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Patent Agency Ranking
公开(公告)号：US07821346B2
公开(公告)日：2010-10-26
申请号：US12229114
申请日：2008-08-20
Applicant: Jeffrey A. McCracken
Inventor： Jeffrey A. McCracken
CPC classification number: H03L1/04 , H03L1/028 , H05K1/0206 , H05K1/0212 , H05K1/141 , H05K3/305 , H05K2201/09036 , H05K2201/10068 , H05K2201/10151 , H05K2201/10166 , H05K2201/10462 , H05K2201/10545 , H05K2201/10946
Abstract: An ovenized oscillator package including at least a heater and a crystal package mounted on opposite sides of a circuit board. Vias extend through the body of the circuit board to transfer heat from the heater to the crystal package. Layers of thermally conductive material extend through the body of the circuit board and are in thermally coupled relationship with the vias for spreading heat throughout the circuit board and other elements mounted thereon.
Abstract translation: 一种加热振荡器封装，其至少包括加热器和安装在电路板的相对侧上的晶体封装。 通孔延伸穿过电路板的主体，以将热量从加热器传递到晶体封装。 导热材料层延伸穿过电路板的主体并与通孔热耦合，用于在整个电路板和安装在其上的其它元件上散热。
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公开(公告)号：US20090051447A1
公开(公告)日：2009-02-26
申请号：US12229113
申请日：2008-08-20
Applicant: Jeffrey A. McCracken , Thomas A. Knecht
Inventor： Jeffrey A. McCracken , Thomas A. Knecht
IPC: H03L1/04
CPC classification number: H03B5/04 , H03B5/36 , H03L1/04 , H05K1/0212 , H05K1/141 , H05K1/181 , H05K2201/10068 , H05K2201/10151 , H05K2201/10166 , H05K2201/10515 , H05K2201/10537
Abstract: An ovenized oscillator package including a ball grid array substrate seated on a circuit board, a heater and a temperature sensor mounted on the ball grid array substrate, and a crystal package mounted to the ball grid array substrate and overlying at least the heater. A layer of thermally conductive epoxy or adhesive material couples the heater to the crystal package. Stabilizer posts, which are made of an insulative adhesive or epoxy material, are formed between the ball grid array substrate and the circuit board for stabilizing and relieving the stress on the ball grid array substrate. A lid is seated on the circuit board and covers and defines an oven for the ball grid array substrate.
Abstract translation: 包括安置在电路板上的球栅阵列基板，安装在球栅阵列基板上的加热器和温度传感器的加热振荡器封装以及安装到球栅阵列基板并至少覆盖加热器的晶体封装。 一层导热环氧树脂或粘合材料将加热器与晶体封装相结合。 在球栅阵列基板和电路板之间形成由绝缘粘合剂或环氧材料制成的稳定柱，用于稳定和减轻球栅阵列基板上的应力。 盖子安置在电路板上并覆盖并限定了用于球栅阵列基板的烘箱。
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公开(公告)号：US08022777B2
公开(公告)日：2011-09-20
申请号：US12380313
申请日：2009-02-26
Applicant: James L. Stolpman , Jeffrey A. McCracken
Inventor： James L. Stolpman , Jeffrey A. McCracken
IPC: H03L1/04
CPC classification number: H03L1/04 , H05K1/0212 , H05K1/0243 , H05K1/181 , H05K3/403 , H05K2201/09181 , H05K2201/10022 , H05K2201/10075 , H05K2201/10151 , H05K2203/165
Abstract: An oscillator assembly including an oscillator seated on a pad of thermally conductive material formed on the surface of a printed circuit board and covered by a lid defining an oven for the oscillator. In one embodiment, a plurality of heaters are located on different sides of the oscillator and at least partially seated on the pad for evenly transferring heat to the pad and the oscillator. In one embodiment, the oscillator is a temperature compensated crystal oscillator and an integrated amplifier controller circuit on the printed circuit board integrates at least one operational amplifier for controlling the heater(s) and one or more transistors for providing heat to the oven. A canopy seated on the pad and covering the oscillator can be used for transferring heat more evenly to the oscillator. A cavity in the bottom of the printed circuit board defines an insulative air pocket.
Abstract translation: 一种振荡器组件，包括位于印刷电路板的表面上形成并由限定用于振荡器的烘箱的盖子覆盖的导热材料垫上的振荡器。 在一个实施例中，多个加热器位于振荡器的不同侧，并且至少部分地位于该垫上，以将热量均匀地传递到该垫和该振荡器。 在一个实施例中，振荡器是温度补偿晶体振荡器，并且印刷电路板上的集成放大器控制器电路集成了至少一个用于控制加热器的运算放大器和用于向烘箱提供热量的一个或多个晶体管。 位于垫上并覆盖振荡器的顶盖可用于将热量更均匀地传递到振荡器。 印刷电路板底部的空腔限定了绝缘气囊。
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公开(公告)号：US20090219101A1
公开(公告)日：2009-09-03
申请号：US12380313
申请日：2009-02-26
Applicant: James L. Stolpman , Jeffrey A. McCracken
Inventor： James L. Stolpman , Jeffrey A. McCracken
IPC: H03L1/04
CPC classification number: H03L1/04 , H05K1/0212 , H05K1/0243 , H05K1/181 , H05K3/403 , H05K2201/09181 , H05K2201/10022 , H05K2201/10075 , H05K2201/10151 , H05K2203/165
Abstract: An oscillator assembly including an oscillator seated on a pad of thermally conductive material formed on the surface of a printed circuit board and covered by a lid defining an oven for the oscillator. In one embodiment, a plurality of heaters are located on different sides of the oscillator and at least partially seated on the pad for evenly transferring heat to the pad and the oscillator. In one embodiment, the oscillator is a temperature compensated crystal oscillator and an integrated amplifier controller circuit on the printed circuit board integrates at least one operational amplifier for controlling the heater(s) and one or more transistors for providing heat to the oven. A canopy seated on the pad and covering the oscillator can be used for transferring heat more evenly to the oscillator. A cavity in the bottom of the printed circuit board defines an insulative air pocket.
Abstract translation: 一种振荡器组件，包括位于印刷电路板的表面上形成并由限定用于振荡器的烘箱的盖子覆盖的导热材料垫上的振荡器。 在一个实施例中，多个加热器位于振荡器的不同侧，并且至少部分地位于该垫上，以将热量均匀地传递到该垫和该振荡器。 在一个实施例中，振荡器是温度补偿晶体振荡器，并且印刷电路板上的集成放大器控制器电路集成了至少一个用于控制加热器的运算放大器和用于向烘箱提供热量的一个或多个晶体管。 位于垫上并覆盖振荡器的顶盖可用于将热量更均匀地传递到振荡器。 印刷电路板底部的空腔限定了绝缘气囊。
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公开(公告)号：US20090051446A1
公开(公告)日：2009-02-26
申请号：US12229114
申请日：2008-08-20
Applicant: Jeffrey A. McCracken
Inventor： Jeffrey A. McCracken
IPC: H03B1/00
CPC classification number: H03L1/04 , H03L1/028 , H05K1/0206 , H05K1/0212 , H05K1/141 , H05K3/305 , H05K2201/09036 , H05K2201/10068 , H05K2201/10151 , H05K2201/10166 , H05K2201/10462 , H05K2201/10545 , H05K2201/10946
Abstract: An ovenized oscillator package including at least a heater and a crystal package mounted on opposite sides of a circuit board. Vias extend through the body of the circuit board to transfer heat from the heater to the crystal package. Layers of thermally conductive material extend through the body of the circuit board and are in thermally coupled relationship with the vias for spreading heat throughout the circuit board and other elements mounted thereon.
Abstract translation: 一种加热振荡器封装，其至少包括加热器和安装在电路板的相对侧上的晶体封装。 通孔延伸穿过电路板的主体，以将热量从加热器传递到晶体封装。 导热材料层延伸穿过电路板的主体并与通孔热耦合，用于在整个电路板和安装在其上的其它元件上散热。
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