摘要:
The invention provides novel inhibitors of hedgehog signaling that are useful as a therapeutic agents for treating malignancies where the compounds have the general formula I: wherein A, X, Y R1, R2, R3, R4, m and n are as described herein.
摘要:
A method for producing a chip is disclosed. A first step of the method may involve fabricating the chip only up to and including a first metal layer during a first manufacturing phase such that an input/output (I/O) region of the chip has a plurality of slots, where each of the slots has a plurality of first transistors. A second step of the method may involve designing a plurality of upper metal layers above the first metal layer in response to a custom design created after the first fabricating has started, the upper metal layers interconnecting a plurality of the first transistors to form a plurality of mixed-signal building block functions. A third step of the method may involve fabricating the chip to add the upper metal layers during a second manufacturing phase.
摘要:
An apparatus including a base layer of a platform application specific integrated circuit (ASIC), a mixed-signal function and a built-in self test (BIST) function. The base layer of the platform ASIC generally includes a plurality of pre-diffused regions disposed around a periphery of the platform ASIC. Each of the pre-diffused regions is generally configured to be metal-programmable. The mixed-signal function may include two or more sub-functions formed with a metal mask set placed over a first number of the plurality of pre-diffused regions. The BIST function may be formed with a metal mask set placed over a second number of the plurality of pre-diffused regions. The BIST function may be configured to test the mixed-signal function and present a digital signal indicating an operating condition of the mixed-signal function.
摘要:
A platform application specific integrated circuit (ASIC) including a base layer. The base layer generally comprises a predefined input/output (I/O) region and a predefined core region. The predefined input/output (I/O) region may comprise a plurality of pre-diffused regions disposed in the platform ASIC. The predefined core region may comprise one or more metal layers defining a plurality of power regions formed according to a custom design created after the base layer is fabricated. The base layer can be customized by depositing one or more metal layers.
摘要:
An apparatus that may include a base layer of a platform application specific integrated circuit (ASIC) and a mixed-signal function. The base layer of the platform application specific integrated circuit (ASIC) generally comprises a plurality of pre-diffused regions disposed around a periphery of the platform ASIC. Each of the pre-diffused regions may be configured to be metal-programmable. The mixed-signal function may include two or more sub-functions formed with a metal mask set placed over a number of the plurality of pre-diffused regions.
摘要:
An apparatus comprising a first transistor pair, second transistor pair, a third transistor pair and a fourth transistor pair. The first transistor pair may be (i) implemented as thin oxide devices and (ii) configured to receive a differential input signal. The second transistor pair may be (i) implemented as thick oxide devices and (ii) configured to generate a differential output signal in response to the differential input signal. The output signal has a voltage higher than the input signal. The third transistor pair may be (i) connected between the first and second transistor pairs and (ii) configured to protect the first transistor pair. The fourth transistor pair may be (i) connected between the third transistor pair and a ground and (ii) configured to increase an operating speed of the apparatus.
摘要:
A method for producing a chip is disclosed. A first step of the method may involve first fabricating the chip only up to and including a first metal layer such that a core region of the chip has an array of cells, each of the cells having a plurality of transistors. A second step of the method may be to design a plurality of upper metal layers above the first metal layer in response to a custom design created after the first fabricating has started, the upper metal layers interconnecting a plurality of the cells to form an electrostatic discharge clamp at a power domain crossing. A third step may include second fabricating the chip to add the upper metal layers.
摘要:
A slew based clock multiplier which outputs a fraction of a master clock without having to use, as a reference, an edge of a higher frequency clock, and without having to use precision delay cells to delay edges of the master clock. The slew based clock multiplier can be configured to provide such an output as the result of a ratio of input current sources, a ratio of capacitors in the circuit, or as a result of a combination of the two.
摘要:
An apparatus comprising an integrated circuit having (i) a number of regions each pre-diffused and configured to be metal-programmed and (ii) a plurality of pins configured to connect the integrated circuit to a socket. A logic portion may be implemented on the integrated circuit (i) configured to implement integrated circuit operations and (ii) having one or more I/O connections and one or more supply connections. A first group of the pre-diffused regions are metal-programmed and coupled to said I/O connections. A second group of the pre-diffused regions are metal-programmed and coupled to the supply connections.
摘要:
A method for interconnecting sub-functions of metal-mask programmable functions that includes the steps of (A) forming a base layer of a platform application specific integrated circuit (ASIC) comprising a plurality of pre-diffused regions disposed around a periphery of the platform ASIC, (B) forming two or more sub-functions of a function with a metal mask set placed over a number of the plurality of pre-diffused regions of the platform application specific integrated circuit and (C) configuring one or more connection points in each of the two or more sub-functions such that interconnections between the two or more sub-functions are tool routable in a single layer. Each of the pre-diffused regions is configured to be metal-programmable.