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公开(公告)号：US07219713B2
公开(公告)日：2007-05-22
申请号：US11037913
申请日：2005-01-18
IPC分类号： F28F7/00
CPC分类号： H01L23/3733 , H01L23/4093 , H01L23/42 , H01L2924/0002 , H01L2924/00
摘要： The present invention is a thermal interface for coupling a heat source to a heat sink. One embodiment of the invention comprises a mesh and a liquid, e.g., a thermally conductive liquid, disposed in the mesh. The mesh and the thermally conductive liquid are adapted to contact both the heat source and the heat sink when disposed therebetween. In one embodiment, the mesh may comprise a metal or organic material compatible with the liquid. In one embodiment, the liquid may comprise liquid metal. For example, the liquid may comprise a gallium indium tin alloy. A gasket may optionally be used to seal the mesh and the liquid between the heat source and the heat sink. In one embodiment, the heat source is an integrated circuit chip.
摘要翻译： 本发明是用于将热源耦合到散热器的热界面。 本发明的一个实施例包括设置在网中的网和液体，例如导热液体。 网格和导热液体在其间设置时适于接触热源和散热器。 在一个实施方案中，网可以包含与液体相容的金属或有机材料。 在一个实施方案中，液体可以包含液态金属。 例如，液体可以包括镓铟锡合金。 可以可选地使用垫圈来密封网格和热源和散热器之间的液体。 在一个实施例中，热源是集成电路芯片。
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公开(公告)号：US07063127B2
公开(公告)日：2006-06-20
申请号：US10665798
申请日：2003-09-18
申请人： Jeffrey D. Gelorme , Hendrik F. Hamann , Nancy C. LaBianca , Yves C. Martin , Theodore G. Van Kessel
发明人： Jeffrey D. Gelorme , Hendrik F. Hamann , Nancy C. LaBianca , Yves C. Martin , Theodore G. Van Kessel
IPC分类号： F28F7/00
CPC分类号： H01L23/433 , H01L2924/0002 , H01L2924/00
摘要： A thermal interface for IC chip cooling is provided. One embodiment of the thermal interface includes a thermally conductive liquid or paste-like metal(s) disposed within a flexible, thermally conductive enclosure. The enclosure is adapted to be placed between an IC chip and a heat sink to enhance heat transfer from the chip to the heat sink, thereby enabling quicker and more efficient cooling of the chip than can be achieved by conventional techniques. In several embodiments, the thermal interface is held in place by mechanical pressure rather than by bonding, which further facilitates inspection and repair of the IC device.
摘要翻译： 提供了用于IC芯片冷却的热接口。 热界面的一个实施例包括设置在柔性导热外壳内的导热液体或糊状金属。 壳体适于放置在IC芯片和散热器之间，以增强从芯片到散热片的热传递，从而比通过常规技术可以实现的更快和更有效地冷却芯片。 在几个实施例中，热界面通过机械压力而不是通过粘合保持在适当位置，这进一步便于IC器件的检查和修理。
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公开(公告)号：US20120125433A1
公开(公告)日：2012-05-24
申请号：US13364171
申请日：2012-02-01
IPC分类号： H01L31/0224 , H01L31/18
CPC分类号： H01L31/1804 , H01L31/02245 , H01L31/0682 , Y02E10/547 , Y02P70/521
摘要： Electrical contact to the front side of a photovoltaic cell is provided by an array of conductive through-substrate vias, and optionally, an array of conductive blocks located on the front side of the photovoltaic cell. A dielectric liner provides electrical isolation of each conductive through-substrate via from the semiconductor material of the photovoltaic cell. A dielectric layer on the backside of the photovoltaic cell is patterned to cover a contiguous region including all of the conductive through-substrate vias, while exposing a portion of the backside of the photovoltaic cell. A conductive material layer is deposited on the back surface of the photovoltaic cell, and is patterned to form a first conductive wiring structure that electrically connects the conductive through-substrate vias and a second conductive wiring structure that provides electrical connection to the backside of the photovoltaic cell.
摘要翻译： 与光伏电池正面的电接触由导电贯穿衬底通孔的阵列以及可选地位于光伏电池正面的导电块的阵列提供。 电介质衬垫提供每个导电贯穿衬底通孔与光伏电池的半导体材料的电隔离。 在光伏电池的背面上的电介质层被图案化以覆盖包括所有导电贯穿衬底通孔的连续区域，同时暴露光伏电池的背面的一部分。 导电材料层沉积在光伏电池的背表面上，并被图案化以形成第一导电布线结构，其电连接导电贯穿衬底通孔和第二导电布线结构，该第二导电布线结构提供与光伏背面的电连接 细胞。
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公开(公告)号：US20120186626A1
公开(公告)日：2012-07-26
申请号：US13014319
申请日：2011-01-26
IPC分类号： H01L31/052
CPC分类号： H02S20/00 , F24S30/425 , F24S50/20 , F24S2030/115 , F24S2030/132 , H02S20/32 , Y02E10/47 , Y02E10/50
摘要： A solar energy collection system includes a reference member, a support member rotatably mounted relative to the reference member, and a drive system operatively coupled between the reference member and the support member. The drive system includes a linear actuator having a fixed portion operatively connected to the reference member and a strut portion that is selectivity extendable relative to the fixed portion. The strut portion includes an end section. A first connector member is operatively connected between the reference member and the end section of the strut portion, and a second connector member is operatively connected between the support member and the end section of the strut portion. Selective extension and retraction of the strut portion relative to the fixed portion selectively shifts the support member along a desired path.
摘要翻译： 太阳能收集系统包括参考构件，相对于参考构件可旋转地安装的支撑构件和可操作地联接在参考构件和支撑构件之间的驱动系统。 驱动系统包括线性致动器，其具有可操作地连接到参考构件的固定部分和相对于固定部分选择性延伸的支柱部分。 支柱部分包括端部。 第一连接器构件可操作地连接在参考构件和支柱部分的端部之间，并且第二连接器构件可操作地连接在支撑构件和支柱部分的端部之间。 支柱部分相对于固定部分的选择性延伸和缩回选择性地沿着期望的路径移动支撑构件。
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公开(公告)号：US09178466B2
公开(公告)日：2015-11-03
申请号：US13365301
申请日：2012-02-03
IPC分类号： H01L31/00 , H02S20/30 , H01L31/042 , H02S30/20 , H01L31/054
CPC分类号： H02S20/30 , H01L31/042 , H01L31/0547 , H02S10/40 , H02S20/32 , H02S30/20 , Y02E10/52 , Y10T29/49355
摘要： A transportable photovoltaic system includes a plurality of photovoltaic devices, a composite frame to which the plurality of photovoltaic devices are affixed, and a base structure to which the composite frame is movably attached through at least one variable-angle mount structure. The orientation of the frame and the light concentrating elements relative to the base structure can be altered employing the at least one variable-angle mount structure. The frame and the plurality of photovoltaic devices can be assembled prior to shipping, and the base structure can be manufactured on site. The transportable photovoltaic system is not affixed to ground or other fixture, but can be picked up at any time during the operational lifetime. The transportable photovoltaic system can be rapidly deployed with little or no site preparation requirement other than generally level ground, and can be retracted to a lower exposure position to avoid storm and/or hazardous conditions.
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6.发明申请Structure and Methods of Processing for Solder Thermal Interface Materials for Chip Cooling 有权用于芯片冷却的焊料热界面材料的加工结构和方法公开(公告)号：US20080265404A1
公开(公告)日：2008-10-30
申请号：US11742161
申请日：2007-04-30
申请人： Bruce Furman , Madhusudan K. Iyengar , Paul A. Lauro , Yves Martin , Roger R. Schmidt , Da-Yuan Shih , Theodore G. Van Kessel , Wei Zou
发明人： Bruce Furman , Madhusudan K. Iyengar , Paul A. Lauro , Yves Martin , Roger R. Schmidt , Da-Yuan Shih , Theodore G. Van Kessel , Wei Zou
CPC分类号： H01L23/42 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2924/15311 , H01L2224/0401
摘要： Assemblies for dissipating heat from integrated circuits and circuit chips are disclosed. The assemblies include a low melt solder as a thermal interface material (TIM) for the transfer of heat from a chip to a heat sink (HS), wherein the low melt solder has a melting point below the maximum operating temperature of the chip. Methods for making the assemblies are also disclosed.
摘要翻译： 公开了用于从集成电路和电路芯片散热的组件。 组件包括作为用于将热从芯片传递到散热器（HS）的热界面材料（TIM）的低熔点焊料，其中低熔点焊料的熔点低于芯片的最大工作温度。 还公开了制造组件的方法。
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公开(公告)号：US07697291B2
公开(公告)日：2010-04-13
申请号：US11751334
申请日：2007-05-21
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： The present invention is a method and apparatus for cooling a semiconductor heat source. In one embodiment a thermal spreader is provided and includes a substrate for supporting the semiconductor heat source and a heat sink coupled to the substrate. A channel is disposed between the heat sink and substrate. The channel has at least one wall defined by the heat sink. The surface area of the channel wall defined by the heat sink is about 10 to about 100 times the surface area of a bottom surface of the semiconductor heat source. A coolant, for example liquid metal, circulates within the channel.
摘要翻译： 本发明是用于冷却半导体热源的方法和装置。 在一个实施例中，提供了散热器，并且包括用于支撑半导体热源的衬底和耦合到衬底的散热器。 通道设置在散热器和基板之间。 该通道具有至少一个由散热器限定的壁。 由散热器限定的通道壁的表面积为半导体热源的底面的表面积的约10至约100倍。 冷却剂，例如液态金属，在通道内循环。
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公开(公告)号：US07265977B2
公开(公告)日：2007-09-04
申请号：US11037441
申请日：2005-01-18
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： The present invention is a method and apparatus for cooling a semiconductor heat source. In one embodiment a thermal spreader is provided and includes a substrate for supporting the semiconductor heat source and a heat sink coupled to the substrate. A channel is disposed between the heat sink and substrate. The channel has at least one wall defined by the heat sink. The surface area of the channel wall defined by the heat sink is about 10 to about 100 times the surface area of a bottom surface of the semiconductor heat source. A coolant, for example liquid metal, circulates within the channel.
摘要翻译： 本发明是用于冷却半导体热源的方法和装置。 在一个实施例中，提供了散热器，并且包括用于支撑半导体热源的衬底和耦合到衬底的散热器。 通道设置在散热器和基板之间。 该通道具有至少一个由散热器限定的壁。 由散热器限定的通道壁的表面积为半导体热源的底面的表面积的约10至约100倍。 冷却剂，例如液态金属，在通道内循环。
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公开(公告)号：US08776868B2
公开(公告)日：2014-07-15
申请号：US12550090
申请日：2009-08-28
IPC分类号： F28F7/00
CPC分类号： F28F3/12 , F28D2021/0031 , F28F2230/00 , F28F2255/02 , H01L23/427 , H01L2924/0002 , Y10T29/53113 , H01L2924/00
摘要： A cooling device for cooling a computer includes: a flexible and conformal fluid heat-exchanger coupled to a surface of the computer; a liquid coolant material circulated through the fluid heat-exchanger to convey heat from the fluid to an external cooling apparatus; an enclosure defined when the fluid heat-exchanger is placed against the computer surface; and a vacuum applied to the enclosure, removably sealing the fluid heat-exchanger to the computer to provide a vapor seal for the enclosure.
摘要翻译： 用于冷却计算机的冷却装置包括：耦合到计算机的表面的柔性和保形流体热交换器; 循环通过流体热交换器以将热量从流体传送到外部冷却装置的液体冷却剂材料; 当流体热交换器抵靠计算机表面放置时限定的外壳; 以及施加到外壳的真空，可移除地将流体热交换器密封到计算机以为外壳提供蒸气密封。
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公开(公告)号：US20110048672A1
公开(公告)日：2011-03-03
申请号：US12550090
申请日：2009-08-28
CPC分类号： F28F3/12 , F28D2021/0031 , F28F2230/00 , F28F2255/02 , H01L23/427 , H01L2924/0002 , Y10T29/53113 , H01L2924/00
摘要： A cooling device for cooling a computer includes: a flexible and conformal fluid heat-exchanger coupled to a surface of the computer; a liquid coolant material circulated through the fluid heat-exchanger to convey heat from the fluid to an external cooling apparatus; an enclosure defined when the fluid heat-exchanger is placed against the computer surface; and a vacuum applied to the enclosure, removably sealing the fluid heat-exchanger to the computer to provide a vapor seal for the enclosure.
摘要翻译： 用于冷却计算机的冷却装置包括：耦合到计算机的表面的柔性和保形流体热交换器; 循环通过流体热交换器以将热量从流体传送到外部冷却装置的液体冷却剂材料; 当流体热交换器抵靠计算机表面放置时限定的外壳; 以及施加到外壳的真空，可移除地将流体热交换器密封到计算机以为外壳提供蒸气密封。
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