Method and apparatus for reducing nozzle failure in stored inkjet printheads
    3.
    发明申请
    Method and apparatus for reducing nozzle failure in stored inkjet printheads 有权
    用于减少存储的喷墨打印头中的喷嘴故障的方法和装置

    公开(公告)号:US20060023036A1

    公开(公告)日:2006-02-02

    申请号:US10909044

    申请日:2004-07-30

    IPC分类号: B41J2/17

    摘要: An inkjet printhead and a method for increasing the shelf life thereof are herein disclosed. The inkjet printhead has one or more nozzles for dispensing a colorant. These nozzles are fluidically connected to a reservoir. A first colorant substantially fills the nozzles while a second colorant is reserved in the reservoir.

    摘要翻译: 本文公开了一种喷墨打印头及其保存期限的增加方法。 喷墨打印头具有用于分配着色剂的一个或多个喷嘴。 这些喷嘴流体地连接到储存器。 第一着色剂基本上填充喷嘴,而在储存器中保留第二着色剂。

    Ink recirculation system
    5.
    发明申请
    Ink recirculation system 有权
    油墨循环系统

    公开(公告)号:US20060187278A1

    公开(公告)日:2006-08-24

    申请号:US11062043

    申请日:2005-02-18

    IPC分类号: B41J2/17

    CPC分类号: B41J2/175 B41J2/17596

    摘要: One embodiment of a method of storing a printhead includes opening a valve to a vent of an ink reservoir, operating a pump in a first direction to pull ink from the ink reservoir through said valve, and pumping the ink pulled from the ink reservoir to an ink supply container.

    摘要翻译: 存储打印头的方法的一个实施例包括将阀打开到墨水储存器的通风口,在第一方向上操作泵以从墨水储存器抽吸墨水通过所述阀,并且将从墨水储存器抽出的墨水泵送到 供墨容器

    Methods for hermetic sealing of post media-filled MEMS package
    7.
    发明授权
    Methods for hermetic sealing of post media-filled MEMS package 失效
    填充后填充的MEMS封装的密封方法

    公开(公告)号:US07534662B2

    公开(公告)日:2009-05-19

    申请号:US11127915

    申请日:2005-05-11

    IPC分类号: H01L21/00 H01L23/22

    摘要: This invention provides a system and method for hermetically sealing a post media-filled package with a metal cap. The method can include the operation of filling a MEMS package through a fill port with at least one medium. A further operation can be plugging the fill port in the MEMS package with a sealant. Another operation can include depositing a metal cap over the sealant to hermetically seal the fill port.

    摘要翻译: 本发明提供了一种用金属盖密封填充后填充包装的系统和方法。 该方法可以包括通过具有至少一种介质的填充端口填充MEMS封装的操作。 进一步的操作可以用密封剂堵塞MEMS封装中的填充端口。 另一种操作可以包括在密封剂上沉积金属盖以气密地密封填充口。

    Package having bond-sealed underbump
    8.
    发明申请
    Package having bond-sealed underbump 有权
    封装具有密封的底部灌封

    公开(公告)号:US20050275072A1

    公开(公告)日:2005-12-15

    申请号:US10854110

    申请日:2004-05-26

    IPC分类号: B81C1/00 H01L23/02

    CPC分类号: B81C1/00269

    摘要: A package for containing microelectromechanical devices includes a first substrate wafer, and a second substrate wafer made of an optical quality material. An underbump is interposed between the first and second substrate wafers. The underbump is composed of a standoff region and a localized bond region. The first and second substrate wafers and the underbump define a chamber that contains at least one microelectronic device.

    摘要翻译: 用于容纳微机电器件的封装包括第一衬底晶片和由光学质量材料制成的第二衬底晶片。 在第一和第二基板晶片之间插入底部凹凸。 底部凹坑由间隔区域和局部粘结区域组成。 第一和第二衬底晶片和底部凹部限定包含至少一个微电子器件的腔室。

    SYSTEM AND METHODS FOR HERMETIC SEALING OF POST MEDIA-FILLED MEMS PACKAGE
    10.
    发明申请
    SYSTEM AND METHODS FOR HERMETIC SEALING OF POST MEDIA-FILLED MEMS PACKAGE 有权
    用于封装后封装的MEMS封装的系统和方法

    公开(公告)号:US20050184382A1

    公开(公告)日:2005-08-25

    申请号:US10783849

    申请日:2004-02-19

    摘要: This invention provides a system and method for hermetically sealing a post media-filled package with a metal cap. The method can include the operation of filling a MEMS package through a fill port with at least one medium. A further operation can be plugging the fill port in the MEMS package with a sealant. Another operation can include depositing a metal cap over the sealant to hermetically seal the fill port.

    摘要翻译: 本发明提供了一种用金属盖密封填充后填充包装的系统和方法。 该方法可以包括通过具有至少一种介质的填充端口填充MEMS封装的操作。 进一步的操作可以用密封剂堵塞MEMS封装中的填充端口。 另一种操作可以包括在密封剂上沉积金属盖以气密地密封填充口。