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    Touch panel and method of manufacturing the same
    2.
    发明授权
    Touch panel and method of manufacturing the same 有权
    触摸面板及制造方法相同

    公开(公告)号：US08823677B2

    公开(公告)日：2014-09-02

    申请号：US13087358

    申请日：2011-04-14

    申请人： Jen-Shiun Huang ,  Tsung-Yi Lin ,  Ming-Hui Chiang ,  Wan-Tien Chen ,  Wen-Jen Lee

    发明人： Jen-Shiun Huang ,  Tsung-Yi Lin ,  Ming-Hui Chiang ,  Wan-Tien Chen ,  Wen-Jen Lee

    IPC分类号： G06F3/045

    CPC分类号： G06F3/045 ,  G06F2203/04103

    摘要： A touch panel and a method of manufacturing the same are disclosed in this invention. The touch panel is with a central induction region and a peripheral region, and at least includes an upper electrode portion having an upper substrate located in the central induction region and the peripheral region, a first signal induction layer located in the central induction region and the peripheral region, and a first circuit layer located in the peripheral region only. The first signal induction layer covers the upper substrate in the central induction region. The first circuit layer is sandwiched between the upper substrate and the first signal induction layer, and electrically connected the first signal induction layer.

    摘要翻译： 触摸面板及其制造方法在本发明中公开。 触摸面板具有中心感应区域和周边区域，并且至少包括具有位于中心感应区域和外围区域中的上基板的上电极部分，位于中心感应区域中的第一信号感应层和 周边区域和仅位于外围区域中的第一电路层。 第一信号感应层覆盖中央感应区域中的上基板。 第一电路层夹在上基板和第一信号感应层之间，电连接第一信号感应层。

    HEAT DISSIPATION UNIT FOR LED BULB
    3.
    发明申请
    HEAT DISSIPATION UNIT FOR LED BULB 审中-公开
    LED散热器散热装置

    公开(公告)号：US20120268937A1

    公开(公告)日：2012-10-25

    申请号：US13090515

    申请日：2011-04-20

    申请人： Wen-Jen Lee

    发明人： Wen-Jen Lee

    IPC分类号： F21V29/00 ,  F21S4/00

    CPC分类号： F21V29/89 ,  F21K9/232 ,  F21K9/238 ,  F21V3/00 ,  F21V23/006 ,  F21V29/713 ,  F21V29/773 ,  F21V29/83 ,  F21Y2105/10 ,  F21Y2115/10

    摘要： A heat dissipation unit for LED bulb includes a base seat formed with a receiving cavity and a base section, a first heat dissipation member having multiple heat dissipation sections and a perforation, a second heat dissipation member and a retainer member. The heat dissipation sections of the first heat dissipation section are arranged around the perforation. Each heat dissipation section has a first side attached to the base section and a second side. A first through hole is formed in the receiving cavity in communication with the receiving cavity and the perforation. The second heat dissipation member is formed with a second through hole and a spreading section attached to the second side of the heat dissipation section. The retainer member is fitted in the first and second through holes and the perforation to integrally connect the base seat with the first and second heat dissipation members.

    摘要翻译： 用于LED灯泡的散热单元包括形成有容纳腔和基部的基座，具有多个散热部和穿孔的第一散热构件，第二散热构件和保持构件。 第一散热部的散热部布置在穿孔周围。 每个散热部分具有附接到基部的第一侧和第二侧。 在接收腔中形成有与接收腔和穿孔连通的第一通孔。 第二散热构件形成有第二通孔和安装在散热部的第二侧的扩展部。 保持构件安装在第一和第二通孔和穿孔中，以将基座与第一和第二散热构件一体地连接。

    High intensity LED
    4.
    发明授权
    High intensity LED 失效
    高强度LED

    公开(公告)号：US07067848B1

    公开(公告)日：2006-06-27

    申请号：US11146024

    申请日：2005-06-07

    申请人： Wen-Jen Lee ,  Jyun-Ze Lin

    发明人： Wen-Jen Lee ,  Jyun-Ze Lin

    IPC分类号： H01L33/00

    CPC分类号： H01L33/60 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A High Intensity LED is disclosed to include a metal base, which has a through hole extending between the top and bottom surfaces thereof and a first electrode formed integral with and downwardly extending from the bottom surface, a second electrode inserted through the through hole and isolated from the metal base with an electrically insulative sleeve, an LED chip mounted on the top surface of the metal base and electrically contacting with the top surface of the metal base and the LED chip electrically connected to the top end of the second electrode with at least one gold wire, and an electrically insulative packaging shell surrounding the metal base and the LED chip excluding the first electrode and the bottom end of the second electrode. Red, green and/or blue color LED chips may be in contact with the top surface of the metal base to produce High Intensity light.

    摘要翻译： 公开了一种高强度LED，其包括金属基底，其具有在其顶表面和底表面之间延伸的通孔和与底表面一体形成并向下延伸的第一电极，穿过通孔插入的第二电极和隔离的 从具有电绝缘套筒的金属基底，安装在金属基座的顶表面上的LED芯片与金属基底的顶表面和与第二电极的顶端电连接的LED芯片电接触至少 一个金线，以及围绕金属基底和除了第二电极的第一电极和底端之外的LED芯片的电绝缘包装壳。 红色，绿色和/或蓝色LED芯片可以与金属基底的顶表面接触以产生高强度光。

    HEAT-DISSIPATING STRUCTURE OF LED BULB
    5.
    发明申请
    HEAT-DISSIPATING STRUCTURE OF LED BULB 审中-公开
    LED灯泡散热结构

    公开(公告)号：US20120013237A1

    公开(公告)日：2012-01-19

    申请号：US12836080

    申请日：2010-07-14

    申请人： Wen-Jen Lee

    发明人： Wen-Jen Lee

    IPC分类号： H01J61/52

    CPC分类号： F21V29/83 ,  F21K9/23 ,  F21K9/232 ,  F21V3/00 ,  F21V19/0055 ,  F21V29/713 ,  F21V29/767 ,  F21Y2115/10

    摘要： A heat-dissipating structure of a LED bulb includes: a base, a heat-absorbing member, a heat-dissipating member, an assembling portion and a heat-conducting member. The base has a trough and a first hole in communication with the trough. The heat-absorbing member is provided in the trough and having a second hole in communication with the first hole. The heat-dissipating member has a third hole opposite to the first hole and a first heat-diffusing portion extending outwardly from the third hole. The first heat-diffusing portion and the base define a first heat-dissipating space there between. The assembling portion has a fourth hole and a second heat-diffusing portion extending outwardly from the fourth hole. The assembling portion and the heat-dissipating member define a second heat-dissipating space there between. A connecting end protrudes from an outer end of the second heat-diffusing portion away from the base. The heat-conducting member is disposed through the first, second, third and fourth holes to be combined with the base, the heat-absorbing member, the heat-dissipating member and the assembling portion, thereby obtaining the heat-dissipating structure having an excellent heat-dissipating effect.

    摘要翻译： LED灯泡的散热构造包括：基座，吸热构件，散热构件，组装部和导热构件。 基座具有槽和与槽连通的第一孔。 吸热构件设置在槽中并且具有与第一孔连通的第二孔。 散热构件具有与第一孔相对的第三孔和从第三孔向外延伸的第一热扩散部。 第一热扩散部分和基部在其间限定第一散热空间。 组装部分具有从第四孔向外延伸的第四孔和第二热扩散部。 组装部分和散热构件在其间限定第二散热空间。 连接端从第二热扩散部分的外端远离基部突出。 导热构件通过第一，第二，第三和第四孔设置成与基座，吸热构件，散热构件和组装部分组合，从而获得具有优异的散热结构 散热效果好。