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公开(公告)号:US20170352538A1
公开(公告)日:2017-12-07
申请号:US15613396
申请日:2017-06-05
申请人: Jeehwan Kim , Dirk Robert ENGLUND , Mark A. HOLLIS , Travis WADE , Michael GEIS , Richard MOLNAR
发明人: Jeehwan Kim , Dirk Robert ENGLUND , Mark A. HOLLIS , Travis WADE , Michael GEIS , Richard MOLNAR
IPC分类号: H01L21/02 , H01L21/306 , H01L29/04 , H01L21/683 , H01L21/3213 , H01L29/16
CPC分类号: H01L21/02527 , H01L21/02376 , H01L21/02444 , H01L21/0245 , H01L21/02499 , H01L21/02598 , H01L21/0262 , H01L21/02639 , H01L21/02645 , H01L21/02647 , H01L21/30604 , H01L21/32133 , H01L21/6835 , H01L29/04 , H01L29/1602 , H01L29/1606 , H01L29/66015 , H01L2221/68363 , H01L2221/68381 , H01L2221/68386
摘要: A buffer layer is employed to fabricate diamond membranes and allow reuse of diamond substrates. In this approach, diamond membranes are fabricated on the buffer layer, which in turn is disposed on a diamond substrate that is lattice-matched to the diamond membrane. The weak bonding between the buffer layer and the diamond substrate allows ready release of the fabricated diamond membrane. The released diamond membrane is transferred to another substrate to fabricate diamond devices, while the diamond substrate is reused for another fabrication.