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公开(公告)号：US06821323B1
公开(公告)日：2004-11-23
申请号：US10129998
申请日：2002-07-31
申请人： Jane Bell , Joachim Heyer , Jürgen Hupe , Ingo Kalker , Marlies Kleinfeld
发明人： Jane Bell , Joachim Heyer , Jürgen Hupe , Ingo Kalker , Marlies Kleinfeld
IPC分类号： C23C1831
摘要： The invention describes a process for non-galvanic tin plating of copper and copper alloys by precipitation of tin from methanesulphonic acid and tin-containing electrolytes, containing a complexing agent. In describing a process by which a durable tin layer which can be soldered is a created, which, at the same time, prevents liberation of the base material, this invention discloses that the electrolytes have at least one foreign metal added to form a diffusion barrier in the layer.
摘要翻译： 本发明描述了一种通过从甲磺酸沉淀锡和含有络合剂的含锡电解质对铜和铜合金进行非电镀锡的方法。 在描述可以被焊接的耐用锡层产生的过程中，同时防止了基材的释放，本发明公开了电解质具有加入至少一种外来金属以形成扩散阻挡层 在层中。
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公开(公告)号：US06589593B1
公开(公告)日：2003-07-08
申请号：US09674510
申请日：2000-11-15
申请人： Jürgen Hupe , Sabine Fix , Ortrud Steinius
发明人： Jürgen Hupe , Sabine Fix , Ortrud Steinius
IPC分类号： B05D512
CPC分类号： C23C18/1641 , C23C18/2013 , C23C18/2086 , C23C18/26 , C25D5/56 , C25D21/14 , H05K3/188 , H05K3/241 , Y10T29/49155 , Y10T29/49165
摘要： A process for coating substrates having polymer surfaces with metals in the manufacturing of printed circuit boards, in particular in the manufacturing of printed circuit boards having microscopic holes and fine geometries by the application of an electroconductive polymer layer and a subsequent metallization, wherein the electroconductive polymer layer is preferably doped with a zinc-containing, colloidal palladium solution prior to the metallization step, the electroconductive polymer is poly-3,4-ethylenedioxythiophene and a contacting with a copper(II) salt solution is performed prior to the metallization.
摘要翻译： 一种在制造印刷电路板中涂覆具有金属的聚合物表面的基材的方法，特别是在制造具有微孔和精细几何形状的印刷电路板时，通过施加导电聚合物层和随后的金属化，其中导电聚合物 优选在金属化步骤之前用含锌胶体钯溶液掺杂，导电聚合物是聚-3,4-亚乙基二氧噻吩，并且在金属化之前进行与铜（II）盐溶液的接触。
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3.发明授权Direct metallization of electrically non-conductive polyimide substrate surfaces 有权非导电聚酰亚胺基板表面的直接金属化公开(公告)号：US07815785B2
公开(公告)日：2010-10-19
申请号：US11756048
申请日：2007-05-31
申请人： Walter Kronenberg , Jürgen Hupe
发明人： Walter Kronenberg , Jürgen Hupe
CPC分类号： C25D5/56 , H05K1/0346 , H05K3/188 , H05K2201/0154 , H05K2201/0329 , H05K2203/0796
摘要： The present invention relates to an improved method for the direct metallization of non-conductive substrate surfaces, in particular polyimide surfaces, that is characterized by the process steps of etching the substrate surface with an acidic etching solution that contains peroxide; contacting the etched substrate surface with an acidic treatment solution that contains permanganate; activating the treated substrate surface in an acidic activation solution that contains peroxide; contacting the activated substrate surface with an acidic catalytic solution that contains at least a thiophene derivate and at least a sulfonic acid derivate; metallization of the thus treated substrate surface in an acidic galvanic metallization bath.
摘要翻译： 本发明涉及用于直接金属化非导电衬底表面，特别是聚酰亚胺表面的改进方法，其特征在于用含有过氧化物的酸性蚀刻溶液蚀刻衬底表面的工艺步骤; 使蚀刻的基底表面与含有高锰酸盐的酸性处理溶液接触; 在含有过氧化物的酸性活化溶液中活化经处理的底物表面; 使活化的底物表面与至少含有噻吩衍生物和至少一种磺酸衍生物的酸性催化溶液接触; 这样处理的基底表面在酸性电镀金属浴中的金属化。
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公开(公告)号：US06576111B1
公开(公告)日：2003-06-10
申请号：US09674509
申请日：2000-12-28
IPC分类号： C25D338
摘要： A process for the copper plating of substrates using insoluble anodes in acidic copper baths with separate replenishing of consumed copper ions, characterized in that the major portion of the copper ions is directly supplied in the form of copper carbonate and/or basic copper carbonate, dispensing with diaphragms and auxiliary electrolytes, in a separate tank operated in a bypass mode with respect to the working electrolyte, the released gaseous CO2 being separated off in said separate tank.
摘要翻译： 一种用于在酸性铜浴中使用不溶性阳极镀铜的方法，其中单独补充消耗的铜离子，其特征在于铜离子的主要部分直接以碳酸铜和/或碱式碳酸铜的形式供应，分配 具有隔膜和辅助电解质，在相对于工作电解质以旁路模式操作的单独的罐中，释放的气态CO 2在所述单独的罐中被分离。
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