公开(公告)号：US08207597B2

公开(公告)日：2012-06-26

申请号：US11670899

申请日：2007-02-02

申请人： Jeffrey D. Punzalan ,  Henry D. Bathan ,  Il Kwon Shim ,  Zigmund Ramirez Camacho

发明人： Jeffrey D. Punzalan ,  Henry D. Bathan ,  Il Kwon Shim ,  Zigmund Ramirez Camacho

IPC分类号： H01L23/495

CPC分类号： H01L21/565 ,  H01L21/4828 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system is provided including forming a lead frame including forming an inner lead having a planar surface, the inner lead extending inwardly from the lead frame and forming a stiffening structure integral with the lead frame for maintaining the planar surface; encapsulating the inner lead with an electrical connection to an integrated circuit die and with a first inner lead body of the inner lead exposed; and singulating the inner lead from the lead frame.

摘要翻译： 提供了一种集成电路封装系统，包括形成引线框架，该引线框架包括形成具有平坦表面的内引线，该内引线从引线框架向内延伸并形成与引线框架一体的加强结构，用于保持平面; 将内部引线封装到集成电路管芯的电连接处，并且内部引线的第一内部引线体被暴露; 并从引线框架中分离出内引线。

公开(公告)号：US20090250798A1

公开(公告)日：2009-10-08

申请号：US12484131

申请日：2009-06-12

申请人： Henry D. Bathan ,  Il Kwon Shim ,  Jeffrey D. Punzalan ,  Zigmund Ramirez Camacho

发明人： Henry D. Bathan ,  Il Kwon Shim ,  Jeffrey D. Punzalan ,  Zigmund Ramirez Camacho

IPC分类号： H01L23/495 ,  H01L21/56 ,  H01L23/498 ,  H01L23/28

CPC分类号： H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49548 ,  H01L2224/10175 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2924/3841 ,  Y10T29/49121 ,  Y10T29/49169 ,  Y10T29/49181

摘要： An integrated circuit package system with interconnect support is provided including providing an integrated circuit, forming an electrical interconnect on the integrated circuit, forming a contact pad having a chip support, and coupling the integrated circuit to the contact pad by the electrical interconnect, with the integrated circuit on the chip support.

摘要翻译： 提供具有互连支持的集成电路封装系统，包括提供集成电路，在集成电路上形成电互连，形成具有芯片支撑的接触焊盘，以及通过电互连将集成电路耦合到接触焊盘， 集成电路在芯片上的支持。

公开(公告)号：US07420265B2

公开(公告)日：2008-09-02

申请号：US11164321

申请日：2005-11-17

申请人： Henry D. Bathan ,  Il Kwon Shim ,  Jeffrey D. Punzalan ,  Zigmund Ramirez Camacho

发明人： Henry D. Bathan ,  Il Kwon Shim ,  Jeffrey D. Punzalan ,  Zigmund Ramirez Camacho

IPC分类号： H01L23/495

CPC分类号： H01L24/32 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49558 ,  H01L24/73 ,  H01L2224/1012 ,  H01L2224/16245 ,  H01L2224/81136 ,  H01L2224/81138 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2224/29099 ,  H01L2924/00

摘要： An integrated circuit package system including an integrated circuit die, a leadframe and an integrated circuit support. The integrated circuit support between the integrated circuit die and the leadframe with the electrical interconnects connected to the leadframe.

摘要翻译： 一种集成电路封装系统，包括集成电路管芯，引线框架和集成电路支架。 集成电路管芯与引线框架之间的集成电路支持，电气互连连接到引线框。

公开(公告)号：US20080012100A1

公开(公告)日：2008-01-17

申请号：US11670899

申请日：2007-02-02

申请人： Jeffrey D. Punzalan ,  Henry D. Bathan ,  Il Kwon Shim ,  Zigmund Ramirez Camacho

发明人： Jeffrey D. Punzalan ,  Henry D. Bathan ,  Il Kwon Shim ,  Zigmund Ramirez Camacho

IPC分类号： H01L23/495

CPC分类号： H01L21/565 ,  H01L21/4828 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system is provided including forming a lead frame including forming an inner lead having a planar surface, the inner lead extending inwardly from the lead frame and forming a stiffening structure integral with the lead frame for maintaining the planar surface; encapsulating the inner lead with an electrical connection to an integrated circuit die and with a first inner lead body of the inner lead exposed; and singulating the inner lead from the lead frame.

摘要翻译： 提供了一种集成电路封装系统，包括形成引线框架，该引线框架包括形成具有平坦表面的内引线，该内引线从引线框架向内延伸并形成与引线框架一体的加强结构，用于保持平面; 将内部引线封装到集成电路管芯的电连接处，并且内部引线的第一内部引线体被暴露; 并从引线框架中分离出内引线。

公开(公告)号：US07947534B2

公开(公告)日：2011-05-24

申请号：US11307383

申请日：2006-02-04

申请人： Jeffrey D. Punzalan ,  Henry D. Bathan ,  Il Kwon Shim ,  Keng Kiat Lau

发明人： Jeffrey D. Punzalan ,  Henry D. Bathan ,  Il Kwon Shim ,  Keng Kiat Lau

IPC分类号： H01L33/62

CPC分类号： H01L23/49548 ,  H01L23/3107 ,  H01L23/49541 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated circuit package system is provided including: forming a plurality of leads with a predetermined thickness and a predetermined interval gap between each of the plurality of leads; configuring each one of the plurality of leads to include first terminal ends disposed adjacent an integrated circuit and second terminal ends disposed along a periphery of a package; and forming the second terminal ends of alternating leads disposed along the periphery of the package to form an etched lead-to-lead gap in excess of the predetermined interval gap.

摘要翻译： 提供一种集成电路封装系统，包括：在多个引线中的每一个之间形成具有预定厚度和预定间隔间隙的多个引线; 配置所述多个引线中的每一个包括邻近集成电路设置的第一终端和沿着封装的周边设置的第二终端; 以及沿着所述封装的周边形成交替引线的第二端部，以形成超过所述预定间隔间隙的蚀刻引线到引线间隙。

公开(公告)号：US07928540B2

公开(公告)日：2011-04-19

申请号：US11558589

申请日：2006-11-10

申请人： Il Kwon Shim ,  Antonio B. Dimaano, Jr. ,  Henry D. Bathan ,  Jeffrey D. Punzalan

发明人： Il Kwon Shim ,  Antonio B. Dimaano, Jr. ,  Henry D. Bathan ,  Jeffrey D. Punzalan

IPC分类号： H01L21/56 ,  H01L23/495

CPC分类号： H01L23/49548 ,  H01L21/565 ,  H01L23/3107 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system is provided including forming an external interconnect having a lead body and a lead tip, forming a lead protrusion in the lead tip, connecting a device and the external interconnect, and encapsulating the device and the external interconnect.

摘要翻译： 提供一种集成电路封装系统，包括形成具有引线主体和引线端头的外部互连件，在引线端头中形成引线突起，连接器件和外部互连，并封装器件和外部互连。

公开(公告)号：US07563647B2

公开(公告)日：2009-07-21

申请号：US11456532

申请日：2006-07-10

申请人： Henry D. Bathan ,  Il Kwon Shim ,  Jeffrey D. Punzalan ,  Zigmund Ramirez Camacho

发明人： Henry D. Bathan ,  Il Kwon Shim ,  Jeffrey D. Punzalan ,  Zigmund Ramirez Camacho

IPC分类号： H01L21/00 ,  H01R43/00 ,  H01L23/495

CPC分类号： H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49548 ,  H01L2224/10175 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2924/3841 ,  Y10T29/49121 ,  Y10T29/49169 ,  Y10T29/49181

摘要： An integrated circuit package system with interconnect support is provided including providing an integrated circuit, forming an electrical interconnect on the integrated circuit, forming a contact pad having a chip support, and coupling the integrated circuit to the contact pad by the electrical interconnect, with the integrated circuit on the chip support.

摘要翻译： 提供具有互连支持的集成电路封装系统，包括提供集成电路，在集成电路上形成电互连，形成具有芯片支撑的接触焊盘，以及通过电互连将集成电路耦合到接触焊盘， 集成电路在芯片上的支持。

公开(公告)号：US07400049B2

公开(公告)日：2008-07-15

申请号：US11307683

申请日：2006-02-16

申请人： Il Kwon Shim ,  Henry D. Bathan ,  Zigmund Ramirez Camacho ,  Jeffrey D. Punzalan

发明人： Il Kwon Shim ,  Henry D. Bathan ,  Zigmund Ramirez Camacho ,  Jeffrey D. Punzalan

IPC分类号： H01L23/28

CPC分类号： H01L23/4334 ,  H01L21/568 ,  H01L23/3135 ,  H01L23/49568 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system is provided forming an external interconnect from a padless lead frame, encapsulating a heat sink and the external interconnect, mounting an integrated circuit die on the heat sink, and encapsulating the integrated circuit die, the heat sink, and the external interconnect.

摘要翻译： 提供一种集成电路封装系统，其形成来自无引脚引线框架的外部互连，封装散热器和外部互连，将集成电路管芯安装在散热器上，以及封装集成电路管芯，散热器和外部 互连。

公开(公告)号：US20080111215A1

公开(公告)日：2008-05-15

申请号：US11558589

申请日：2006-11-10

申请人： Il Kwon Shim ,  Antonio B. Dimaano ,  Henry D. Bathan ,  Jeffrey D. Punzalan

发明人： Il Kwon Shim ,  Antonio B. Dimaano ,  Henry D. Bathan ,  Jeffrey D. Punzalan

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49548 ,  H01L21/565 ,  H01L23/3107 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system is provided including forming an external interconnect having a lead body and a lead tip, forming a lead protrusion in the lead tip, connecting a device and the external interconnect, and encapsulating the device and the external interconnect.

摘要翻译： 提供一种集成电路封装系统，包括形成具有引线主体和引线端头的外部互连件，在引线端头中形成引线突起，连接器件和外部互连，并封装器件和外部互连。

公开(公告)号：US07274089B2

公开(公告)日：2007-09-25

申请号：US11162682

申请日：2005-09-19

申请人： Jeffrey D. Punzalan ,  Il Kwon Shim ,  Zigmund Ramirez Camacho ,  Henry D. Bathan

发明人： Jeffrey D. Punzalan ,  Il Kwon Shim ,  Zigmund Ramirez Camacho ,  Henry D. Bathan

IPC分类号： H01L23/495

CPC分类号： H01L23/49503 ,  H01L21/4828 ,  H01L23/49548 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/27013 ,  H01L2224/29007 ,  H01L2224/29191 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/2939 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/0715 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system including an integrated circuit die and a lead frame with a trenched die pad. The integrated circuit die is mounted to the trenched die pad.

摘要翻译： 一种集成电路封装系统，包括集成电路管芯和具有沟槽管芯焊盘的引线框架。 集成电路管芯安装到沟槽焊盘上。