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    Micro-actuator transducer stack inertia cancellation control
    3.
    发明授权
    Micro-actuator transducer stack inertia cancellation control 有权
    微执行器传感器堆栈惯性取消控制

    公开(公告)号：US06765743B2

    公开(公告)日：2004-07-20

    申请号：US09837691

    申请日：2001-04-18

    申请人： Dale E. Goodman ,  Eric A. Eckberg

    发明人： Dale E. Goodman ,  Eric A. Eckberg

    IPC分类号： G11B2102

    CPC分类号： G11B5/4846 ,  G11B5/4853 ,  G11B5/5552

    摘要： A micro-actuator of a head suspension either is wired in a reverse polarity to effect movement of the suspension arms in opposing directions relative to the magnetic disks or reversed in physical orientation and wired identically. This permits a single micro-actuator control signal to control all micro-actuators and thereby cancel the affects of inertia of the suspension arms and the read/write heads on the actuator arms as half of the suspension arms and magnetic heads move in one direction while, simultaneously, the other half of the suspension arms and magnetic heads move in a second, opposite direction in response to a single control signal, simplifying wiring and control electronics. The counter-movement of the suspension arms and magnetic counter the inertia and inertial forces and expedite the settling into their stable recording/reading positions, thereby reducing seek times and improving disk drive performance.

    摘要翻译： 磁头悬架的微致动器或者以相反的极性布线，以实现相对于磁盘的相反方向的悬架臂的移动或物理取向反向并且相同地布线。 这允许单个微致动器控制信号来控制所有微致动器，从而在悬架臂和磁头的一半沿一个方向移动的同时消除悬架臂和致动器臂上的读/写头的惯性的影响，同时 同时，另一半的悬架臂和磁头响应于单个控制信号在第二相反方向上移动，从而简化布线和控制电子装置。 悬架臂和磁铁的反运动反映了惯性和惯性力，并加快了稳定的记录/读取位置，从而减少了寻道时间，提高了磁盘驱动器性能。

    Universal surface finish for DCA, SMT and pad on pad interconnections
    4.
    发明授权
    Universal surface finish for DCA, SMT and pad on pad interconnections 失效
    DCA，SMT和焊盘互连焊盘的通用表面光洁度

    公开(公告)号：US5910644A

    公开(公告)日：1999-06-08

    申请号：US873060

    申请日：1997-06-11

    申请人： Dale E. Goodman ,  Mark K. Hoffmeyer ,  Roger S. Krabbenhoft

    发明人： Dale E. Goodman ,  Mark K. Hoffmeyer ,  Roger S. Krabbenhoft

    IPC分类号： H05K3/24 ,  H05K1/16

    CPC分类号： H05K3/244 ,  H01L2224/45147 ,  H01L2224/49171 ,  H01L2924/19105

    摘要： A printed circuit connector terminal pad coating technique is disclosed which functions as a single universal pad surface which supports multiple electrical connection practices including wirebonding, soldering, and wear resistant, pad on pad mechanical connection. The tri-plate surface treatment includes an initial diffusion resistant coating of nickel; an intermediate layer of hard, wear resistant noble or semi-noble metal that provides pad on pad connector reliability and affords a metallurgically stable solder joints and wirebond interfaces; and a final coating of soft gold. The intermediate layer may be pure palladium having a nominal thickness of 35 microinches or a layer of gold, hardened by cobalt, nickel, iron or a combination of these dopants to effect a hardness of 200 to 250 (Knoop scale). The use of a common surface treatment for the multiple attachment processes is implemented with a single masking step, rather than a sequence of selective masking, plating and stripping operations. In the printed circuit environment, the masking is provided by the final covering that encloses, seals, and electrically insulates the conductors in a circuit board application or in the instance of a flexcable, the adhesive coated flexible coverlay the covers and seals the copper conductor elements while exposing the conductor terminal pads.

    摘要翻译： 公开了一种印刷电路连接器端子焊盘涂覆技术，其作为单个通用焊盘表面，其支持多种电连接实践，包括引线键合，焊接和耐磨，焊盘机械连接。 三板表面处理包括镍的初始扩散涂层; 硬质耐磨贵金属或半贵金属的中间层，提供衬垫连接器可靠性的焊盘，并提供冶金稳定的焊点和引线接口; 和最后的软金涂层。 中间层可以是公称厚度为35微英寸的纯钯或由钴，镍，铁或这些掺杂剂的组合硬化的金层，以实现200至250（Knoop量程）的硬度。 通过单个掩蔽步骤而不是选择性掩蔽，电镀和剥离操作的顺序来实现对多个附接过程的常见表面处理的使用。 在印刷电路环境中，掩模由最终的覆盖物提供，封装，密封和电绝缘在电路板应用中，或者在柔性的情况下，粘合剂涂覆的柔性覆盖物覆盖并密封铜导体元件 同时暴露导体端子焊盘。