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    Active liquid metal thermal spreader
    2.
    发明授权
    Active liquid metal thermal spreader 有权
    主动液态金属散热器

    公开(公告)号：US07697291B2

    公开(公告)日：2010-04-13

    申请号：US11751334

    申请日：2007-05-21

    申请人： Yves Martin ,  Theodore G. Van Kessel

    发明人： Yves Martin ,  Theodore G. Van Kessel

    IPC分类号： H05K7/20

    CPC分类号： H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The present invention is a method and apparatus for cooling a semiconductor heat source. In one embodiment a thermal spreader is provided and includes a substrate for supporting the semiconductor heat source and a heat sink coupled to the substrate. A channel is disposed between the heat sink and substrate. The channel has at least one wall defined by the heat sink. The surface area of the channel wall defined by the heat sink is about 10 to about 100 times the surface area of a bottom surface of the semiconductor heat source. A coolant, for example liquid metal, circulates within the channel.

    摘要翻译： 本发明是用于冷却半导体热源的方法和装置。 在一个实施例中，提供了散热器，并且包括用于支撑半导体热源的衬底和耦合到衬底的散热器。 通道设置在散热器和基板之间。 该通道具有至少一个由散热器限定的壁。 由散热器限定的通道壁的表面积为半导体热源的底面的表面积的约10至约100倍。 冷却剂，例如液态金属，在通道内循环。

    Active liquid metal thermal spreader
    3.
    发明授权
    Active liquid metal thermal spreader 失效
    主动液态金属散热器

    公开(公告)号：US07265977B2

    公开(公告)日：2007-09-04

    申请号：US11037441

    申请日：2005-01-18

    申请人： Yves Martin ,  Theodore G. Van Kessel

    发明人： Yves Martin ,  Theodore G. Van Kessel

    IPC分类号： H05K7/20

    CPC分类号： H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The present invention is a method and apparatus for cooling a semiconductor heat source. In one embodiment a thermal spreader is provided and includes a substrate for supporting the semiconductor heat source and a heat sink coupled to the substrate. A channel is disposed between the heat sink and substrate. The channel has at least one wall defined by the heat sink. The surface area of the channel wall defined by the heat sink is about 10 to about 100 times the surface area of a bottom surface of the semiconductor heat source. A coolant, for example liquid metal, circulates within the channel.

    摘要翻译： 本发明是用于冷却半导体热源的方法和装置。 在一个实施例中，提供了散热器，并且包括用于支撑半导体热源的衬底和耦合到衬底的散热器。 通道设置在散热器和基板之间。 该通道具有至少一个由散热器限定的壁。 由散热器限定的通道壁的表面积为半导体热源的底面的表面积的约10至约100倍。 冷却剂，例如液态金属，在通道内循环。

    Thermal ground plane for cooling a computer
    4.
    发明授权
    Thermal ground plane for cooling a computer 有权
    用于冷却电脑的热接地平面

    公开(公告)号：US08776868B2

    公开(公告)日：2014-07-15

    申请号：US12550090

    申请日：2009-08-28

    申请人： Yves Martin ,  Theodore G. Van Kessel

    发明人： Yves Martin ,  Theodore G. Van Kessel

    IPC分类号： F28F7/00

    CPC分类号： F28F3/12 ,  F28D2021/0031 ,  F28F2230/00 ,  F28F2255/02 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/53113 ,  H01L2924/00

    摘要： A cooling device for cooling a computer includes: a flexible and conformal fluid heat-exchanger coupled to a surface of the computer; a liquid coolant material circulated through the fluid heat-exchanger to convey heat from the fluid to an external cooling apparatus; an enclosure defined when the fluid heat-exchanger is placed against the computer surface; and a vacuum applied to the enclosure, removably sealing the fluid heat-exchanger to the computer to provide a vapor seal for the enclosure.

    摘要翻译： 用于冷却计算机的冷却装置包括：耦合到计算机的表面的柔性和保形流体热交换器; 循环通过流体热交换器以将热量从流体传送到外部冷却装置的液体冷却剂材料; 当流体热交换器抵靠计算机表面放置时限定的外壳; 以及施加到外壳的真空，可移除地将流体热交换器密封到计算机以为外壳提供蒸气密封。

    GRID-LINE-FREE CONTACT FOR A PHOTOVOLTAIC CELL
    5.
    发明申请
    GRID-LINE-FREE CONTACT FOR A PHOTOVOLTAIC CELL 有权
    光伏电池的无线联系

    公开(公告)号：US20120125433A1

    公开(公告)日：2012-05-24

    申请号：US13364171

    申请日：2012-02-01

    申请人： Supratik Guha ,  Yves Martin ,  Naim Moumen ,  Robert L. Sandstrom ,  Theodore G. Van Kessel

    发明人： Supratik Guha ,  Yves Martin ,  Naim Moumen ,  Robert L. Sandstrom ,  Theodore G. Van Kessel

    IPC分类号： H01L31/0224 ,  H01L31/18

    CPC分类号： H01L31/1804 ,  H01L31/02245 ,  H01L31/0682 ,  Y02E10/547 ,  Y02P70/521

    摘要： Electrical contact to the front side of a photovoltaic cell is provided by an array of conductive through-substrate vias, and optionally, an array of conductive blocks located on the front side of the photovoltaic cell. A dielectric liner provides electrical isolation of each conductive through-substrate via from the semiconductor material of the photovoltaic cell. A dielectric layer on the backside of the photovoltaic cell is patterned to cover a contiguous region including all of the conductive through-substrate vias, while exposing a portion of the backside of the photovoltaic cell. A conductive material layer is deposited on the back surface of the photovoltaic cell, and is patterned to form a first conductive wiring structure that electrically connects the conductive through-substrate vias and a second conductive wiring structure that provides electrical connection to the backside of the photovoltaic cell.

    摘要翻译： 与光伏电池正面的电接触由导电贯穿衬底通孔的阵列以及可选地位于光伏电池正面的导电块的阵列提供。 电介质衬垫提供每个导电贯穿衬底通孔与光伏电池的半导体材料的电隔离。 在光伏电池的背面上的电介质层被图案化以覆盖包括所有导电贯穿衬底通孔的连续区域，同时暴露光伏电池的背面的一部分。 导电材料层沉积在光伏电池的背表面上，并被图案化以形成第一导电布线结构，其电连接导电贯穿衬底通孔和第二导电布线结构，该第二导电布线结构提供与光伏背面的电连接 细胞。

    THERMAL GROUND PLANE FOR COOLING A COMPUTER
    6.
    发明申请
    THERMAL GROUND PLANE FOR COOLING A COMPUTER 有权
    用于冷却计算机的热接地平面

    公开(公告)号：US20110048672A1

    公开(公告)日：2011-03-03

    申请号：US12550090

    申请日：2009-08-28

    申请人： YVES MARTIN ,  Theodore G. Van Kessel

    发明人： YVES MARTIN ,  Theodore G. Van Kessel

    IPC分类号： F28F7/00 ,  B23P15/26 ,  F28D15/00

    CPC分类号： F28F3/12 ,  F28D2021/0031 ,  F28F2230/00 ,  F28F2255/02 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/53113 ,  H01L2924/00

    摘要： A cooling device for cooling a computer includes: a flexible and conformal fluid heat-exchanger coupled to a surface of the computer; a liquid coolant material circulated through the fluid heat-exchanger to convey heat from the fluid to an external cooling apparatus; an enclosure defined when the fluid heat-exchanger is placed against the computer surface; and a vacuum applied to the enclosure, removably sealing the fluid heat-exchanger to the computer to provide a vapor seal for the enclosure.

    摘要翻译： 用于冷却计算机的冷却装置包括：耦合到计算机的表面的柔性和保形流体热交换器; 循环通过流体热交换器以将热量从流体传送到外部冷却装置的液体冷却剂材料; 当流体热交换器抵靠计算机表面放置时限定的外壳; 以及施加到外壳的真空，可移除地将流体热交换器密封到计算机以为外壳提供蒸气密封。

    Heterogeneous thermal interface for cooling
    8.
    发明授权
    Heterogeneous thermal interface for cooling 有权
    用于冷却的异质热界面

    公开(公告)号：US07219713B2

    公开(公告)日：2007-05-22

    申请号：US11037913

    申请日：2005-01-18

    申请人： Jeffrey D. Gelorme ,  Supratik Guha ,  Nancy C. LaBianca ,  Yves Martin ,  Theodore G. Van Kessel

    发明人： Jeffrey D. Gelorme ,  Supratik Guha ,  Nancy C. LaBianca ,  Yves Martin ,  Theodore G. Van Kessel

    IPC分类号： F28F7/00

    CPC分类号： H01L23/3733 ,  H01L23/4093 ,  H01L23/42 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The present invention is a thermal interface for coupling a heat source to a heat sink. One embodiment of the invention comprises a mesh and a liquid, e.g., a thermally conductive liquid, disposed in the mesh. The mesh and the thermally conductive liquid are adapted to contact both the heat source and the heat sink when disposed therebetween. In one embodiment, the mesh may comprise a metal or organic material compatible with the liquid. In one embodiment, the liquid may comprise liquid metal. For example, the liquid may comprise a gallium indium tin alloy. A gasket may optionally be used to seal the mesh and the liquid between the heat source and the heat sink. In one embodiment, the heat source is an integrated circuit chip.

    摘要翻译： 本发明是用于将热源耦合到散热器的热界面。 本发明的一个实施例包括设置在网中的网和液体，例如导热液体。 网格和导热液体在其间设置时适于接触热源和散热器。 在一个实施方案中，网可以包含与液体相容的金属或有机材料。 在一个实施方案中，液体可以包含液态金属。 例如，液体可以包括镓铟锡合金。 可以可选地使用垫圈来密封网格和热源和散热器之间的液体。 在一个实施例中，热源是集成电路芯片。

    SOLAR ENERGY COLLECTION SYSTEM
    10.
    发明申请
    SOLAR ENERGY COLLECTION SYSTEM 审中-公开
    太阳能收集系统

    公开(公告)号：US20120186626A1

    公开(公告)日：2012-07-26

    申请号：US13014319

    申请日：2011-01-26

    申请人： Supratik Guha ,  Yves C. Martin ,  Naim Moumen ,  Robert L. Sandstrom ,  Theodore G. Van Kessel

    发明人： Supratik Guha ,  Yves C. Martin ,  Naim Moumen ,  Robert L. Sandstrom ,  Theodore G. Van Kessel

    IPC分类号： H01L31/052

    CPC分类号： H02S20/00 ,  F24S30/425 ,  F24S50/20 ,  F24S2030/115 ,  F24S2030/132 ,  H02S20/32 ,  Y02E10/47 ,  Y02E10/50

    摘要： A solar energy collection system includes a reference member, a support member rotatably mounted relative to the reference member, and a drive system operatively coupled between the reference member and the support member. The drive system includes a linear actuator having a fixed portion operatively connected to the reference member and a strut portion that is selectivity extendable relative to the fixed portion. The strut portion includes an end section. A first connector member is operatively connected between the reference member and the end section of the strut portion, and a second connector member is operatively connected between the support member and the end section of the strut portion. Selective extension and retraction of the strut portion relative to the fixed portion selectively shifts the support member along a desired path.

    摘要翻译： 太阳能收集系统包括参考构件，相对于参考构件可旋转地安装的支撑构件和可操作地联接在参考构件和支撑构件之间的驱动系统。 驱动系统包括线性致动器，其具有可操作地连接到参考构件的固定部分和相对于固定部分选择性延伸的支柱部分。 支柱部分包括端部。 第一连接器构件可操作地连接在参考构件和支柱部分的端部之间，并且第二连接器构件可操作地连接在支撑构件和支柱部分的端部之间。 支柱部分相对于固定部分的选择性延伸和缩回选择性地沿着期望的路径移动支撑构件。