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公开(公告)号：US20110204501A1
公开(公告)日：2011-08-25
申请号：US13100768
申请日：2011-05-04
IPC分类号： H01L23/495
CPC分类号： H01L23/49548 , H01L23/3107 , H01L23/49541 , H01L2924/0002 , H01L2924/00
摘要： An integrated circuit packaging system includes: a plurality of leads with a predetermined thickness and a predetermined interval gap between each of the plurality of leads; each one of the plurality of leads includes first terminal ends disposed adjacent an integrated circuit and second terminal ends disposed along a periphery of a package; and a lead-to-lead gap formed between the second terminal ends of alternating leads in excess of the predetermined interval gap.
摘要翻译： 集成电路封装系统包括：具有预定厚度的多个引线和多个引线中的每一个之间的预定间隔间隙; 所述多个引线中的每一个包括邻近集成电路设置的第一端子和沿着封装的周边设置的第二端子端; 以及在交替引线的第二端部之间形成的引出线间隙超过预定间隔间隙。
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公开(公告)号：US07947534B2
公开(公告)日：2011-05-24
申请号：US11307383
申请日：2006-02-04
IPC分类号： H01L33/62
CPC分类号： H01L23/49548 , H01L23/3107 , H01L23/49541 , H01L2924/0002 , H01L2924/00
摘要： An integrated circuit package system is provided including: forming a plurality of leads with a predetermined thickness and a predetermined interval gap between each of the plurality of leads; configuring each one of the plurality of leads to include first terminal ends disposed adjacent an integrated circuit and second terminal ends disposed along a periphery of a package; and forming the second terminal ends of alternating leads disposed along the periphery of the package to form an etched lead-to-lead gap in excess of the predetermined interval gap.
摘要翻译： 提供一种集成电路封装系统，包括：在多个引线中的每一个之间形成具有预定厚度和预定间隔间隙的多个引线; 配置所述多个引线中的每一个包括邻近集成电路设置的第一终端和沿着封装的周边设置的第二终端; 以及沿着所述封装的周边形成交替引线的第二端部，以形成超过所述预定间隔间隙的蚀刻引线到引线间隙。
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公开(公告)号：US08207597B2
公开(公告)日：2012-06-26
申请号：US11670899
申请日：2007-02-02
IPC分类号： H01L23/495
CPC分类号： H01L21/565 , H01L21/4828 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L24/48 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided including forming a lead frame including forming an inner lead having a planar surface, the inner lead extending inwardly from the lead frame and forming a stiffening structure integral with the lead frame for maintaining the planar surface; encapsulating the inner lead with an electrical connection to an integrated circuit die and with a first inner lead body of the inner lead exposed; and singulating the inner lead from the lead frame.
摘要翻译： 提供了一种集成电路封装系统，包括形成引线框架，该引线框架包括形成具有平坦表面的内引线，该内引线从引线框架向内延伸并形成与引线框架一体的加强结构，用于保持平面; 将内部引线封装到集成电路管芯的电连接处，并且内部引线的第一内部引线体被暴露; 并从引线框架中分离出内引线。
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公开(公告)号：US20090250798A1
公开(公告)日：2009-10-08
申请号：US12484131
申请日：2009-06-12
IPC分类号： H01L23/495 , H01L21/56 , H01L23/498 , H01L23/28
CPC分类号： H01L23/3107 , H01L23/49503 , H01L23/49541 , H01L23/49548 , H01L2224/10175 , H01L2224/16 , H01L2224/16245 , H01L2924/3841 , Y10T29/49121 , Y10T29/49169 , Y10T29/49181
摘要： An integrated circuit package system with interconnect support is provided including providing an integrated circuit, forming an electrical interconnect on the integrated circuit, forming a contact pad having a chip support, and coupling the integrated circuit to the contact pad by the electrical interconnect, with the integrated circuit on the chip support.
摘要翻译： 提供具有互连支持的集成电路封装系统，包括提供集成电路，在集成电路上形成电互连，形成具有芯片支撑的接触焊盘，以及通过电互连将集成电路耦合到接触焊盘， 集成电路在芯片上的支持。
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公开(公告)号：US07420265B2
公开(公告)日：2008-09-02
申请号：US11164321
申请日：2005-11-17
IPC分类号： H01L23/495
CPC分类号： H01L24/32 , H01L23/3107 , H01L23/49548 , H01L23/49558 , H01L24/73 , H01L2224/1012 , H01L2224/16245 , H01L2224/81136 , H01L2224/81138 , H01L2924/00013 , H01L2924/01005 , H01L2924/01033 , H01L2924/01082 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2224/29099 , H01L2924/00
摘要： An integrated circuit package system including an integrated circuit die, a leadframe and an integrated circuit support. The integrated circuit support between the integrated circuit die and the leadframe with the electrical interconnects connected to the leadframe.
摘要翻译： 一种集成电路封装系统，包括集成电路管芯，引线框架和集成电路支架。 集成电路管芯与引线框架之间的集成电路支持，电气互连连接到引线框。
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公开(公告)号：US20080012100A1
公开(公告)日：2008-01-17
申请号：US11670899
申请日：2007-02-02
IPC分类号： H01L23/495
CPC分类号： H01L21/565 , H01L21/4828 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L24/48 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided including forming a lead frame including forming an inner lead having a planar surface, the inner lead extending inwardly from the lead frame and forming a stiffening structure integral with the lead frame for maintaining the planar surface; encapsulating the inner lead with an electrical connection to an integrated circuit die and with a first inner lead body of the inner lead exposed; and singulating the inner lead from the lead frame.
摘要翻译： 提供了一种集成电路封装系统，包括形成引线框架，该引线框架包括形成具有平坦表面的内引线，该内引线从引线框架向内延伸并形成与引线框架一体的加强结构，用于保持平面; 将内部引线封装到集成电路管芯的电连接处，并且内部引线的第一内部引线体被暴露; 并从引线框架中分离出内引线。
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公开(公告)号：US08399968B2
公开(公告)日：2013-03-19
申请号：US11164335
申请日：2005-11-18
IPC分类号： H01L23/495
CPC分类号： H01L23/49503 , H01L23/49541 , H01L2924/0002 , H01L2924/00
摘要： A non-leaded integrated circuit package system is provided providing a die paddle of a lead frame, forming a dual row of terminals including outer terminal pads and inner terminal pads, and selectively fusing an extension between the die paddle and instances of the inner terminal pads.
摘要翻译： 提供了一种非引线集成电路封装系统，其提供引线框架的管芯焊盘，形成包括外部端子焊盘和内部端子焊盘的双排端子，并且选择性地熔合管芯焊盘与内部端子焊盘的实例之间的延伸 。
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公开(公告)号：US07928540B2
公开(公告)日：2011-04-19
申请号：US11558589
申请日：2006-11-10
IPC分类号： H01L21/56 , H01L23/495
CPC分类号： H01L23/49548 , H01L21/565 , H01L23/3107 , H01L24/48 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided including forming an external interconnect having a lead body and a lead tip, forming a lead protrusion in the lead tip, connecting a device and the external interconnect, and encapsulating the device and the external interconnect.
摘要翻译： 提供一种集成电路封装系统，包括形成具有引线主体和引线端头的外部互连件，在引线端头中形成引线突起，连接器件和外部互连，并封装器件和外部互连。
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公开(公告)号：US07563647B2
公开(公告)日：2009-07-21
申请号：US11456532
申请日：2006-07-10
IPC分类号： H01L21/00 , H01R43/00 , H01L23/495
CPC分类号： H01L23/3107 , H01L23/49503 , H01L23/49541 , H01L23/49548 , H01L2224/10175 , H01L2224/16 , H01L2224/16245 , H01L2924/3841 , Y10T29/49121 , Y10T29/49169 , Y10T29/49181
摘要： An integrated circuit package system with interconnect support is provided including providing an integrated circuit, forming an electrical interconnect on the integrated circuit, forming a contact pad having a chip support, and coupling the integrated circuit to the contact pad by the electrical interconnect, with the integrated circuit on the chip support.
摘要翻译： 提供具有互连支持的集成电路封装系统，包括提供集成电路，在集成电路上形成电互连，形成具有芯片支撑的接触焊盘，以及通过电互连将集成电路耦合到接触焊盘， 集成电路在芯片上的支持。
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公开(公告)号：US07400049B2
公开(公告)日：2008-07-15
申请号：US11307683
申请日：2006-02-16
IPC分类号： H01L23/28
CPC分类号： H01L23/4334 , H01L21/568 , H01L23/3135 , H01L23/49568 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided forming an external interconnect from a padless lead frame, encapsulating a heat sink and the external interconnect, mounting an integrated circuit die on the heat sink, and encapsulating the integrated circuit die, the heat sink, and the external interconnect.
摘要翻译： 提供一种集成电路封装系统，其形成来自无引脚引线框架的外部互连，封装散热器和外部互连，将集成电路管芯安装在散热器上，以及封装集成电路管芯，散热器和外部 互连。
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