnetic part to a soft magnetic part in the manufacture of an electrical machine comprising polishing the joining surfaces such that the surface roughness hight is about less than or equal to two nanometers and joining the parts by direct bonding.
摘要翻译： 在制造电机中将硬磁性部件紧密地连接到软磁性部件上的方法，包括抛光接合表面，使得表面粗糙度高度为大约小于或等于2纳米，并通过直接粘合将部件接合。
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公开(公告)号：US5483115A
公开(公告)日：1996-01-09
申请号：US284714
申请日：1994-08-02
CPC分类号： H02K15/03 , H02K1/2793 , H02K21/24
摘要： An electrical machine comprises a stationary first section (1) and a second section (5) which is movable relative to the stationary section. At least one of the sections comprises a soft-magnetic part (7) and a hard-magnetic part (9). A surface (7a) of the soft-magnetic part and a surface (9a) of the hard-magnetic part are fixed intimately to one another by direct bonding.
摘要翻译： 电机包括固定第一部分（1）和可相对于固定部分移动的第二部分（5）。 至少一个部分包括软磁部分（7）和硬磁部分（9）。 软磁性部件的表面（7a）和硬磁性部件的表面（9a）通过直接接合彼此紧密地固定。
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3.发明授权Method of manufacturing a plate having a plane main surface, method of manufacturing a plate having parallel main surfaces, and device suitable for implementing said methods 失效制造具有平面主表面的板的方法，制造具有平行主表面的板的方法以及适于实现所述方法的装置
公开(公告)号：US5441442A
公开(公告)日：1995-08-15
申请号：US71908
申请日：1993-06-03
摘要： Methods and device for manufacturing a plate with a plane main surface or with parallel main surfaces, whereby material is taken off from the edges of the plate and from the central portion of the plate alternately by means of polishing in order to obtain main surfaces having a convex, plane, or concave shape. Polishing is stopped after at least one transition from convex to concave or vice versa at the moment at which the main surface has a substantially plane shape or has substantially parallel main surfaces.
摘要翻译： 用于制造具有平面主表面或平行主表面的板的方法和装置，由此通过抛光交替地从板的边缘和板的中心部分剥离材料，以获得主表面具有 凸形，平面或凹形。 在主表面具有大致平面形状或具有基本上平行的主表面的时刻，在从凸到凹之间至少一次过渡之后停止抛光。
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4.发明授权
公开(公告)号：US5622525A
公开(公告)日：1997-04-22
申请号：US213768
申请日：1994-03-16
申请人： Jan Haisma , Peter W. De Haas , Dirk K. G. De Boer , Waltherus W. Van den Hoogenhof , Lambertus Postma
发明人： Jan Haisma , Peter W. De Haas , Dirk K. G. De Boer , Waltherus W. Van den Hoogenhof , Lambertus Postma
CPC分类号： C09G1/02 , C09K3/1463 , G11B5/3163
摘要： Method of polishing a surface (5a) of copper or an alloy comprising mainly copper, in which a polishing means is moved across the surface while exerting a polishing pressure of approximately 500 g/cm.sup.2 for obtaining a plane and smooth polished surface without any defects. A composition of a polishing component comprising a colloidal suspension of SiO.sub.2 particles having an average particle size of between 20 and 50 nm in an alkali solution, demineralized water and a chemical activator is used as a polishing means.
摘要翻译： 抛光铜或主要是铜的合金的表面（5a）的方法，其中抛光装置在表面上移动，同时施加约500g / cm 2的抛光压力，以获得平面和光滑的抛光表面而没有任何缺陷。 作为研磨装置，使用在碱溶液，软化水和化学活化剂中含有平均粒径为20〜50nm的SiO 2颗粒的胶体悬浮液的组合物。
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