-
公开(公告)号：US07585334B2
公开(公告)日：2009-09-08
申请号：US11065742
申请日：2005-02-25
申请人： Jeffrey M. Catchmark , Gregory S. McCarty , Anat Hatzor-de Picciotto , Guy P. Lavallee , Michael A. Rogosky
发明人： Jeffrey M. Catchmark , Gregory S. McCarty , Anat Hatzor-de Picciotto , Guy P. Lavallee , Michael A. Rogosky
IPC分类号： H01L21/00
摘要： A multi-layer resist process is used to define a sacrificial host structure used to produce a molecular ruler useful for defining structures via a lift-off type process. By using this process, the removal of the host structure is significantly simplified, and a structure is formed which is perfect for achieving a reproducible high yield lift-off. Moreover, the processes disclosed are completely compatible with volume IC manufacturing processes, and uses a minimum of the organic material which, in a high volume production application, will dramatically reduce solution depletion.
摘要翻译： 使用多层抗蚀剂工艺来定义用于产生用于通过剥离型工艺限定结构的分子尺的牺牲主体结构。 通过使用该方法，主体结构的去除被显着简化，并且形成了对于实现可再现的高屈服剥离是完美的结构。 此外，所公开的方法与体积IC制造工艺完全兼容，并且使用至少有机材料，其在大量生产应用中将显着减少溶液耗尽。
-
2.发明授权Optical waveguides and grating structures fabricated using polymeric dielectric compositions 失效使用聚合物电介质组合物制造的光波导和光栅结构公开(公告)号：US06826333B2
公开(公告)日：2004-11-30
申请号：US10206144
申请日：2002-07-26
IPC分类号： G02B634
CPC分类号： B82Y20/00 , G02B6/12004 , G02B6/1221 , G02B6/1225 , G02B6/124 , G02B6/4214 , G02B6/4249 , G02B2006/12097 , G02F1/0147 , G02F1/065 , G02F2201/30
摘要： Using polymeric dielectric materials (preferably materials derived from bisbenzocyclobutene monomers) and an electron beam lithography process for patterning this material, we have developed a process for fabricating optical waveguides with complex integrated devices such as gratings. Such gratings are not limited to one-dimensional type gratings but can include 2 dimensional gratings such as curved gratings or photonic crystals. Due to the properties of BCB, this process could also be implemented using optical photolithography depending upon the waveguide dimensions desired and the grating dimensions desired. Alternatively, the optical waveguide could be patterned using optical lithography and the grating can be patterned using electron beam lithography. Gratings with much more dimensional precision can be fabricated using electron beam lithography. Gratings fabricated with precise dimensional control are required, for example, for many applications including Dense Wavelength Division Multiplexing (DWDM) for telecommunications applications.
摘要翻译： 使用聚合物电介质材料（优选衍生自双苯并环丁烯单体的材料）和用于图案化该材料的电子束光刻工艺，我们开发了一种用复合集成器件如光栅制造光波导的工艺。 这种光栅不限于一维型光栅，而是可以包括二维光栅，例如弯曲光栅或光子晶体。 由于BCB的性质，根据所需的波导尺寸和所需的光栅尺寸，也可以使用光学光刻实现该工艺。 或者，可以使用光学光刻对光波导进行图案化，并且可以使用电子束光刻来对光栅进行图案化。 可以使用电子束光刻制造具有更大尺寸精度的光栅。 需要使用精确尺寸控制制造的光栅，例如用于许多应用，包括用于电信应用的密集波分复用（DWDM）。
-
3.发明授权Optical waveguides and grating structures fabricated using polymeric dielectric compositions 失效使用聚合物电介质组合物制造的光波导和光栅结构公开(公告)号：US06985663B2
公开(公告)日：2006-01-10
申请号：US10960314
申请日：2004-10-06
IPC分类号： G20B6/10
CPC分类号： B82Y20/00 , G02B6/12004 , G02B6/1221 , G02B6/1225 , G02B6/124 , G02B6/4214 , G02B6/4249 , G02B2006/12097 , G02F1/0147 , G02F1/065 , G02F2201/30
摘要： Using polymeric dielectric materials (preferably materials derived from bisbenzocyclobutene monomers) and an electron beam lithography process for patterning this material, we have developed a process for fabricating optical waveguides with complex integrated devices such as gratings. Such gratings are not limited to one-dimensional type gratings but can include 2 dimensional gratings such as curved gratings or photonic crystals. Due to the properties of BCB, this process could also be implemented using optical photolithography depending upon the waveguide dimensions desired and the grating dimensions desired. Alternatively, the optical waveguide could be patterned using optical lithography and the grating can be patterned using electron beam lithography. In addition, the general process described below can be applied to the fabrication of complex lightwave circuits containing, for example, multiple optical waveguides, couplers/splitters, grating based filters and even more complex devices and structures.
摘要翻译： 使用聚合物电介质材料（优选衍生自双苯并环丁烯单体的材料）和用于图案化该材料的电子束光刻工艺，我们开发了一种用复合集成器件如光栅制造光波导的工艺。 这种光栅不限于一维型光栅，而是可以包括二维光栅，例如弯曲光栅或光子晶体。 由于BCB的性质，根据所需的波导尺寸和所需的光栅尺寸，也可以使用光学光刻实现该工艺。 或者，可以使用光学光刻对光波导进行图案化，并且可以使用电子束光刻来对光栅进行图案化。 此外，下面描述的一般处理可以应用于制造包含例如多个光波导，耦合器/分离器，基于光栅的滤波器以及甚至更复杂的器件和结构的复杂光波电路。
-
4.发明授权公开(公告)号：US07432039B2
公开(公告)日：2008-10-07
申请号：US10979023
申请日：2004-11-01
CPC分类号： B81C1/00063 , B81B2203/033 , B82Y10/00 , H01L21/0337 , H01L21/0338 , H01L21/76838 , Y10T428/261
摘要： A method of fabricating a pattern on a surface of a substrate includes applying at least one non-molecular lithographic technique with at least one molecular lithographic technique to simultaneously define a size and shape of at least one of the features of the pattern. The pattern includes a nanoscale gap between features, the gap having a width defined by the thickness of one or more molecular layers used in one of the molecular lithographic techniques.
摘要翻译： 在衬底的表面上制造图案的方法包括使用至少一种分子光刻技术施加至少一种非分子光刻技术，以同时限定图案的至少一个特征的尺寸和形状。 该图案包括特征之间的纳米尺度间隙，间隙具有由分子光刻技术之一中使用的一个或多个分子层的厚度限定的宽度。
-
5.发明授权Patterning compositions using E-beam lithography and structures and devices made thereby 失效使用电子束光刻及其制造的结构和器件的图案化组合物公开(公告)号：US06919164B2
公开(公告)日：2005-07-19
申请号：US10164841
申请日：2002-06-07
CPC分类号： G03F7/0757 , G03F7/0045 , G03F7/2059 , Y10S430/143
摘要： A method of patterning a layer of e-beam sensitive dielectric material, such as bisbenzocyclobutene monomers, using electron beam lithography.
摘要翻译： 使用电子束光刻法来形成电子束敏感介电材料层的方法，例如双苯并环丁烯单体。
-
6.发明授权Optical and optoelectronic packaging and integration platform with stationary and movable elements 失效光学和光电封装和集成平台与固定和可移动元件公开(公告)号：US06921215B2
公开(公告)日：2005-07-26
申请号：US10756706
申请日：2004-01-12
CPC分类号： G02B6/42 , G02B6/32 , G02B6/3652 , G02B6/3696 , G02B6/4214 , G02B6/423
摘要： The integration, packaging and assembly of optical components, optoelectronic components and submounts using features pressed into ceramic elements. The submounts may be composed of a ceramic material and contain optical and optoelectronic components. The submounts can be movable to change the optical characteristics of modules created through the integration of optical or optoelectronic components. Such modules can have functions including optical detection, optical signal generation, optical signal branching or processing, optical switching, optical multiplexing or de-multiplexing, optical modulation or optical transmission. The disclosure also provides an example, which is not meant to be limiting, of an optical module including two or more optical components and a packaging, integration and assembly platform.
摘要翻译： 光学元件的集成，封装和组装，光电子元件和底座使用特征压入陶瓷元件。 底座可以由陶瓷材料组成并且包含光学和光电子部件。 底座可以是可移动的，以改变通过集成光学或光电子部件而产生的模块的光学特性。 这样的模块可以具有光检测，光信号生成，光信号分支或处理，光切换，光复用或解复用，光调制或光传输等功能。 本公开还提供了一种不意在限制包括两个或更多个光学部件和封装，集成和组装平台的光学模块的示例。
-
7.发明授权Optical, optoelectronic and electronic packaging platform, module using the platform, and methods for producing the platform and the module 失效光学，光电子和电子封装平台，使用平台的模块，以及生产平台和模块的方法公开(公告)号：US06704488B2
公开(公告)日：2004-03-09
申请号：US09968596
申请日：2001-10-01
IPC分类号： G02B600
CPC分类号： G02B6/42 , G02B6/32 , G02B6/3652 , G02B6/3696 , G02B6/4214 , G02B6/423
摘要： A packaging platform, and method for producing the platform, for integrating, aligning and securing two or more optical, optoelectronic and/or electronic components is provided. The platform provides features for positioning the these elements in the x, y and z directions. This platform can simplify the coupling of light from an optical or optoelectronic component to another optical or optoelectronic component or simplify the electrical coupling from an electronic or optoelectronic component to another electronic or optoelectronic component. This platform can also serve as the final packaging structure, which can be sealed or unsealed, for the integrated, aligned and/or secured optical, optoelectronic and electronic components, where said structure includes any required or desired optical, electrical and/or mechanical features.
摘要翻译： 提供了一种包装平台和用于生产平台的方法，用于集成，对准和固定两个或多个光学，光电子和/或电子部件。 该平台提供了将这些元素定位在x，y和z方向的特征。 该平台可以简化来自光学或光电子部件的光与另一光学或光电子部件的耦合，或简化从电子或光电子部件到另一电子或光电子部件的电耦合。 该平台还可以用作用于集成的，对准的和/或固定的光学，光电子和电子部件的最终封装结构，其可以是密封或非密封的，其中所述结构包括任何所需或期望的光学，电和/或机械特征 。
-
-
-
-
-
-
搜索结果
7 条记录 (耗时 0.026 秒)
