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公开(公告)号：US10026859B2
公开(公告)日：2018-07-17
申请号：US12897162
申请日：2010-10-04
CPC分类号： H01L31/0508 , H01L31/0512 , Y02E10/50
摘要： Disclosed are wire assemblies for solar cells. One wire assembly includes a first polymer film and a second polymer film overlaying the first polymer film. The second polymer film has a wire embedded in it such that a surface of the wire that is facing away from the first polymer film is exposed. The gauge of the wire is about 36 to 46 gauge. The thickness of the second polymer film is about ¼ to ½ the diameter of the wire and about 0.5 to 1.5 mils.
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公开(公告)号：US20120080079A1
公开(公告)日：2012-04-05
申请号：US12897162
申请日：2010-10-04
IPC分类号： H01L31/02
CPC分类号： H01L31/0508 , H01L31/0512 , Y02E10/50
摘要： Disclosed are wire assemblies for solar cells. One wire assembly includes a first polymer film and a second polymer film overlaying the first polymer film. The second polymer film has a wire embedded in it such that a surface of the wire that is facing away from the first polymer film is exposed. The gauge of the wire is about 36 to 46 gauge. The thickness of the second polymer film is about ¼ to ½ the diameter of the wire and about 0.5 to 1.5 mils.
摘要翻译： 公开了用于太阳能电池的电线组件。 一个线组件包括第一聚合物膜和覆盖第一聚合物膜的第二聚合物膜。 第二聚合物膜具有嵌入其中的线，使得电线的远离第一聚合物膜的表面暴露。 电线的规格约为36至46号。 第二聚合物膜的厚度约为导线直径的1/4至1/2，约0.5至1.5密耳。
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3.发明申请Method for preventing metalorganic precursor penetration into porous dielectrics 有权防止金属有机前体渗入多孔电介质的方法公开(公告)号：US20050148209A1
公开(公告)日：2005-07-07
申请号：US10897479
申请日：2004-07-23
申请人： Karen Chu , Anil Vijayendran , Michal Danek
发明人： Karen Chu , Anil Vijayendran , Michal Danek
IPC分类号： H01L21/26 , H01L21/285 , H01L21/768 , H01L29/00
CPC分类号： H01L21/76843 , H01L21/28556 , H01L21/76807 , H01L21/76826 , H01L21/76831
摘要： Methods and structures are provided for conformal lining of dual damascene structures in semiconductor devices that contain porous or low k dielectrics. Features, such as trenches and contact vias are formed in the dielectrics. The features are subjected to low-power plasma predeposition treatment to irregularities on the porous surfaces and/or reactively form an permeation barrier before a diffusion barrier material is deposited on the feature. The diffusion barrier may, for example, be deposited by CVD using metalorganic vapor reagents. The feature is then filled with copper metal and further processed to complete a dual damascene interconnect. The plasma predeposition treatment advantageously reduces the amount of permeation of the metalorganic reagent into the interlayer dielectric.
摘要翻译： 为包含多孔或低k电介质的半导体器件中的双镶嵌结构的保形衬里提供了方法和结构。 在电介质中形成诸如沟槽和接触通孔的特征。 这些特征经受低功率等离子体预沉积处理到多孔表面上的不规则性和/或在扩散阻挡材料沉积在特征上之前反应形成渗透屏障。 可以使用金属有机蒸汽试剂通过CVD沉积扩散阻挡层。 该特征然后用铜金属填充并进一步处理以完成双镶嵌互连。 等离子体预沉积处理有利地减少了金属有机试剂渗透到层间电介质中的量。
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公开(公告)号：US07960643B2
公开(公告)日：2011-06-14
申请号：US12556460
申请日：2009-09-09
IPC分类号： H01L31/0203 , H01L31/048
CPC分类号： H01L31/049 , Y02E10/50
摘要： Provided are novel back sheets for solar module encapsulation. According to various embodiments, the back sheets are ungrounded and flexible. In certain embodiments, the back sheets include an integrated flexible and electrically isolated moisture barrier. The electrically isolated moisture barrier may be a thin metallic sheet, e.g., an aluminum foil. The electrically isolated, flexible moisture barrier eliminates the need for grounding.
摘要翻译： 提供太阳能模块封装的新型背板。 根据各种实施例，底片是不接地且柔性的。 在某些实施例中，背板包括集成的柔性和电隔离的湿气屏障。 电隔离的防潮层可以是薄金属片，例如铝箔。 电气隔离，灵活的防潮层消除了对接地的需要。
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公开(公告)号：US06797642B1
公开(公告)日：2004-09-28
申请号：US10267305
申请日：2002-10-08
申请人： Karen Chu , Anil Vijayendran , Michal Danek
发明人： Karen Chu , Anil Vijayendran , Michal Danek
IPC分类号： H01L2131
CPC分类号： H01L21/76844 , C23C14/5826 , C23C16/56 , H01L21/76805 , H01L21/76814 , H01L21/76862
摘要： The present invention provides a method to improve adhesion of barrier, metal, dielectric interfaces. In the process flow, a first barrier material is formed on a dielectric layer and bombarded with a plasma to effectively push the barrier material into the dielectric interface while leaving a portion of the barrier material over the dielectric. A second barrier material, which may or may not be the same as the first barrier material, is then formed on the remaining first barrier material. Advantageously, the method of the present invention allows the barrier material to be pushed into the dielectric to insure excellent adhesion, which prevents chemical mechanical polishing delamination. Furthermore, the presence of the first barrier material on the sidewalls of via apertures through the dielectric can prevent Cu poisoning from sputtered Cu or CxOy.
摘要翻译： 本发明提供了改善阻挡层，金属，电介质界面的附着力的方法。 在工艺流程中，第一阻挡材料形成在电介质层上并用等离子体轰击以有效地将阻挡材料推入电介质界面，同时将阻挡材料的一部分留在电介质上。 然后可以在剩余的第一阻挡材料上形成第二阻挡材料，其可以或可以不与第一阻挡材料相同。 有利地，本发明的方法允许阻挡材料被推入电介质以确保优异的粘附性，这防止了化学机械抛光分层。 此外，通过电介质的通孔的侧壁上的第一阻挡材料的存在可以防止溅射的Cu或C x O y的Cu中毒。
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公开(公告)号：US09634168B2
公开(公告)日：2017-04-25
申请号：US13198539
申请日：2011-08-04
申请人： Joseph Laia , Anil Vijayendran , Adam C. Sherman
发明人： Joseph Laia , Anil Vijayendran , Adam C. Sherman
IPC分类号： H01L31/042 , H01L31/00 , H01L31/05 , H01L31/02 , H01R13/52 , H02S20/25 , H02S40/36 , F24J2/52 , F24J2/46
CPC分类号： H01L31/05 , F24S25/40 , F24S2025/601 , H01L31/0201 , H01R13/5219 , H02S20/25 , H02S40/36 , Y02B10/12 , Y02E10/50 , Y10T29/49826
摘要： Provided are novel building integrable photovoltaic (BIP) modules having specially configured attachment structures for securing these modules to building structures and other BIP modules. In certain embodiments, a BIP module includes a base sheet supporting photovoltaic cells and having a rigid polymer portion and a flexible polymer portion. The flexible portion is designed to be penetrated with mechanical fasteners during installation. The flexible portion may include fastening pointers and/or through holes for identifying specific penetration locations. The rigid portion provides necessary structural rigidity and support to the module and more specifically to the photovoltaic cells. In certain other embodiments, a BIP module includes an adhesive bumper strip disposed along one edge of the module and configured for secure this module with respect to another module. During installation, the strip is positioned between a back sealing sheet of one module and a front sealing sheet of another module.
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7.发明申请公开(公告)号：US20110214716A1
公开(公告)日：2011-09-08
申请号：US13107574
申请日：2011-05-13
IPC分类号： H01L31/048
CPC分类号： H01L31/049 , Y02E10/50
摘要： Provided are novel solar modules including electrically isolated moisture barriers. According to various embodiments, the solar modules include two distinct seals: one to electrically isolate the moisture barrier and one to protect photovoltaic cells of the module. Also provided are novel back sheets for solar module encapsulation, and novel solar modules including such back sheets. According to various embodiments, the back sheets are ungrounded and flexible. In certain embodiments, the back sheets include an integrated flexible and electrically isolated moisture barrier. The electrically isolated moisture barrier may be a thin metallic sheet, e.g., an aluminum foil. The electrically isolated, flexible moisture barrier eliminates the need for grounding.
摘要翻译： 提供了包括电隔离的防潮屏障的新型太阳能组件。 根据各种实施例，太阳能模块包括两个不同的密封件：一个用于电隔离湿气屏障，一个用于保护模块的光伏电池。 还提供了用于太阳能模块封装的新型背板，以及包括这种背板的新型太阳能模块。 根据各种实施例，底片是不接地且柔性的。 在某些实施例中，背板包括集成的柔性和电隔离的湿气屏障。 电隔离的防潮层可以是薄金属片，例如铝箔。 电气隔离，灵活的防潮层消除了对接地的需要。
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8.发明授权Deposition of thin continuous PVD seed layers having improved adhesion to the barrier layer 有权沉积具有改善的与阻挡层的粘附性的薄连续PVD种子层公开(公告)号：US07645696B1
公开(公告)日：2010-01-12
申请号：US11473618
申请日：2006-06-22
申请人： Alexander Dulkin , Anil Vijayendran , Tom Yu , Daniel R. Juliano
发明人： Alexander Dulkin , Anil Vijayendran , Tom Yu , Daniel R. Juliano
IPC分类号： H01L21/00
CPC分类号： H01L21/76843 , C23C14/022 , C23C14/046 , H01L21/02068 , H01L21/2855 , H01L21/32131 , H01L21/76813 , H01L21/76862 , H01L21/76865 , H01L21/76873
摘要： Methods of depositing thin seed layers that improve continuity of the seed layer as well as adhesion to the barrier layer are provided. According to various embodiments, the methods involve performing an etchback operation in the seed deposition chamber prior to depositing the seed layer. The etch step removes barrier layer overhang and/or oxide that has formed on the barrier layer. It some embodiments, a small deposition flux of seed atoms accompanies the sputter etch flux of argon ions, embedding metal atoms into the barrier layer. The embedded metal atoms create nucleation sites for subsequent seed layer deposition, thereby promoting continuous seed layer film growth, film stability and improved seed layer-barrier layer adhesion.
摘要翻译： 提供了提高种子层的连续性的薄种子层的沉积方法以及与阻挡层的粘附性。 根据各种实施例，所述方法包括在沉积种子层之前在种子沉积室中执行回蚀作业。 蚀刻步骤去除在阻挡层上形成的阻挡层突出端和/或氧化物。 在一些实施例中，种子原子的小沉积通量伴随着氩离子的溅射蚀刻通量，将金属原子嵌入阻挡层中。 嵌入的金属原子产生用于随后的种子层沉积的成核位点，从而促进连续的种子层膜生长，膜稳定性和改进的种子层 - 阻挡层粘附。
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公开(公告)号：US20130032198A1
公开(公告)日：2013-02-07
申请号：US13198539
申请日：2011-08-04
申请人： Joseph Laia , Anil Vijayendran , Adam C. Sherman
发明人： Joseph Laia , Anil Vijayendran , Adam C. Sherman
IPC分类号： H01L31/048 , H01L31/05 , B23P11/00 , H01L31/02
CPC分类号： H01L31/05 , F24S25/40 , F24S2025/601 , H01L31/0201 , H01R13/5219 , H02S20/25 , H02S40/36 , Y02B10/12 , Y02E10/50 , Y10T29/49826
摘要： Provided are novel building integrable photovoltaic (BIP) modules having specially configured attachment structures for securing these modules to building structures and other BIP modules. In certain embodiments, a BIP module includes a base sheet supporting photovoltaic cells and having a rigid polymer portion and a flexible polymer portion. The flexible portion is designed to be penetrated with mechanical fasteners during installation. The flexible portion may include fastening pointers and/or through holes for identifying specific penetration locations. The rigid portion provides necessary structural rigidity and support to the module and more specifically to the photovoltaic cells. In certain other embodiments, a BIP module includes an adhesive bumper strip disposed along one edge of the module and configured for secure this module with respect to another module. During installation, the strip is positioned between a back sealing sheet of one module and a front sealing sheet of another module.
摘要翻译： 提供了具有专门配置的附件结构的新型建筑可集成光伏（BIP）模块，用于将这些模块固定到建筑结构和其他BIP模块。 在某些实施例中，BIP模块包括支撑光伏电池的基片，并且具有刚性聚合物部分和柔性聚合物部分。 柔性部分设计成在安装期间用机械紧固件穿透。 柔性部分可以包括用于识别特定穿透位置的紧固指针和/或通孔。 刚性部分为模块提供了必要的结构刚度和支撑，更具体地提供了光伏电池。 在某些其他实施例中，BIP模块包括沿着模块的一个边缘设置的粘合缓冲带，并且被配置为相对于另一个模块固定该模块。 在安装期间，条带位于一个模块的背面密封片和另一个模块的前密封片之间。
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公开(公告)号：US20100071757A1
公开(公告)日：2010-03-25
申请号：US12556460
申请日：2009-09-09
IPC分类号： H01L31/048
CPC分类号： H01L31/049 , Y02E10/50
摘要： Provided are novel back sheets for solar module encapsulation. According to various embodiments, the back sheets are ungrounded and flexible. In certain embodiments, the back sheets include an integrated flexible and electrically isolated moisture barrier. The electrically isolated moisture barrier may be a thin metallic sheet, e.g., an aluminum foil. The electrically isolated, flexible moisture barrier eliminates the need for grounding.
摘要翻译： 提供太阳能模块封装的新型背板。 根据各种实施例，底片是不接地且柔性的。 在某些实施例中，背板包括集成的柔性和电隔离的湿气屏障。 电隔离的防潮层可以是薄金属片，例如铝箔。 电气隔离，灵活的防潮层消除了对接地的需要。
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