公开(公告)号：US20180248092A1

公开(公告)日：2018-08-30

申请号：US15900685

申请日：2018-02-20

Applicant: Jen-You Liang

Inventor： Jen-You Liang

IPC: H01L33/62 ,  H01L33/60 ,  H05K1/03 ,  H05K1/18

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/60 ,  H05K1/03 ,  H05K1/05 ,  H05K1/181 ,  H05K3/0052 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2201/10227 ,  H05K2201/10522 ,  H05K2201/1053

Abstract: A light sensor lead frame substrate may comprise a plurality of lead frame substrates formed on a metal substrate through a series of processing including chemical etching, plasma etching and stamping. The lead frame substrates are connected through a plurality of connecting sections, and each of the lead frame substrates is connected to the metal substrate through the connecting section. Each of the connecting sections has two pre-cut sections respectively formed at two ends of the connecting section. After molding, the lead frame substrates are configured to pass through a series of processing including electroplating, injection and desmear to enable each of the lead frame substrates to have a first insulating layer, a reflector cup and a second insulating layer, and with the pre-cut sections, the connecting sections are adapted to be easily washed down by a punch in the punching process.