公开(公告)号：US09980384B2

公开(公告)日：2018-05-22

申请号：US14407405

申请日：2013-06-21

Applicant: KYOCERA Corporation

Inventor： Yoshio Ohashi ,  Kunihide Shikata

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K3/38 ,  C04B37/02 ,  H05K1/11

CPC classification number: H05K1/181 ,  C04B37/025 ,  C04B2237/10 ,  C04B2237/343 ,  C04B2237/407 ,  C04B2237/55 ,  C04B2237/59 ,  C04B2237/86 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/111 ,  H05K3/388 ,  H05K2201/10462 ,  H05K2201/2063 ,  Y02P70/611 ,  H01L2924/00014

Abstract: The circuit board includes a ceramic sintered body and a metal wiring layer provided on at least one primary surface thereof with a glass layer interposed therebetween, and when the cross section of the circuit board perpendicular to the primary surface of the ceramic sintered body is viewed, the ratio of the length of an interface between the glass layer and the metal wiring layer to a length of the glass layer in a direction along the primary surface is 1.25 to 1.80.

公开(公告)号：US20160344119A1

公开(公告)日：2016-11-24

申请号：US14714916

申请日：2015-05-18

Applicant: Autoliv ASP, Inc.

Inventor： Boris G. Karasik ,  William M. Leach

IPC: H01R12/70 ,  H05K1/18

CPC classification number: H01R12/7076 ,  H01R12/724 ,  H01R13/719 ,  H05K1/18 ,  H05K3/301 ,  H05K3/306 ,  H05K3/308 ,  H05K2201/10015 ,  H05K2201/10446 ,  H05K2201/10462 ,  H05K2201/105 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10962

Abstract: An assembly provides a dual function for mounting a port connector on a circuit board and also secures a capacitor to the circuit board. The assembly includes the circuit board and a monolithic plastic frame having a flange, a snap structure, a capacitor cradle, and a socket section. The flange has a fastening structure for fastening the frame to the circuit board. The snap structure for a snap-in attachment of the port connector to the frame is arranged near an end edge of the circuit board. The capacitor cradle for holding a cylindrical capacitor is formed adjacent to the snap structure and is elevated from the circuit board by an air gap. The socket section bears socket contacts for receiving capacitor contact leads.

Abstract translation: 组件提供了用于将端口连接器安装在电路板上并且还将电容器固定到电路板的双重功能。 组件包括电路板和具有凸缘，卡扣结构，电容器支架和插座部分的整体式塑料框架。 凸缘具有用于将框架紧固到电路板的紧固结构。 用于端口连接器到框架的卡扣附接的卡扣结构布置在电路板的端部边缘附近。 用于保持圆柱形电容器的电容器支架邻近卡扣结构形成，并且通过气隙从电路板升高。 插座部分用于接收电容器接触引线的插座触点。

公开(公告)号：US20140205864A1

公开(公告)日：2014-07-24

申请号：US14019486

申请日：2013-09-05

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Sang-Il Yi ,  Moon-Gil Kang

IPC: H01M2/34

CPC classification number: H01M2/34 ,  H01M2/105 ,  H01M2/204 ,  H01M10/425 ,  H05K3/3426 ,  H05K3/4015 ,  H05K2201/0394 ,  H05K2201/10037 ,  H05K2201/1031 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10916 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613

Abstract: A rechargeable battery pack includes a plurality of battery cells, a connection tab electrically coupled to one or more terminals of the battery cells, a connection plate electrically coupled to the connection tab, and having an opening for accommodating a protruding portion of the connection tab, and a protective circuit module electrically coupled to the connection plate, and having a combination groove, wherein the connection plate is on a first surface of the protective circuit module to face the combination groove, and wherein the first surface of the protective circuit module faces the connection tab.

Abstract translation: 可再充电电池组包括多个电池单元，电连接到电池单元的一个或多个端子的连接凸片，电连接到连接凸片的连接板，并具有用于容纳连接凸片的突出部分的开口， 以及保护电路模块，电连接到所述连接板，并且具有组合凹槽，其中所述连接板位于所述保护电路模块的面对所述组合凹槽的第一表面上，并且其中所述保护电路模块的第一表面面向 连接标签。

公开(公告)号：US20140099123A1

公开(公告)日：2014-04-10

申请号：US14044226

申请日：2013-10-02

Applicant: Electronics and Telecommunications Research Institute

Inventor： Sae-Kyoung KANG ,  Joon-Ki LEE ,  Joon-Young HUH

IPC: H04B10/40

CPC classification number: H04B10/40 ,  G02B6/4281 ,  H05K1/0243 ,  H05K1/0251 ,  H05K1/189 ,  H05K3/3421 ,  H05K3/3447 ,  H05K2201/10121 ,  H05K2201/10462

Abstract: A flexible printed circuit board (FPCB) includes at least one signal pad part disposed at each of a top and bottom of a flexible substrate base and configured to include an upper signal pad and a lower signal pad and a through hole formed at a portion corresponding to a signal via, a signal line disposed at the top of the substrate base, and extending from the upper signal pad along a length direction of the substrate base, an upper ground pad disposed at the top of the substrate base to be separated from the upper signal pad and the signal line near the upper signal pad, and a lower ground pad disposed at the bottom of the substrate base to be separated from the lower signal pad near the lower signal pad, and connected to the upper ground pad through a ground via.

Abstract translation: 柔性印刷电路板（FPCB）包括设置在柔性基板基底的顶部和底部的每一个处的至少一个信号焊盘部分，并被配置为包括上部信号焊盘和下部信号焊盘以及形成在对应部分的部分的通孔 信号通孔，设置在基板顶部的信号线，并且沿着基板基底的长度方向从上信号焊盘延伸;上接地焊盘，设置在基板基座的顶部，以与基板基板分离; 上信号焊盘和靠近上信号焊盘的信号线，以及设置在基板底部的下接地焊盘，以与下信号焊盘附近的下信号焊盘分离，并通过地面连接到上接地焊盘 通过。

公开(公告)号：US20130140079A1

公开(公告)日：2013-06-06

申请号：US13817964

申请日：2011-08-23

Applicant: Tatsuya Nakamura

Inventor： Tatsuya Nakamura

IPC: H01G2/10

CPC classification number: H01G2/10 ,  H01G2/06 ,  H01G9/08 ,  H01G9/12 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/10462 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/10651

Abstract: A capacitor holder comprising a body part formed in a shape into which a tip end of a capacitor can be fitted; and a lead part which is fixed to the body part and can be soldered to a predetermined fitting location. The body part has an opening through which the tip end of the capacitor is exposed, and an end surface abutment portion which abuts a tip end surface of the capacitor in a vicinity of a pressure valve, when the tip end of the capacitor is fitted into the body part. The lead part is fixed to the body part at a position opposite to the capacitor with respect to a reference plane, which is a plane includes the tip end surface of the capacitor abutting the end surface abutment portion.

Abstract translation: 一种电容器保持器，包括形成为能够安装电容器的尖端的形状的主体部分; 以及引导部，其固定到主体部并且可以被焊接到预定的配合位置。 主体部分具有露出电容器的前端的开口，以及当电容器的前端装配到电容器的前端时与端子表面抵接部分邻接电容器的顶端表面 身体部位。 引线部分相对于参考平面固定在与电容器相对的位置处的主体部分，该基准面是包括抵靠端表面抵接部分的电容器的末端表面的平面。

公开(公告)号：US20120019985A1

公开(公告)日：2012-01-26

申请号：US12839596

申请日：2010-07-20

Applicant: CHUN-KONG CHAN ,  CHI-CHING CHEN

Inventor： CHUN-KONG CHAN ,  CHI-CHING CHEN

IPC: H01G9/045

CPC classification number: H01G9/045 ,  H01G9/008 ,  H01G9/10 ,  H05K3/306 ,  H05K2201/10462 ,  H05K2201/10583 ,  H05K2201/2036

Abstract: An aluminum electrolytic capacitor includes a main body, two electric leads, and a metal set plate. The main body has a base and a plastic insulating film. The electric leads are located at one end of the base. The metal set plate is located at opposite end, with a connecting portion and a soldering portion. The connecting portion is located at the surface of the other end of the base opposite of the two electric leads. The soldering portion extends outside of the main body. The plastic insulating film wraps around the main body and the outer edge of the connecting portion. Thereby, the metal set plate is secured firmly with the main body. The soldering portion of the metal set plate is soldered onto the printed circuit board, allowing the aluminum electrolytic capacitor to be firmly attached to the printed circuit board.

Abstract translation: 铝电解电容器包括主体，两个电引线和金属板。 主体有一个基座和一个塑料绝缘膜。 电引线位于基座的一端。 金属制板位于相对端，具有连接部分和焊接部分。 连接部位于与两个电引线相反的基座的另一端的表面。 焊接部分延伸到主体的外部。 塑料绝缘膜围绕主体和连接部分的外边缘卷绕。 由此，金属固定板与主体牢固地固定。 金属制板的焊接部分焊接到印刷电路板上，使得铝电解电容器牢固地附接到印刷电路板上。

公开(公告)号：US20090051446A1

公开(公告)日：2009-02-26

申请号：US12229114

申请日：2008-08-20

Applicant: Jeffrey A. McCracken

Inventor： Jeffrey A. McCracken

IPC: H03B1/00

CPC classification number: H03L1/04 ,  H03L1/028 ,  H05K1/0206 ,  H05K1/0212 ,  H05K1/141 ,  H05K3/305 ,  H05K2201/09036 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10462 ,  H05K2201/10545 ,  H05K2201/10946

Abstract: An ovenized oscillator package including at least a heater and a crystal package mounted on opposite sides of a circuit board. Vias extend through the body of the circuit board to transfer heat from the heater to the crystal package. Layers of thermally conductive material extend through the body of the circuit board and are in thermally coupled relationship with the vias for spreading heat throughout the circuit board and other elements mounted thereon.

Abstract translation: 一种加热振荡器封装，其至少包括加热器和安装在电路板的相对侧上的晶体封装。 通孔延伸穿过电路板的主体，以将热量从加热器传递到晶体封装。 导热材料层延伸穿过电路板的主体并与通孔热耦合，用于在整个电路板和安装在其上的其它元件上散热。

公开(公告)号：US20080250377A1

公开(公告)日：2008-10-09

申请号：US11696659

申请日：2007-04-04

Applicant: Steven C. Bird ,  Varoujan Malian ,  Mudasir Ahmad ,  Charles H. Casale ,  Danlu Tang

Inventor： Steven C. Bird ,  Varoujan Malian ,  Mudasir Ahmad ,  Charles H. Casale ,  Danlu Tang

IPC: G06F17/50 ,  G01R31/00

CPC classification number: G01R31/2818 ,  H05K1/0231 ,  H05K1/0237 ,  H05K1/0262 ,  H05K1/0268 ,  H05K1/113 ,  H05K1/181 ,  H05K3/3421 ,  H05K3/3457 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4623 ,  H05K2201/0367 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09627 ,  H05K2201/09663 ,  H05K2201/10333 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2201/10545 ,  H05K2201/10734 ,  Y02P70/611

Abstract: Methods and apparatus for accessing a high speed signal routed on a conductive trace on an internal layer of a printed circuit board (PCB) using high density interconnect (HDI technology) are provided. The conductive trace may be coupled to a microvia (μVia) having a conductive dome disposed above the outer layer pad of the μVia. In-circuit test (ICT) fixtures or high speed test probes may interface with the conductive dome to test the high speed signal with decreased reflection loss and other parasitic effects when compared to conventional test points utilizing plated through-hole (PTH) technology.

Abstract translation: 提供了使用高密度互连（HDI技术）访问在印刷电路板（PCB）的内层上的导电迹线上路由的高速信号的方法和装置。 导电迹线可以耦合到具有设置在muVia的外层焊盘上方的导电圆顶的微孔（muVia）。 与使用电镀通孔（PTH）技术的常规测试点相比，在线测试（ICT）固定装置或高速测试探头可与导电圆顶接口以测试具有降低的反射损耗和其他寄生效应的高速信号。

公开(公告)号：US20080225461A1

公开(公告)日：2008-09-18

申请号：US12039284

申请日：2008-02-28

Applicant: Yukihiko SHIRAKAWA ,  Iwao MIURA

Inventor： Yukihiko SHIRAKAWA ,  Iwao MIURA

IPC: H01G4/224

CPC classification number: H01G2/06 ,  H01C1/14 ,  H01G4/228 ,  H01G9/008 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10462 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/611 ,  Y02P70/613

Abstract: There are provided an electronic component permitting easy surface mounting onto a circuit board and, a mounted structure and an inverter device therewith.A surface mount type electronic component has a dielectric element body, electrodes, lead conductors, and lead wires. The dielectric element body has principal faces and side faces. One electrode is formed on one principal face, the other electrode is formed on the other principal face, and the electrodes face each other. A first portion of one lead conductor is laid on one side face. A first portion of the other lead conductor is laid on another side face. First portions of the lead wires are connected to the corresponding first portions of the lead conductors.

Abstract translation: 提供了允许容易地安装到电路板上的电子部件，以及安装的结构和与其相反的逆变器装置。 表面安装型电子部件具有电介质元件主体，电极，引线导体和引线。 电介质元件主体具有主面和侧面。 一个电极形成在一个主面上，另一个电极形成在另一个主面上，电极彼此面对。 一个引线导体的第一部分放置在一个侧面上。 另一个引线导体的第一部分被放置在另一侧面上。 引线的第一部分连接到引线导体的对应的第一部分。

公开(公告)号：US20080081253A1

公开(公告)日：2008-04-03

申请号：US11905282

申请日：2007-09-28

Applicant: Tomoyuki Shose ,  Katsuyuki Kida ,  Masao Kondou ,  Yasuo Akai

Inventor： Tomoyuki Shose ,  Katsuyuki Kida ,  Masao Kondou ,  Yasuo Akai

IPC: H01M2/02

CPC classification number: H01M2/0413 ,  H01M2/0222 ,  H01M10/052 ,  H05K3/341 ,  H05K2201/0373 ,  H05K2201/10462 ,  H05K2201/10643 ,  H05K2201/10659 ,  Y02P70/613 ,  Y10S228/901

Abstract: A lead plate-attached coin-type battery is constituted from a combination of a coin-type battery and a positive lead plate. In the coin-type battery, a negative cap seals the aperture of a positive outer can. In a lateral view, the positive lead plate is crank-shaped, and one end thereof is attached to the outer surface of the positive outer can of the coin-type battery. A lead plate is not attached to the negative cap. One or more projections that project in the Z axis direction are provided on the negative cap. In the lead plate-attached coin-type battery, the positive lead plate and negative cap have been attached to respective conductive lands on a circuit board by a solder reflow method.

Abstract translation: 引线板式硬币型电池由硬币型电池和正极引线板的组合构成。 在硬币型电池中，负极帽密封正外壳的孔径。 在侧视图中，正极引线板是曲柄形的，其一端连接到硬币型电池的正外壳的外表面。 引线板未连接到负极盖。 在Z轴方向上投影的一个或多个突起设置在负极盖上。 在带引线板的硬币型电池中，通过焊料回流法将正极引线板和负极盖安装在电路板上的各个导电焊盘上。